Adhesive for optical communication device

A binder and optical communication technology, applied in the direction of adhesives, adhesive types, polymer adhesive additives, etc., can solve the problems of high labor costs, low displacement, low production efficiency, etc., to reduce labor costs, shorten Process flow, the effect of reducing production costs

Inactive Publication Date: 2019-05-03
上海熙邦新材料有限公司
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The curing characteristics of acrylate are mainly that light curing has the characteristics of fast positioning, but the chemical resistance and reliability are insufficient, and the curing shrinkage rate is too large; while epoxy adhesive has high reliability, but the curing time is long, which cannot meet the requirements. Pipeline Production Requirements for Optical Communication Device Manufacturing
Ordinary photothermal dual-curing adhesives have a long UV positioning time, and have a large curing stress and shrinkage rate, which cannot meet the requirements of fast positioning within 10 seconds and low stress and low displacement required for optical device production.
Another existing adhesive for optical communication devices is to use UV glue for positioning first, and then use heat-curing glue to improve reliability to meet the requirements of optical devices. Due to the need for secondary sizing, the production Low efficiency, high labor cost, and multiple sizing may lead to high product defect rate

Method used

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  • Adhesive for optical communication device
  • Adhesive for optical communication device
  • Adhesive for optical communication device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～5

[0026] Embodiment 1~5, the preparation of adhesive for optical communication device

[0027] According to the formulations listed in Tables 1 to 5, the adhesive for optical communication devices was prepared through the following steps:

[0028] 1) Add epoxy resin, dual-functional functional group resin, and functional resin into the double-planetary vacuum mixer with stepless speed regulation, control the temperature of the material in the mixer within the range of 60-80°C, and start the mixing mixer at a speed of 100 ~300 rpm, start the high-speed disperser at the same time, the speed is 1500-2000 rpm, keep stirring for 60-90 minutes, so that the functional resin, epoxy resin and dual-functional resin can be fully contacted and fused and mixed evenly;

[0029] 2) After the temperature of the mixed resin is lowered to 20-25°C, add transparent filler and mix evenly, take it out and further disperse it through a non-metallic roller three-roll mill, and control the fineness to l...

Embodiment 6

[0044] Embodiment 6, adhesive bond strength test

[0045] Get the adhesive for optical communication devices obtained in Examples 1 to 5, and carry out a bond strength test on BOSA (Bi-Directional Optical Sub-Assembly, light emitting and receiving components), and simultaneously use ordinary secondary dispensing (UV glue+thermal Cured glue) as a control, the specific test results are shown in Table 6.

[0046] Table 6. Performance test results

[0047]

[0048] It can be seen from the results of the bonding strength test in Table 6 that the bonding strength of the adhesives obtained in Examples 1 to 5 in the bonding of the optical fiber communication device BOSA is greater than 1.0 kg after UV curing. After 10 minutes of thermal curing, the pulling force is greater than 15 kg, which meets the process and reliability requirements of active or passive optical devices, and can well replace the existing two kinds of adhesives (UV glue positioning + thermal curing) glue) to im...

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Abstract

The invention discloses an adhesive for an optical communication device. A formula for preparing the adhesive for the optical communication device comprises the following raw materials in percentagesby weight: 30-50% of epoxy resin, 10-50% of bifunctional resin, 1-10% of functional resin, 1-10% of a toughening agent, 1-10% of a thermal curing agent and 0.5-5% of a photo curing agent. According tothe adhesive for the optical communication device, the performance index of the adhesive meets the requirements on the process and reliability of an active or passive optical device, an existing method of improving reliability by using two adhesives (UV adhesive positioning and thermal curing adhesive) respectively can be replaced well, the adhesive has double curing functions of photo curing andheating curing, and the product has the characteristics of rapid UV positioning performance and high reliability of a heating curing adhesive.

Description

technical field [0001] The invention relates to the technical field of bonding and sealing for optical communication active and passive optical devices and other optical devices, in particular to a fast-positioning dual-curing adhesive for single-component optical communication devices. Background technique [0002] Optical communication, as a communication method with light wave as the carrier, has become the main transmission method of various communication networks, and plays a pivotal role in modern telecommunication networks. As an emerging technology, optical fiber communication is rare in the history of communication for its rapid development and wide range of applications in recent years. It is also an important symbol of the world's new technology revolution and the main transmission tool for various information in the future information society. Optical devices It is also the heart of the optical transmission system. As an optical communication adhesive that plays ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/08C09J11/08C09J11/06
Inventor 丁宇辉
Owner 上海熙邦新材料有限公司
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