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A method of fabricating a ductile circuit

A production method and ductility technology, which is applied in the direction of printed circuit manufacturing, printed circuit, printed circuit assembly of electric components, etc., can solve the problems of efficiency limitation, processing efficiency defect, integration and integration of processing technology without making ductile circuit, etc., to achieve High efficiency and automatic effect

Active Publication Date: 2019-04-12
HUAZHONG UNIV OF SCI & TECH
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AI Technical Summary

Problems solved by technology

[0006] Generally speaking, these methods of making flexible / ductile circuits focus on improving the performance of the circuit. When faced with large-scale production, they all have relatively large defects in processing efficiency, and they do not contribute to the overall performance of making ductile circuits. The processing technology is integrated and integrated, and the efficiency is more limited

Method used

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  • A method of fabricating a ductile circuit
  • A method of fabricating a ductile circuit
  • A method of fabricating a ductile circuit

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Embodiment Construction

[0032] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.

[0033] figure 1 It is a structural schematic diagram of unwinding and lamination of the ductile circuit according to the embodiment of the method of the present invention, wherein: two unwinding rollers 100 respectively unwind the conductive layer and the auxiliary base layer, and the two rollers 200 complete the lamination of the two .

[0034] figure 2 It is a structural schematic diagram ...

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Abstract

Provided is a method for manufacturing a ductile circuit. The method uses a "roll-to-roll" type process, and involves: (S1) integrating a conductive layer and a first auxiliary substrate layer into one body and then making same into a coiled material, using one end of the coiled material as an initial feeding unrolling end, and extending same to a set length after unrolling; (S2) patterning the conductive layer of the coiled material unrolled to the set length to prepare a required circuit structure; (S3) using a first elastomer layer provided with a first auxiliary substrate as a feeding end, sending same to a pair of rollers, transfer printing the circuit structure to the surface of the first elastomer layer, and then removing the first auxiliary substrate layer; (S4) assembling a chip and the circuit structure together by using double-roll pressing and a bonding difference so as to obtain a ductile circuit layer semi-finished product; and (S5) transfer printing a second elastomer layer to the surface of the ductile circuit layer semi-finished product, wherein the second elastomer layer is used for a packaging layer of the ductile circuit layer semi-finished product. The method improves the production efficiency of the ductile circuit by combining the process of making the ductile circuit with a roll-to-roll motion platform.

Description

technical field [0001] The invention belongs to the field of making ductile circuits, and in particular relates to making ductile circuits with a roll-to-roll method. Background technique [0002] Ductile electronics can be summarized as an emerging electronic technology that manufactures organic / inorganic material electronic devices on ductile plastic or thin metal substrates. , national defense and other fields have broad application prospects, such as flexible electronic displays, organic light-emitting diodes OLED, printed RFID, thin-film solar panels, bionic electronic skin, smart wearable devices, etc. Ductile electronics may bring about a revolution in electronic technology, which has attracted worldwide attention and developed rapidly. The U.S. magazine "Science" listed the development of organic electronics technology as one of the world's top ten scientific and technological achievements in 2000, alongside major discoveries such as the draft human genome and biolo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/20H05K3/30
CPCH05K3/0064H05K3/20H05K3/30H05K2203/0531
Inventor 吴志刚朱斌彭鹏
Owner HUAZHONG UNIV OF SCI & TECH
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