Composite material, high-frequency circuit substrate made of same, and manufacturing method
A technology of composite materials and mixtures, which is applied in the direction of circuit substrate materials, circuit devices, printed circuits, etc., can solve the problems of material solubility degradation, poor process operability, and difficulties in making prepregs, and achieve good thermal oxygen aging performance and production Easy to improve the effect of long-term thermo-oxidative aging performance
Active Publication Date: 2019-04-30
GUANGDONG SHENGYI SCI TECH
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Problems solved by technology
[0011] The current research on ethylene-propylene rubber shows that when ethylene-propylene rubber is added to a thermosetting resin for the production of circuit substrates, as the weight-average molecular weight increases, the composite material and its circuit substrates have better performance. Thermal oxygen aging performance, however, as the weight average molecular weight increases, the solubility of the material will decrease, the process operability will deteriorate, and the production of prepregs is relatively difficult
Method used
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Embodiment
[0112] A method for manufacturing a high-frequency circuit substrate, comprising the steps of:
[0113] Mix the components involved in the example according to the addition amount shown in the table below, adjust to a suitable viscosity with solvent toluene, stir and mix evenly, and prepare the glue;
[0114]Use 1080 glass fiber cloth to impregnate the above glue solution, and then dry to remove the solvent to make a prepreg; stack eight prepregs that have been made, and laminate copper foil with a thickness of 1 oz (ounce) on both sides. Curing for 2 hours in the middle, the curing pressure is 50kg / cm 2 , The curing temperature is 190°C.
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Abstract
The invention relates to a composite material, a high-frequency circuit substrate made by using the composite material, and a manufacturing method. The composite material includes: (1) 20 to 70 parts of a thermosetting mixture; the thermosetting mixture includes: (A) The following thermosetting resins are based on polybutadiene or polybutadiene-styrene copolymer resins composed of hydrocarbon elements containing more than 60% vinyl; and (B) a weight-average molecular weight greater than 100,000 and less than 15 10,000 and number average molecular weight greater than 60,000 but less than 100,000 is solid ethylene-propylene rubber at room temperature; (2) 10-60 parts of glass fiber cloth; (3) 0-70 parts of powder filler; (4) curing initiator 1 to 3 copies. The composite material of the invention has good solvent solubility and good process operation performance; the high-frequency circuit substrate made of the composite material has good high-frequency dielectric performance and better thermal-oxygen aging performance.
Description
technical field [0001] The invention relates to the technical field of polymer materials, in particular to a composite material, a high-frequency circuit substrate made with it and a manufacturing method, in particular to a thermosetting dielectric composite material, a high-frequency circuit substrate made with it and a manufacturing method. Background technique [0002] In recent years, with the development of high-performance, high-functionality and networking of information and communication equipment, in order to transmit and process large-capacity information, the operation signal tends to be high-frequency, and thus the material of the circuit board is required. [0003] Among the existing materials for printed circuit boards, epoxy resins with excellent adhesive properties are widely used. However, epoxy resin circuit boards generally have high dielectric constants and dielectric loss tangents (dielectric constants greater than 4, dielectric The loss tangent is about...
Claims
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IPC IPC(8): C08L47/00C08L23/16C08L71/12C08K13/04C08K5/5399C08K3/36C08K5/14C08K7/14C08K5/03C08K5/3492H05K1/03B32B17/02B32B17/06B32B17/10B32B25/14B32B27/28
CPCB32B5/02B32B25/04B32B25/14B32B27/12B32B27/28C08L47/00H05K1/0353C08L2201/08C08L2205/03C08L2203/20B32B2307/204B32B2262/101C08J5/244C08J5/249C08L23/16C08K13/04C08K5/5399C08K3/36C08K5/14C08K7/14C08L71/126C08K2003/2241C08L79/04C08K5/03C08K5/3492B32B5/26B32B17/02B32B25/16C08J2400/26C08J2300/24C08J2325/10C08J2423/16H05K1/0237H05K1/0366H05K1/0373H05K2201/0154H05K2201/0278H05K2201/068
Inventor 苏民社李杜业颜善银刘潜发杨中强
Owner GUANGDONG SHENGYI SCI TECH