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Semi-interpenetrating polymer network polyimide resin composition and film-like adhesive prepared from same

A technology of polythioetherimide resin and resin composition, which is applied in the direction of adhesives, adhesive additives, film/sheet adhesives, etc., can solve the problem of high cost of pentaphenylenetetradiamine monomers, and achieve Effect of good solvent solubility, optimized flexibility and hygroscopicity

Active Publication Date: 2017-06-30
成都正威新材料研发有限公司 +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the cost of the dianhydride monomer and pentaphenylene tetraether diamine monomer used in it is also relatively high

Method used

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  • Semi-interpenetrating polymer network polyimide resin composition and film-like adhesive prepared from same
  • Semi-interpenetrating polymer network polyimide resin composition and film-like adhesive prepared from same
  • Semi-interpenetrating polymer network polyimide resin composition and film-like adhesive prepared from same

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Embodiment Construction

[0033] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all the embodiment. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0034] 1. Preparation of polythioetherimide resin A

[0035] After nitrogen replacement in a dry and clean 20L reactor, add 5mol each of 3-nitrophthalic anhydride and 4-nitrophthalic anhydride with a mass ratio of 5:5, o-xylene and N, N- 12 liters of mixed solvent of dimethylacetamide (DMAC), after stirring and dissolving, add 3mol 4,4′-diaminodiphenyl ODA, 1mol 2,2′-dimethyl-4,4′-diaminodiphenylmethane , 1mol3,3'-...

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Abstract

The invention relates to semi-interpenetrating polymer network polyimide resin composition and a film-like adhesive prepared from the same. The resin composition is a resin composition adhesive solution comprising polythioetherimide resin, a BMI (bismaleimide) prepolymer containing siloxane, filler and an adhesion promoter, and a semi-interpenetrating polymer network polyimide adhesive film is prepared with a tape casting method. A thermoplastic and thermosetting semi-interpenetrating polymer network structure is formed in the polyimide adhesive film, the advantageous properties of the thermoplastic and thermosetting adhesive films are combined, the CTE value and bonding strength of the adhesive film are controlled by adjusting the thermoplastic and thermosetting ratio, and the adhesive film with better comprehensive performance is obtained. The flexibility and moisture absorption performance of the adhesive film are optimized by using BMI resin containing the siloxane structure; the linear expansion coefficient is further decreased by using nano silica filler, and the stripping strength of the adhesive film with metal is further improved by using high-temperature-resistant 4-(trimethoxysilyl)aniline as the adhesion promoter; polythioetherimide is prepared from bis-nitrophthalimide and alkali metal hydrosulfide, and thus the cost of the adhesive film is reduced.

Description

technical field [0001] The invention relates to a polyimide resin composition glue, a preparation method of the composition glue, and a semi-interpenetrating network polyimide film prepared from the composition glue. Background technique [0002] Polyimide film is a heterocyclic polymer matrix resin that was first used in high temperature resistant adhesives. It has excellent heat resistance and film formation, and has important application value in the field of microelectronics manufacturing and high temperature structural bonding. . In recent years, with the development trend of light, thin, short and small electronic products, the market demand for adhesive-free two-layer flexible copper clad laminate (2L-FCCL) is increasing, leading the rapid development of polyimide film. Polyimide film is divided into two categories: thermosetting and thermoplastic. Thermosetting polyimide adhesive film has excellent heat resistance and can be used as structural bonding at 280-320°C,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J181/02C09J179/08C09J11/04C09J11/06C09J7/00C08G75/0259C08G75/0227C08G73/12
Inventor 钟吉彬李晓敏黄渝鸿钟逸康王建英袁萍朱勇程四龙姚曾
Owner 成都正威新材料研发有限公司
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