The utility model relates to an ink
coating mechanism for edge covering of a
silicon wafer battery piece, which comprises a bottom plate, supports are arranged on the bottom plate at intervals, a rotating shaft is arranged between the supports on the two sides in a rotating mode, and an ink roller is sleeved on the rotating shaft. A vertical plate with an inverted L-shaped structure is mounted on each single-side support, and a
micrometer is mounted on each vertical plate; tool aprons are further arranged between the
micrometer and the rotating shaft, a scraper is jointly installed on the tool aprons on the two sides, and the scraper is located above the
printing ink roller at intervals; the tool aprons on the single sides are installed on the vertical plate in a floating mode. By rotating the
micrometer, adjusting the actual relative position of the tool apron relative to the vertical plate and adjusting the spacing distance of the scraper on the tool apron relative to the
printing ink roller, the thickness of an ink layer on the
printing ink roller is adjusted through the scraper so as to meet the edge covering requirements of different printing ink thicknesses on a
silicon wafer battery piece, operation is convenient and rapid, and the working efficiency is improved. And the printing ink thickness precision and uniformity can be effectively adjusted and maintained, and the practicability is good.