Epoxy resin composition as well as preparation method and application thereof

A technology of epoxy resin and composition, which is applied in the direction of epoxy resin glue, epoxy polymerized polyolefin adhesive, aldehyde/ketone condensation polymer adhesive, etc., which can solve the problems of low bonding strength and packaging bonding Poor properties and other problems, to achieve the effect of enhanced bonding, good bonding performance

Pending Publication Date: 2022-05-10
江苏中科科化新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a kind of epoxy resin composition and its preparation method and application in order to overcome the problem of poor adhesion and low bonding strength of the copper nickel-plated frame package existing in the prior art, and the epoxy resin composition has Good bonding properties with the necessary fluidity, formability and flame retardancy

Method used

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  • Epoxy resin composition as well as preparation method and application thereof
  • Epoxy resin composition as well as preparation method and application thereof
  • Epoxy resin composition as well as preparation method and application thereof

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Embodiment approach

[0050] According to a preferred embodiment of the present invention, the preparation method further includes: cooling and pulverizing the melt-kneaded epoxy resin composition to obtain the epoxy resin composition.

[0051] Preferably, the particle size of the pulverized epoxy resin composition does not exceed 1.5 mm.

[0052] The third aspect of the present invention provides the application of the above epoxy resin composition in the copper-nickel-plated frame package;

[0053] Wherein, the application includes molding the epoxy resin composition on a nickel-plated copper frame.

[0054] In the present invention, the epoxy resin composition has excellent adhesion performance on the metal frame, especially for copper-nickel-plated frame packaging with higher reliability, and can avoid defects such as delamination caused by insufficient adhesion .

[0055] According to the present invention, the molding conditions have a wide range and can be adjusted according to actual appl...

Embodiment 1-13

[0084]After weighing and mixing according to the proportion of each component in Table 1, melt and knead uniformly on an open mill preheated at a temperature of 65-95 ℃, and then remove the uniformly mixed material from the mill and naturally cool it, and pulverize to obtain powder. After passing through a 10-mesh sieve, the particle size of the powdery material after sieving does not exceed 1.5mm. Further preformed to obtain the cake of epoxy resin composition, the density of preformed cake is 1.6-2.1g / cm 3 , evaluated by the following methods, and the results are shown in Table 1.

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Abstract

The invention relates to the field of semiconductor packaging, and discloses an epoxy resin composition and a preparation method and application thereof, the epoxy resin composition comprises epoxy resin, phenolic resin, a curing accelerator, a filler, a release agent, a coupling agent and an adhesion accelerator; wherein the adhesion promoter comprises a first adhesion promoter and an optional second adhesion promoter; the first adhesion promoter is selected from at least one of a thiazole compound, a thiadiazole compound and a pyrazole compound. According to the epoxy resin composition, groups such as amino groups, sulfydryl groups and the like in molecules of the adhesion promoter and hydroxyl groups on metal form hydrogen-bond interaction or N and S atom lone electron pairs and metal atom empty orbits form covalent bonds, so that adhesion between a system and a nickel-plated copper framework is enhanced; meanwhile, the epoxy resin composition has necessary flowability, formability and flame retardance.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to an epoxy resin composition and a preparation method and application thereof. Background technique [0002] Epoxy molding compound is widely used in the field of semiconductor packaging because of its excellent performance, especially in chip and integrated circuit packaging, it is used as the mainstream material. With the development of semiconductor packaging towards high integration, large chips, and more complex structures, the requirements for frames and packaging substrates are getting higher and higher. The traditional copper frame has excellent electrical conductivity and heat dissipation, but to a certain extent copper is easy to oxidize, and atoms are easy to migrate, which will cause defects in appearance and even electrical properties. A dense oxide layer can be formed on the nickel surface to prevent further oxidation. Therefore, the nickel-plated copper frame i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/08C09J161/06C09J11/06H01L23/29
CPCC09J163/00C09J163/08C09J11/06H01L23/298C08L2203/206C08L2201/02C08L61/06C08K3/36C08K5/544C08K5/3472C08K5/47C08K5/46C08K5/3447C08K5/5399
Inventor 丁昇征李卓李海亮李刚王善学卢绪奎
Owner 江苏中科科化新材料股份有限公司
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