Method for manufacturing characters of printed circuit board

A technology for printed circuit boards and manufacturing methods, which is applied in the directions of printed circuit components, printed circuit secondary processing, transfer printing, etc., and can solve problems such as difficulty in controlling the width of characters, insufficient production alignment accuracy, and easy misalignment of characters , to achieve the effects of reducing character deviation, improving the production capacity of the minimum line width, and improving the alignment accuracy

Inactive Publication Date: 2015-12-30
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is that in the prior art, the alignment accuracy of printed circuit board characters is not enough, the character

Method used

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Embodiment

[0027] The present embodiment provides a kind of preparation method of printed circuit board character, and it comprises the following steps:

[0028] S1, the previous process, use chemical cleaning and water washing to remove the oxide layer on the copper surface of the printed circuit board, increase the roughness of the copper surface, so as to improve the bonding force between the solder resist coating and the copper surface and enhance the uniform color of the coating To make a solder resist layer on the surface of the printed circuit board by using the conventional solder resist process, specifically: grind the plate, roughen the copper surface, make a screen printing screen according to the requirements, and carry out the whole board screen printing ink, and evenly coat the solder resist ink On the surface of the printed circuit board, then pre-baked at a low temperature of 70-75 ° C for 40-45 minutes, then carried out UV exposure and development to wash away the solder ...

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Abstract

The invention discloses a method for manufacturing characters of a printed circuit board. The method includes the following steps that S1, in the pre-process, a solder mask of the printed circuit board is manufactured; S2, solder resist ink with the same color as the needed characters is selected, and the viscosity of the solder resist ink is adjusted to an appropriate value; S3, a screen printing plate is prepared, and whole-plate screen printing is performed; S4, pre-baking is performed; S5, exposure and development are performed to obtain the characters of the printed circuit board; S6, after-baking is performed. The solder resist technological process is adopted for replacing a traditional character manufacturing process to manufacture the characters; the alignment accuracy of a solder resist exposure machine can reach the tolerance range of +/-20 micrometers which is far accurate than the tolerance range of +/-100 micrometers of human eye alignment, so that the alignment accuracy of the characters is greatly improved, and the undesirable phenomenon that the characters deviate or are printed on a bonding pad or become fuzzy easily is effectively reduced.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a method for making printed circuit board characters. Background technique [0002] A printed circuit board, also known as a printed circuit board (PCB for short), is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. A printed circuit board usually includes more than one circuit layer and a substrate layer for insulation between circuit layers. The printed circuit board is also covered with a solder mask on the outer circuit layer. The solder mask is The protective layer of the outer layer of insulation plays the role of protecting the circuit and preventing the tin on the circuit when soldering parts. In order to facilitate the identification of the positions of the components to be soldered on the printed circuit board, a character layer is printed outside the sol...

Claims

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Application Information

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IPC IPC(8): H05K3/28
CPCH05K1/0266H05K3/28H05K2203/0531H05K2203/17
Inventor 王自杰朱拓
Owner SHENZHEN SUNTAK MULTILAYER PCB
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