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Method for manufacturing flexible circuit

A production method and ductility technology, which is applied in the direction of printed circuit manufacturing, printed circuit, printed circuit assembly of electric components, etc., can solve the problems of efficiency limitation, processing efficiency defect, and the integration and integration of processing technology without making ductile circuit, etc., to achieve Achieve automation and high efficiency

Active Publication Date: 2017-09-29
HUAZHONG UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Generally speaking, these methods of making flexible / ductile circuits focus on improving the performance of the circuit. When faced with large-scale production, they all have relatively large defects in processing efficiency, and they do not contribute to the overall performance of making ductile circuits. The processing technology is integrated and integrated, and the efficiency is more limited

Method used

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  • Method for manufacturing flexible circuit
  • Method for manufacturing flexible circuit
  • Method for manufacturing flexible circuit

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Embodiment Construction

[0032] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0033] figure 1 It is a structural schematic diagram of completing the unwinding and lamination of ductile circuits according to the method embodiment of the present invention, wherein: two unwinding rollers 100 respectively unwind the conductive layer and the auxiliary base layer, and the rollers 200 complete the lamination of the two. .

[0034] figure 2 It is a schematic diagram of the struct...

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Abstract

The invention discloses a method for manufacturing a flexible circuit. The method uses a roll-to-roll techniques and comprises the following steps of: S1, integrating a conductive layer and a first auxiliary substrate layer into one body and then making the same into a coiled material, using one end of the coiled material as an initial feeding unrolling end and unrolling the end to set length; S2, patterning the conductive layer of the coiled material unrolled to the set length to prepare a required circuit structure; S3, using a first elastomer layer provided with the substrate as a feeding end to be transferred to a pair of roller, transfer printing the circuit structure on the surface of the first elastomer layer, and removing the first auxiliary substrate layer; S4 assembling a chip and the circuit structure by using double-roll pressing and bonding difference so as to obtain a flexible circuit layer semi-finished product; and S5 transfer printing a second elastomer to the surface of the flexible circuit layer semi-finished product, wherein the second elastomer layer is used for the packaging layer of the flexible circuit layer semi-finished product. The method greatly improves the production efficiency of the flexible circuit by combining the process of making the flexible circuit with a roll-to-roll motion platform.

Description

technical field [0001] The invention belongs to the field of manufacture of ductile circuits, in particular to the manufacture of ductile circuits by a roll-to-roll method. Background technique [0002] Ductile electronics can be summarized as an emerging electronic technology that makes organic / inorganic material electronic devices on ductile plastic or thin metal substrates. With its unique characteristics of light weight, thin thickness and ductility, it is widely used in information, energy, medical , national defense and other fields have broad application prospects, such as flexible electronic displays, organic light-emitting diodes OLED, printed RFID, thin-film solar panels, bionic electronic skin, smart wearable devices, etc. Ductile electronic technology has the potential to bring about a revolution in electronic technology, which has attracted worldwide attention and developed rapidly. The American "Science" magazine listed the progress of organic electronic techn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/20H05K3/30
CPCH05K3/0064H05K3/20H05K3/30H05K2203/0531
Inventor 吴志刚朱斌彭鹏
Owner HUAZHONG UNIV OF SCI & TECH
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