Method for preparing flexible heat conducting insulating adhesive film used in LED heat radiation substrate

A technology of heat conduction, insulation and high heat conduction, which is applied in the direction of carboxyl rubber adhesives, chemical instruments and methods, adhesives, etc., which can solve the problems of complex preparation process and achieve high peel strength, strong adhesion, and strong flexibility.

Inactive Publication Date: 2012-09-19
HAISO TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The cover film has certain insulation and thermal ...

Method used

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  • Method for preparing flexible heat conducting insulating adhesive film used in LED heat radiation substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Place the high thermal conductivity inorganic filler in a vacuum oven at 140°C to vacuum dry for 4 hours to remove moisture, and cool to room temperature; weigh the high thermal conductivity inorganic filler in an ethanol aqueous solution (95% by volume of ethanol) in which the coupling agent KH560 is dissolved according to the proportion %), heated in a water bath to 40°C, stirred for 4 hours, filtered, washed twice with absolute ethanol, dried in vacuum at 60°C for 12 hours, ground into powder to obtain a surface-treated high thermal conductivity inorganic filler for use;

[0035] Choose bisphenol A epoxy resin E-44 as liquid epoxy resin, choose bisphenol A epoxy resin CYD-014 as solid epoxy resin, choose CTBN1300×31 as toughening agent, choose dapsone as curing agent , the mixture of alumina, boron nitride and silicon carbide (arbitrary ratio) is selected as the high thermal conductivity inorganic filler, H-1331 is selected as the leveling agent, and the mixed solutio...

Embodiment 2

[0039] The surface treatment process of the high thermal conductivity inorganic filler is as described in Example 1, and the coupling agent is replaced by KH550.

[0040] Choose bisphenol A epoxy resin E-42 as liquid epoxy resin, choose bisphenol A epoxy resin CYD-011 as solid epoxy resin, choose carboxyl-terminated liquid nitrile rubber CTBN1300×8 as toughener, choose Dapsone is used as a curing agent, a mixture of alumina, boron nitride and silicon carbide (arbitrary ratio) is used as a high thermal conductivity inorganic filler, H-140 is used as a leveling agent, ethyl acetate, tetrahydrofuran and dimethylformamide are selected (arbitrary ratio) of the mixed solution as an organic solvent. The preparation process of the thermally conductive and insulating adhesive is as described in Example 1, and the dosage of each formulation of the flexible thermally conductive and insulating adhesive is shown in Example 2 in Table 1.

[0041] The obtained flexible thermally conductive ...

Embodiment 3

[0044] The surface treatment process of the high thermal conductivity inorganic filler is as described in Example 1, and the coupling agent is replaced by TMC-201.

[0045] The polybutadiene epoxy resin Oxiron 2000 was selected as the liquid epoxy resin, the o-cresol novolac epoxy resin CYDCN-100 was selected as the solid epoxy resin, the amino-terminated liquid nitrile rubber ATBN1300×35 was selected as the toughening agent, and aminobenzene was selected Sulfone is used as curing agent, the mixture of alumina, boron nitride and silicon carbide (arbitrary ratio) is used as high thermal conductivity inorganic filler, H-1231 is used as leveling agent, acetone, tetrahydrofuran and dimethylformamide (arbitrary ratio) are selected mixed solution as an organic solvent. The preparation process of the flexible thermally conductive insulating adhesive is as described in Example 1, and the dosage of each formulation of the flexible thermally conductive insulating adhesive is shown in Ex...

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Abstract

A method for preparing flexible heat conducting insulating adhesive film used in an LED heat radiation substrate comprises the preparation of a flexible heat conducting insulating adhesive and that of the flexible heat conducting insulating adhesive film, wherein the flexible heat conducting insulating adhesive comprises liquid epoxy resin, solid epoxy resin, flexibilizer, curing agent, high-heat conductivity inorganic packing, organic solvent, coupling agent, dispersing agent and flatting agent. The method for preparing the flexible heat conducting insulating adhesive film comprises the following steps: coating the flexible heat conducting insulating adhesive on a release film through a coating machine; baking through a temperature control baking channel to obtain an flexible heat conducting insulating adhesive layer used in the LED heat radiation substrate; coating the release film on the adhesive surface in a compounding manner; and rolling and forming to obtain the flexible heat conducting insulating adhesive film used in the LED heat radiation substrate. The adhesive film used in the LED heat radiation substrate has the characteristics of high heat dissipation, insulation, heat resistance and peel strength, flexibility and the like.

Description

technical field [0001] The invention belongs to the field of polymer material preparation. The invention relates to a method for preparing a flexible heat-conducting insulating adhesive film for an LED heat dissipation base material by using a flexible heat-conducting insulating adhesive. Background technique [0002] As a high-profile emerging product, light-emitting diode (LED) has the advantages of high brightness, small size, long life, environmental protection and energy saving, and has been widely used in indoor and outdoor lighting, display light source, automotive lamp, backlight and other industries . With the popularity of LED applications, the main factor and technical bottleneck restricting its development is heat dissipation. Improving LED luminous efficiency and service life, and solving the heat dissipation problem of LED products have become one of the most important issues at this stage. It is an urgent need to develop flexible thermally conductive insula...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J163/08C09J163/04C09J113/00C09J115/00C09J11/04B32B37/12
Inventor 范和平韩志慧李桢林杨蓓刘莎莎
Owner HAISO TECH
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