The invention relates to a
chip top cover type heat dissipation device based on a
phase change heat transfer mechanism, which comprises a top cover, a jet plate, a
phase change bottom plate and a core carrier plate which are sequentially stacked from top to bottom and are in sealed connection, a
chip is mounted on the core carrier plate, the bottom of the
phase change bottom plate is attached to the surface of the
chip, the interior of the phase change bottom plate is hollow, and a first phase change cavity is formed in the interior of the phase change bottom plate; a second phase change cavity is defined between the
jet flow plate and the phase change bottom plate, the top cover is provided with a top cover groove used for containing the
jet flow plate, the phase change bottom plate and the chip, and the top cover is provided with a first connector and a second connector which are used for installing the connector so that inflow and outflow of the cooling working medium can be achieved. Compared with the prior art, the
integrated design of cooling and heat
diffusion functions is realized in a limited space, the overall
heat resistance between a chip and a heat dissipation interface is effectively reduced, the working medium circulation and heat
diffusion process can be accelerated, the heat dissipation efficiency and temperature uniformity of a chip area are remarkably improved, and the heat dissipation efficiency of the chip area is improved. And the compact and efficient heat dissipation requirements of the high-heat-flux chip are met.