Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Circuit board and manufacturing method thereof

A manufacturing method and circuit board technology, applied in the directions of printed circuit manufacturing, printed circuit, transfer printing, etc., can solve the problems of difficult extraction or extraction cost, waste of cost, high cost, etc., to avoid electrochemical treatment and acid-base etching process. , reduce harm, and help human health

Inactive Publication Date: 2018-06-29
吴勇杰 +2
View PDF7 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This process will produce a large amount of etching sewage containing copper ions during the production process, which will cause great pollution to the environment, and the etched copper is mixed in the chemical solution in the form of ions, which is difficult or expensive to extract, and there is a huge waste of cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention. It can be understood that the drawings are provided for reference and illustration only, and are not intended to limit the present invention. The connection shown in the drawings is only for the convenience of clear description, and does not limit the connection mode.

[0036] It should be noted that all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention. The t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Line widthaaaaaaaaaa
Login to View More

Abstract

The invention provides a manufacturing method of a circuit board, which comprises the steps of designing a circuit pattern; performing mirror image processing on a contour line of the circuit patternto obtain a mirror image contour line of the circuit pattern; coating a copper foil with a layer of strippable glue; attaching a sheet to the side, which is coated with the strippable glue, of the copper foil so as to form a composite sheet; tiling the composite sheet on an adsorption platform with an adsorption function; cutting a copper foil surface in the composite sheet along the mirror imagecontour line of the circuit pattern by using super fast laser so as to form a conductive pattern; stripping the redundant copper foil except for the conductive pattern from the composite sheet; laminating the copper foil surface on which the conductive pattern is formed in the composite sheet to a circuit board substrate coated with an adhesive layer; and stripping the sheet and the strippable glue from the circuit board substrate. The invention further provides a circuit board manufactured according to the manufacturing method. The manufacturing method provided by the invention of the circuitboard has the characteristics of environment-friendly manufacturing process and simplified flow.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing a circuit board and a circuit board manufactured by the method. Background technique [0002] At present, the production of conductive patterns in circuit boards generally adopts the method of chemical etching, that is, using an acidic or alkaline solution that can cause copper to undergo a reduction and oxidation reaction and oxidize it to copper ions, and place the copper clad laminate with the circuit pattern anti-etching layer on it. In the solution, make a series of chemical or electrochemical reactions with the solution, etch away the copper foil on the copper clad plate except the circuit pattern, keep the copper foil with the circuit pattern, and finally form the required conductive pattern. This process will produce a large amount of etching sewage containing copper ions during the production process, which will cause great ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/00H05K3/10
CPCH05K3/007H05K3/103H05K2203/0156H05K2203/0531
Inventor 吴勇杰梁崇智蒲必欣
Owner 吴勇杰
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com