Gallium-based liquid alloy material and preparation method thereof

A liquid alloy and liquid metal technology, applied in the field of gallium-based liquid alloy materials and their preparation, can solve the problems of reducing the heat dissipation capacity of liquid metal radiators, and achieve the effect of efficient heat dissipation

Active Publication Date: 2014-04-23
NINGBO SYRNMA METAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

When electronic equipment works at a lower temperature, the liquid metal in the radiator may be in a c...

Method used

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  • Gallium-based liquid alloy material and preparation method thereof

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Embodiment 1

[0014] A gallium-based alloy material with the following formula (mass percentage): 70% gallium, 15% indium, 10% tin, 2% bismuth, and 3% zinc. Put the metal gallium in a closed flask according to the proportion and heat it to 50℃ in a water bath. At a constant temperature, the gallium in the flask is in a liquid state; then put the indium, tin, bismuth and zinc into the liquid state In a gallium metal glassware; under the protection of argon, stir with a glass rod until indium, tin, bismuth and zinc are completely dissolved into a liquid, and mixed uniformly, and kept at 50°C for 10 minutes to obtain a gallium-based alloy. Gallium-based alloy materials have a melting point of about 1°C.

Embodiment 2

[0016] A gallium-based alloy material with the following formula (mass percentage): 85% gallium, 10% indium, 2% tin, 2% bismuth, and 1% zinc. Put the metal gallium in a closed flask according to the proportion and heat it to 50℃ in a water bath. At a constant temperature, the gallium in the flask is in a liquid state; then put the indium, tin, bismuth and zinc into the liquid state In a gallium metal glassware; under the protection of argon, stir with a glass rod until indium, tin, bismuth and zinc are completely dissolved into a liquid, and mixed uniformly, and kept at 50°C for 10 minutes to obtain a gallium-based alloy. Gallium-based alloy materials have a melting point of about 1°C.

Embodiment 3

[0018] A gallium-based alloy material with the following formula (mass percentage): 80% gallium, 10% indium, 5% tin, 3% bismuth, 2% zinc. Put the metal gallium in a closed flask according to the proportion and heat it to 50℃ in a water bath. At a constant temperature, the gallium in the flask is in a liquid state; then put the indium, tin, bismuth and zinc into the liquid state In a gallium metal glassware; under the protection of argon, stir with a glass rod until indium, tin, bismuth and zinc are completely dissolved into a liquid, and mixed uniformly, and kept at 50°C for 10 minutes to obtain a gallium-based alloy. Gallium-based alloy materials have a melting point of about 1°C.

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Abstract

The invention discloses a gallium-based liquid alloy material and a preparation method thereof, the gallium-based liquid alloy material is composed of the following components: by mass, 70-85% of gallium, 10-15% of indium, 1-12% of tin, 2-6% of bismuth and 1-6% of zinc. In accordance with the ratio, the metal gallium is placed in a sealed flask, and then is placed in a water bath pot for heating to 50 DEG C, in a constant temperature state, the gallium in the flask is in a liquid state; then the indium, the tin, the bismuth and the zinc are put into the glass ware holding the liquid metal gallium; under argon protection, the indium, the tin, the bismuth and the zinc are stirred with a glass rod to completely melt into a liquid and evenly mix, and then the gallium-based liquid alloy material is obtained by thermal insulation for 10 minutes at 50 DEG C. The gallium-based liquid alloy material melting point is as low as about 1 DEG C. When in practical use, the radiator pipe cold end temperature can be as low as about-2 DEG C.

Description

Technical field [0001] The invention relates to a gallium-based alloy material, in particular to a gallium-based liquid alloy material and a preparation method thereof. Background technique [0002] With the rapid development of science and technology and the increasing improvement of people's living standards, the heat dissipation problem of various electronic components has become increasingly obvious. With the improvement of the integration of high-performance computers and the rapid growth of users of high-end electronic products, the efficiency of heat dissipation has become a key bottleneck restricting the application and improvement of high-tech products. Liquid metal is a new alloy medium that presents a fluid state at working temperature. It is at the top of the heat dissipation pyramid due to its high heat transfer coefficient (~80W / m?K). When traditional water-cooling and air-cooling heat dissipation technologies are reaching their limits, liquid metal heat dissip...

Claims

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Application Information

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IPC IPC(8): C22C28/00C22C1/00
Inventor 曹帅刘亚军曹贺全
Owner NINGBO SYRNMA METAL MATERIALS CO LTD
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