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4results about How to "Guaranteed normal production" patented technology

Sterilization method and application of sporoderm-broken ganoderma lucidum spore powder

The invention provides a sterilization method and application of sporoderm-broken ganoderma lucidum spore powder, and belongs to the technical field of health food and medicine processing. The sterilization method comprises the following steps: pretreating wall-broken ganoderma lucidum spore powder through drying and low-temperature ultrasound; after sealing and packaging, carrying out two-section type hot-pressing sterilization treatment; and after sterilization, supercritical CO2 treatment is adopted for post-treatment. According to the invention, low-temperature vacuum drying is matched with low-temperature ultrasonic treatment to realize moisture control and uniform distribution; after sealed packaging, two-section gradient hot-pressing sterilization is adopted, and sterilization thoroughness and thermosensitive component protection are both considered; and finally, residual microorganisms are complementarily killed through supercritical CO2 aftertreatment, oxidized grease is dissolved and removed to reduce the acid value and the peroxide value, meanwhile, oxygen is replaced to delay subsequent oxidation, and no solvent is left. The method is simple and convenient to operate, feasible in industrialization and suitable for processing and production of high-quality health-care foods and medicines.
Owner:KAIPING JIANZHIYUAN HEALTH FOOD CO LTD

Prefabricated assembly type steel bar truss floor support plate welding construction device and use method

The application discloses a prefabricated assembly type steel bar truss floor support plate welding construction device and a use method thereof. The device comprises mounting plates, the two mounting plates are symmetrically arranged in parallel, and a plurality of guide plate assemblies are arranged in the middle portions of the mounting plates, the guide plate assemblies are used for transmitting the floor support plate, frame plates are fixedly connected to two side frames, the frame plates are inverted U-shaped, a plurality of adjusting assemblies are arranged below top walls of the frame plates, the adjusting assemblies are correspondingly arranged with the guide plate assemblies, clamping assemblies are symmetrically arranged on both sides of the adjusting assemblies, the clamping assemblies are used for transmitting the truss, and the clamping assemblies comprise control plates, driving machines, rotating columns, mounting belts, limiting blocks, clamping blocks and magnetic blocks, and the two control plates are fixedly connected on both sides of the adjusting assemblies in parallel. The device can effectively limit the truss, can guarantee the movement between the truss and the steel plate, and improves the welding processing efficiency of the prefabricated assembly type steel bar truss floor support plate.
Owner:CHINA MCC17 GRP CO LTD

Method for manufacturing a semiconductor device and semiconductor device

The application provides a semiconductor device manufacturing method and a semiconductor device. The method comprises the following steps: firstly, providing a substrate comprising a substrate, a bottom electrode layer, a storage material layer, a first dielectric layer and a top electrode layer, wherein the substrate, the bottom electrode layer, the storage material layer and the first dielectric layer are sequentially stacked, the first dielectric layer comprises a first opening, the first opening exposes part of the storage material layer, and the top electrode layer is located in the first opening; then, removing part of the top electrode layer along a first direction, and the remaining top electrode layer forms a plurality of spaced-apart preliminary top electrodes; then, removing part of the preliminary top electrode along a second direction, so that each preliminary top electrode forms a plurality of spaced-apart top electrodes, and the second direction is perpendicular to the first direction; finally, taking the top electrode as a mask to etch the storage material layer, so that part of the bottom electrode layer is exposed. By changing the removal area, the manufacturing of small top electrodes is realized, and the size of the semiconductor device meets the development requirements.
Owner:CETHIK GRP

High-viscosity modified emulsified asphalt, preparation method and application thereof

PendingCN122168040AIncrease dynamic viscosityReduce high temperature viscosityIn situ pavingsBuilding insulationsPolymer scienceBitumen emulsion
The application discloses high-stickiness modified emulsified asphalt as well as a preparation method and application thereof. The high-stickiness modified emulsified asphalt comprises high-stickiness modified asphalt and a soap solution of the emulsified high-stickiness modified asphalt. The high-stickiness modified asphalt comprises, in terms of mass fractions, 35.0-45.0 parts of base asphalt, 5.0-6.0 parts of SEBS, 5.0-6.0 parts of SBR, 1.0-2.0 parts of maleic anhydride grafted wax, 1.5-2.0 parts of rubber oil and 0.1-0.2 parts of sulfur. The soap solution comprises, in terms of mass fractions, 1.0-1.5 parts of an emulsifier, 1.5-2.5 parts of phosphoric acid and 35.0-45.0 parts of water. The high-stickiness modified emulsified asphalt is prepared by optimizing raw materials and a formula, reduces the high-temperature viscosity of high-stickiness asphalt, solves the emulsification difficulty, and has corresponding improvement in normal-temperature performance and storage stability of the asphalt, thereby improving the performance of the high-stickiness modified emulsified asphalt and products.
Owner:ZHEJIANG JIAOGONG HIGHWAY MANTAINANCE +1