Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

1563results about How to "Easy to draw" patented technology

System and method for automated part-number mapping

Automated mapping of part numbers associated with parts in a bill of materials (BOM) submitted by a BOM originator to internal part numbers assigned to those parts by a BOM receiver is performed by one or more computers connected to one or more networks through one or more network interfaces. A first receive component receives one or more data sets containing historical data on bills of materials received in the past by the BOM receiver. A second receive component receives one or more data sets containing known mappings between internal part numbers used by the BOM receiver, and part numbers used by various BOM originators. A third receive component receives one or more data sets containing information of various parameters and their values describing the parts to which the BOM receiver has assigned internal part numbers. A fourth receive component receives one or more methods of automatically learning models for predicting internal part numbers from the above mentioned historical BOM data, mapping data and part parametric data. A learning component learns the models from the data. A fifth receive component receives a BOM from a requesting process. The BOM has one or more parts with a missing internal part number. A mapping component applies the learned models to the received BOM to automatically determine internal part numbers for all unmapped BOM originator part numbers. A release process assigns internal part numbers to all unmapped parts in the BOM and releases the BOM to the requesting process.
Owner:IBM CORP

Liquid-metal printed circuit board and preparation method thereof

ActiveCN102802346AEasing production constraintsEase constraintsConductive pattern formationCircuit susbtrate materialsFlexible circuitsLiquid metal
The invention relates to a liquid-metal printed circuit board, and in particular relates to a flexible printed circuit board and a preparation method thereof. The liquid-metal printed circuit board comprises a substrate, metal electrodes printed on the substrate and an anti-oxidation insulated membranous layer which is used as a cover plate. The preparation method comprises the following steps: a), providing the substrate; b), respectively drawing the first electrode and the second electrode on the surface of the substrate by using a pen type device filled with liquid-metal ink, according to a preset shape to form the metal electrodes, wherein the first electrode and the second electrode are connected through a lead wire or an electronic component; and c), covering the electrodes with the insulated membranous layer to finish the preparation of the circuit board. The preparation method for constructing various circuit boards, especially the flexible circuit boards, has the advantages that the process is simple, the environment is friendly, the operation can be performed under normal temperature, the production cost of the circuit board can be effectively reduced, the production efficiency can be greatly improved, and very high application value is provided.
Owner:TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI

Passive finding equipment and method of network topology

The invention discloses passive finding equipment and a passive finding method based on sniffing and fingerprint technology of network topology. The equipment comprises sniffing devices and a management device, wherein a plurality of sniffing devices are arranged in a network to be found, are directly connected with a host computer of each subnet host exchange, acquire all network element information and routing information from a subnet data packet and transmit the element information and the routing information serving as topology finding information to the management device; and the management device is arranged on any host computer which is not provided with any sniffing device, and is used for managing, summarizing and analyzing the sniffing devices and information acquired by the sniffing devices and drawing and displaying a network topology diagram of the entire network to be found. In the method, topology is found in a passive mode, so that additional data load on the network in a finding period is greatly lowered, and an acquired network data packet is a practical communication action and is correct and reliable. A network topology finding process can be controlled flexibly; through manual setting of the management device, start and stop of all sniffing devices can be controlled conveniently and flexibly; and the equipment and the method have good popularization prospects.
Owner:BEIJING UNIV OF POSTS & TELECOMM

Power semiconductor device internal contact thermal resistance measurement method and measurement clamp

The invention provides a power semiconductor device internal contact thermal resistance measurement method and measurement clamp. The measurement method comprises the steps that a relation curve of device electrical parameters and junction temperature is drawn; a transient thermal impedance curve when liquid metal is coated between the surface of a device shell and a heat radiator is drawn; numeric calculation is performed on the transient thermal impedance curve so that the integral structure function and the differential structure function of the device are obtained; and a contact thermal resistance value is solved through reference to the integral structure function and the differential structure function. The measurement clamp is composed of three substrates arranged in a horizontal direction and two columns arranged in a vertical direction. An insulated plate and a heat radiation substrate are longitudinally and symmetrically arranged between the upper substrate and the intermediate substrate. A pressure uniform distribution device, a sensor, a pressure maintaining plate and a pressure applying device are installed between the intermediate substrate and the lower substrate in turn. According to the measurement method, measurement error caused by a thermocouple can be eliminated, the measurement result is real and reliable and the measurement method is simple and efficient.
Owner:GLOBAL ENERGY INTERCONNECTION RES INST CO LTD +2

Aluminium alloy conductor for automotive wires and manufacturing method thereof

The invention discloses an aluminium alloy conductor for automotive wires, which has the advantages of high heat resistance, conductivity, tensile strength, extensibility and fatigue resistance, and a manufacturing method thereof. The alloy contains 0.3 to 0.8 weight percent of iron, 0.05 to 0.20 percent of silicon, 0.1 to 0.5 weight percent of magnesium, 0.1 to 0.3 weight percent of copper, 0.001 to 0.04 weight percent of boron, 0.001 to 0.04 weight percent of zirconium, 0.001 to 0.04 weight percent of yttrium, and the balance of aluminium and inevitable impurities, wherein one or two elements, except the aluminium and the inevitable impurities, account for 0.1 to 2.0 weight percent. The manufacturing method comprises the following steps of: adding the iron, silicon, magnesium, copper, boron, zirconium, yttrium and aluminium into a smelting furnace; smelting, and casting and rolling; performing intermediate annealing treatment; drawing into aluminium alloy filaments with the diameterof 0.5mm; and stranding into wire cores, and performing annealing treatment. The conductor prepared by the method has the tensile strength of 210MPa and above, the elongation at break of over 10 percent, the conductivity of over 58 percent, and excellent heat resistance and flexibility.
Owner:安徽中青欣意铝合金电缆有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products