Thermal interface material for packaging and radiating chip and preparation method thereof

Abstract

The invention discloses a thermal interface material for packaging and radiating a chip and a preparation method thereof. The thermal interface material comprises a carbon nano tube array on a substrate, and is characterized in that the thermal interface material contains liquid metal which is freely diffused and uniformly distributed in gaps of the carbon nano tube array. The invention uses the carbon nano tube having a high coefficient of heat conductivity to ensure that the thermal interface has a higher heat conductive property, uses the liquid alloy to promote the contact capability between the carbon nano tube and the heat sink and between the carbon nano tube and the chip so as to decrease the thermal resistance of the thermal interface and meet the radiating demand of high-performance chip. The preparation method thereof comprises the steps of: providing a carbon nano tube array vertically formed on the substrate, depositing a metal layer which is easily dissolved in liquid metal on the carbon nano tube, boosting to fully soak the carbon nano tube when the liquid metal is contacted with the carbon nano tube and filling the gaps of the carbon nano tube array.

Description

technical field [0001] The invention relates to a thermal interface material used for high-performance chip packaging and heat dissipation, in particular to a thermal interface material formed with a carbon nanotube array as a basic component and a preparation method thereof. Background technique [0002] According to the famous "Moore's Law" calculation: the number of transistors on a chip doubles every 18 months, then by 2010, the number of transistors on a chip will exceed 1 billion. High integration is beneficial to the upgrade of computer performance, but the problems of chip energy consumption and heat dissipation are also highlighted. In fact, in addition to computer chips, for a large number of power electronic devices, optoelectronic devices, and micro / nano electromechanical systems that have developed rapidly in recent years, there are similar extensive and urgent heat dissipation and cooling needs, and even higher requirements in some cases. . For example, the h...

AI Technical Summary

Problems solved by technology

[0006] In order to meet the needs of high-performance chip cooling technology and overcome the shortcomings of high thermal resistance and poor contact of existing thermal interface materials, the present invention provides a new type of thermal interface material for chip packaging and heat dissipation and its preparation method, which can be used in high-power chips Establish reliable thermal contact with the heat sink unit and provide sufficient thermal conductivity to improve the heat dissipation capability and reliable stability of high-power chips

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