Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Liquid-metal printed circuit board and preparation method thereof

A printed circuit board and liquid metal technology, applied in printed circuit components, circuit substrate materials, metal pattern materials, etc., to ease constraints, facilitate rapid system construction and testing, and reduce manufacturing costs.

Active Publication Date: 2012-11-28
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
View PDF4 Cites 51 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method has never been reported in the past circuit board production at home and abroad.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Liquid-metal printed circuit board and preparation method thereof
  • Liquid-metal printed circuit board and preparation method thereof
  • Liquid-metal printed circuit board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] figure 1 It is a schematic structural diagram of a printed circuit board according to Embodiment 1 of the present invention.

[0058] Choose 200mm×200mm glass fiber reinforced epoxy resin substrate 1, and polish it with 600 mesh water sandpaper;

[0059] Operated by hand or machine control at room temperature figure 2 As shown in the pen-type device 5, turn on the switch 7 to energize and heat the liquid metal ink 6, so as to ensure that the liquid metal ink 6 is in a liquid state with better flow, and the first liquid metal ink (liquid gallium) is formed in the form of points, lines or surfaces. Formally coated on the upper surface of the substrate 1 to form a first room temperature liquid metal electrode 21 in the shape of a point, a line or a plane;

[0060] Likewise, at room temperature by hand or machine control figure 2 As shown in the pen-type device 5, turn on the switch 7 to energize and heat the liquid metal ink 6, so as to ensure that the liquid metal in...

Embodiment 2

[0063] image 3 It is a schematic structural diagram of a printed circuit board according to Embodiment 2 of the present invention. Different from Embodiment 1, the two liquid metal electrodes do not need to be connected by wires or electronic components 4, but directly connect two liquid metals with different components. In this way, circuits made of different liquid metal inks are connected. line to achieve a specific function.

[0064] Choose 200mm×200mm glass fiber reinforced epoxy resin substrate 1, and polish it with 600 mesh water sandpaper;

[0065] Operated by hand or machine control at room temperature figure 2 As shown in the pen-type device 5, the first liquid metal ink (liquid gallium indium tin alloy) is coated on the upper surface of the substrate 1 with a line, and at the same time, a different liquid alloy material (liquid gallium indium tin alloy) is used on the substrate 1 Another line is coated on the upper surface, and one end of the two lines intersec...

Embodiment 3

[0068] Figure 4 It is a schematic structural diagram of a printed circuit board according to Embodiment 3 of the present invention. The difference from Example 1 and Example 2 is that the liquid metal ink can be applied to different surfaces of the substrate and combined with each other, instead of simply being applied on the same surface, so that more complex circuit connections can be realized, thereby completing More specific functions.

[0069] Select 200mm×200mm cotton base 1;

[0070] Operated by hand or machine control at room temperature figure 2As shown in the pen-shaped device 5, the first liquid metal ink (liquid gallium mixed with 0.01wt% to 80wt% nano-semiconductor material particles) is coated on the lower surface of the substrate 1 in the form of dots, lines or planes to form dots. , the first room temperature liquid metal electrode 21 in the shape of a line or a plane; the semiconductor material particles are germanium sulfide particles, germanium selenide...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a liquid-metal printed circuit board, and in particular relates to a flexible printed circuit board and a preparation method thereof. The liquid-metal printed circuit board comprises a substrate, metal electrodes printed on the substrate and an anti-oxidation insulated membranous layer which is used as a cover plate. The preparation method comprises the following steps: a), providing the substrate; b), respectively drawing the first electrode and the second electrode on the surface of the substrate by using a pen type device filled with liquid-metal ink, according to a preset shape to form the metal electrodes, wherein the first electrode and the second electrode are connected through a lead wire or an electronic component; and c), covering the electrodes with the insulated membranous layer to finish the preparation of the circuit board. The preparation method for constructing various circuit boards, especially the flexible circuit boards, has the advantages that the process is simple, the environment is friendly, the operation can be performed under normal temperature, the production cost of the circuit board can be effectively reduced, the production efficiency can be greatly improved, and very high application value is provided.

Description

technical field [0001] The invention belongs to the field of printed circuit boards and their preparation, in particular to a liquid metal printed circuit board and a manufacturing method thereof, that is, to directly coat room temperature liquid metal on the surface of a non-metallic material substrate to form a circuit, thereby producing large-scale and low-cost liquid metal printed circuit boards. Circuit boards, especially flexible liquid metal printed circuit boards. Background technique [0002] Since conductive plastics were discovered and won the Nobel Prize in 2000, plastic-metal composites and composites of other non-metallic flexible materials and metals have gradually attracted people's attention. Various non-metallic materials that have been regarded as insulators are increasingly endowed with conductive properties. Recently, with the need for the development of non-metallic conductive products in some special applications, various new conductive non-metallic m...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K1/09H05K3/12
Inventor 刘静李海燕
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com