Liquid alloy, preparing method of liquid alloy and application of liquid alloy

Abstract

The invention relates to liquid alloy, a preparing method of the liquid alloy and application of the liquid alloy. The liquid alloy comprises the components, by weight part, of 1 part to 90 parts of gallium (Ga), 1 part to 75 parts of indium (In) and 1 part to 40 parts of tin (Sn). The liquid alloy has the superconductivity property in the critical temperature and belongs to nonideal type II superconductors. In addition, the liquid alloy has the excellent characteristics of being convenient to use, wide in application scope, low in cost, free of poison, good in mobility and excellent in electrical conductivity and heat conduction. The preparing method of the liquid alloy also is simple and high in efficiency, achieves environment friendliness and is economical. The liquid alloy can further by widely applied to electric connection of electronic components, electronic circuit boards and self-repairing conductors.

Description

technical field

[0001] The invention relates to the field of metal materials, in particular to a liquid alloy and its preparation method and application. Background technique

[0002] Low-melting-point alloys refer to fusible alloys with a melting point lower than 232° C. (the melting point of Sn), usually composed of low-melting-point metal elements such as bismuth (Bi). Low-melting point alloys are usually widely used as solders, as well as heat-sensitive components such as fuses and fuses in electrical appliances, steam, fire protection, fire alarms and other devices. They are a class of new materials with great development potential.

[0003] Liquid alloy is a low-melting point alloy, which is liquid at room temperature and can flow freely like water, but it has the characteristics of metal. The atomic structure of the liquid alloy is also different from that of ordinary solid metals, and is more similar to an amorphous liquid. Its thermal conductivity and specific heat...

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