Semi-interpenetrating polymer network polyimide resin composition and film-like adhesive prepared from same

A technology of polythioetherimide resin and resin composition, which is applied in the direction of adhesives, adhesive additives, film/sheet adhesives, etc., can solve the problem of high cost of pentaphenylenetetradiamine monomers, and achieve Effect of good solvent solubility, optimized flexibility and hygroscopicity
CN106905914AActive Publication Date: 2017-06-30成都正威新材料研发有限公司 +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
成都正威新材料研发有限公司
Publication Date
2017-06-30

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Abstract

The invention relates to semi-interpenetrating polymer network polyimide resin composition and a film-like adhesive prepared from the same. The resin composition is a resin composition adhesive solution comprising polythioetherimide resin, a BMI (bismaleimide) prepolymer containing siloxane, filler and an adhesion promoter, and a semi-interpenetrating polymer network polyimide adhesive film is prepared with a tape casting method. A thermoplastic and thermosetting semi-interpenetrating polymer network structure is formed in the polyimide adhesive film, the advantageous properties of the thermoplastic and thermosetting adhesive films are combined, the CTE value and bonding strength of the adhesive film are controlled by adjusting the thermoplastic and thermosetting ratio, and the adhesive film with better comprehensive performance is obtained. The flexibility and moisture absorption performance of the adhesive film are optimized by using BMI resin containing the siloxane structure; the linear expansion coefficient is further decreased by using nano silica filler, and the stripping strength of the adhesive film with metal is further improved by using high-temperature-resistant 4-(trimethoxysilyl)aniline as the adhesion promoter; polythioetherimide is prepared from bis-nitrophthalimide and alkali metal hydrosulfide, and thus the cost of the adhesive film is reduced.
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Description

technical field

[0001] The invention relates to a polyimide resin composition glue, a preparation method of the composition glue, and a semi-interpenetrating network polyimide film prepared from the composition glue. Background technique

[0002] Polyimide film is a heterocyclic polymer matrix resin that was first used in high temperature resistant adhesives. It has excellent heat resistance and film formation, and has important application value in the field of microelectronics manufacturing and high temperature structural bonding. . In recent years, with the development trend of light, thin, short and small electronic products, the market demand for adhesive-free two-layer flexible copper clad laminate (2L-FCCL) is increasing, leading the rapid development of polyimide film. Polyimide film is divided into two categories: thermosetting and thermoplastic. Thermosetting polyimide adhesive film has excellent heat resistance and can be used as structural bonding at 280-320°C,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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