The invention discloses a double-medium
cascade liquid cooling heat dissipation
system, and relates to the technical field of
computer hardware heat dissipation. Comprising a
cold plate assembly, a circulating pipeline and a driving unit, the
cold plate assembly comprises a lower-layer
cold plate and an upper-layer cold plate, the lower-layer cold plate comprises a first
liquid alloy cold plate and a second
liquid alloy cold plate which are located in the area, where the GPU module is located, of the mainboard
chip, and the upper-layer cold plate comprises a large
liquid alloy cold plate located in the area, where the CPU module and the HBM module are located, of the mainboard
chip. A first water-based cold plate and a second water-based cold plate are attached to the top of the first liquid
alloy cold plate and the top of the second liquid
alloy cold plate respectively, and a large water-based cold plate is attached to the bottom of the large liquid
alloy cold plate. According to the invention,
heat balance transfer between the
high heat flux area of the GPU module and the low
power consumption area of the CPU module and the HBM module can be realized, heat at the GPU module is partially transferred to a large-area cold plate of the CPU module and HBM module area, the heat dissipation pressure of the GPU module area is obviously reduced, and the overall heat dissipation efficiency is improved.