Composite material, high frequency circuit substrate prepared from composite material, and preparation of composite material

Abstract

The invention relates to a composite material, a high frequency circuit substrate prepared from the composite material, and a preparation of the composite material. The composite material comprises 20 to 70 parts of a thermosetting mixture, 10 to 60 parts of glass fibre cloth, 0 to 70 parts of a powder filling material, and 1 to 3 parts of a curing initiator; the thermosetting mixture is composed of a thermosetting resin and an ethylene propylene rubber; the thermosetting resin is a polybutadiene or a copolymer of the polybutadiene with styrene, wherein the molecular weight of the polybutadiene is lower than 11000Da, the polybutadiene is composed of C and H, and contains more than 60% vinyl; the weight average molecular weight of the ethylene propylene rubber is larger than 100kDa, and lower than 150kDa, the number-average molecular weight of the ethylene propylene rubber is larger than 60kDa, and lower than 100kDa, and the ethylene propylene rubber is a solid material at room temperature. The composite material possesses excellent solvent solubility, and is excellent in operability; the high frequency circuit substrate prepared from the composite material possesses excellent high frequency dielectric properties and better thermal-oxidative aging properties.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a composite material, a high-frequency circuit substrate made with it and a manufacturing method, in particular to a thermosetting dielectric composite material, a high-frequency circuit substrate made with it and a manufacturing method. Background technique [0002] In recent years, with the development of high-performance, high-functionality and networking of information and communication equipment, in order to transmit and process large-capacity information, the operation signal tends to be high-frequency, and thus the material of the circuit board is required. [0003] Among the existing materials for printed circuit boards, epoxy resins with excellent adhesive properties are widely used. However, epoxy resin circuit boards generally have high dielectric constants and dielectric loss tangents (dielectric constants greater than 4, dielectric The loss tangent is about...

AI Technical Summary

Problems solved by technology

[0011] The current research on ethylene-propylene rubber shows that when ethylene-propylene rubber is added to a thermosetting resin for the production of circuit substrates, as the weight-average molecular weight increases, the composite material and its circuit substrates have better performance. Thermal oxygen aging performance, however, as the weight average molecular weight increases, the solubility of the material will decrease, the process operability will deteriorate, and the production of prepregs is relatively difficult

Images