This application discloses a GaN-based micro-LED epitaxial structure, device, and fabrication method. The GaN-based micro-LED epitaxial structure includes, along the growth direction, a substrate, a buffer layer, an N-type doped GaN
electron injection layer, an active region, and an Al2O3 layer. y Ga 1‑y The substrate consists of an N-type
electron blocking layer and a P-type doped GaN
hole injection layer; the substrate is selected from a (111)
crystal plane single-
crystal silicon substrate, a c-axis single-
crystal sapphire substrate, a c-axis single-crystal
silicon carbide substrate, or a c-axis self-supporting single-crystal
gallium nitride substrate; the active region includes an InGaN-based light-emitting structure, which is at least one of an InGaN / GaN alternating multi-
quantum-well structure, a GaN / InGaN / GaN single-
quantum-well structure, and an InGaN
quantum dot structure. This application shortens the carrier radiative recombination lifetime, weakens the quantum-confined
Stark effect, and improves the radiative
recombination rate by employing a thin
quantum well or
quantum dot active region structure, thereby enhancing the device's
modulation bandwidth and
photoelectric efficiency, meeting the performance requirements of light sources for applications such as
data center optical interconnects, co-packaged
optics, and high-speed
visible light communication.