2362results about "Overvoltage protection resistors" patented technology

An electromagnetic interference filter terminal assembly for active implantable medical devices includes a structural pad in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device to the capacitor structure via thermal or ultrasonic bonding, soldering or the like while shielding the capacitor from forces applied to the assembly during attachment of the wires.

A surge protection element for a conventional cable connector includes a printed circuit board preferably shaped as two concentric rings connected by two spokes. The outer ring is electrically connected to the grounded portion of the cable connector body. A printed circuit trace on one of the spokes is separated from a printed circuit trace on the inner ring by a spark gap. If a high voltage surge is carried by the coaxial cable transmission line, a spark is formed in the gap. As a consequence, the high voltage surge is transferred to the surge protection element which in turn conducts the electricity to the grounded body of the connector.

An electrically conductive element for protecting electrical components positioned within a cable connector or cable terminator from high voltage surges includes a ring that is positioned in circumferentially surrounding relation to the input pin of the connector or terminator that carries the signal being transmitted by the coaxial cable. The ring includes at least one prong that extends radially inward therefrom which terminates in close but non-contacting relation to the input pin. When a high voltage surge of electricity is carried by the coaxial cable transmission line, a spark is formed in the gap between the prong and the cable connector or terminator. As a consequence, the high voltage surge is transferred to the surge protection element which in turn conducts the electricity to the grounded body of the connector or terminator.

The present invention relates to a novel thermal-sensitive resistive apparatus, such as PTC and NTC, which allocates planar electrode films on the top and bottom surfaces of a prior art thermal-sensitive resistive apparatus, such as a PTC apparatus, to laminate with an outer electrode layer. A plurality of interconnection vias are electroplated with conductive material to connect to any plane. It is convenient to surface mount the apparatus of the present invention on a printed circuit board. The present invention can largely increase the dimensional stability of components and overcome the disadvantage that thermal diffusion of the prior are surface mounted resistive apparatus is affected easily by line width and environments.

A method for implementing an inductor-capacitor filter in an integrated circuit. Embodiments of the invention implement a 5-pole LC low-pass filter suitable for incorporation in wireless applications necessitating compact layouts. Inductors are formed in an IC as concentric coils on metallization layers, the concentric coils providing a negative coupling coefficient between the inductors. The invention provides programmable frequency response characteristics, enabling the transmission of high-frequency base band information while attenuating carrier RF frequencies.

A voltage variable material (“VVM”) including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid FR-4 laminate, a polyimide, a polymer or a multilayer PCB via a process such as screen or stencil printing. In one embodiment, the VVM includes two types of conductive particles, one with a core and one without a core. The VVM can also have core-shell type semiconductive particles.

A module includes an electronic component having at least two electrodes, a board having electrodes on its surface to be connected to the electrodes of the electronic component, respectively, solders for connecting the electrodes of the electronic component to the electrodes of the board, respectively, an insulating resin covering the electronic component, the surface of the board, the solder, and the electrodes, and solder resists provided on the surface of the board and around the electrodes of the board, respectively. One of the solder resists is separated from the other electrode at a portion between the electronic component and the board. When this module is mounted on a motherboard, the solder does not flow out of the electrodes even when the solder in the insulating resin melts.

The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging. The invention can be employed between an active electronic component and a multilayer circuit card. A method for making the interposer is not presented and can be varied to the individual or proprietary construction methodologies that exist or will be developed.

The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a printed circuit board, integrated circuit chips or other substrates containing conductive energy pathways that service an energy utilizing load and leading to and from an energy source. The interposer will also possess a multi-layer, universal multi-functional, common conductive shield structure with conductive pathways for energy and EMI conditioning and protection that also comprise a commonly shared and centrally positioned conductive pathway or electrode of the structure that can simultaneously shield and allow smooth energy interaction between grouped and energized conductive pathway electrodes containing a circuit architecture for energy conditioning as it relates to integrated circuit device packaging. The invention can be employed between an active electronic component and a multilayer circuit card. A method for making the interposer is not presented and can be varied to the individual or proprietary construction methodologies that exist or will be developed.

Lossy materials can be used to suppress EMI transmission. Disclosed are methods for applying lossy materials to EMI shielded enclosures to improve EMI shielding effectiveness and the EMI shielded enclosures so produced. In some embodiments, the EMI shielded enclosure includes a printed-circuit board mountable device. In one embodiment, lossy material can be applied to the interior of an EMI shielded enclosure using an adhesive. In another embodiment, lossy materials can be applied to the exterior of the EMI enclosure to suppress EMI incident upon the EMI shielded enclosure, thereby reducing the susceptibility of electronics contained within the EMI shielded enclosure. In yet another embodiment, lossy materials can be applied to both the interior and exterior of the EMI enclosure.

A home control protection system includes at least one surge protection strip having a plurality of power outlet receptacles, and a wall mountable central control unit that is in electrical communication with the at least one surge protection strip. The surge protection strip includes a replaceable surge protector module. The surge protection strip includes a circuit for detecting and counting the number of power surges which are shunted by the surge protector module, and compares the number of power surges with a predetermined threshold power surge number that corresponds to a predicted maximum number of power surges before failure of the surge protector module will occur.

On the surface of a ceramic sinter, at least an external electrode for input, an external electrode for output, and external electrodes for grounding are disposed, and the ceramic sinter includes an inductor electrically connected to the external electrode for input and external electrode for output, and a varistor electrically connected to the external electrode for input and external electrodes for grounding. By connecting the inductor to the signal line of the circuit of an electronic appliance and connecting the varistor between the input side of the signal line and the ground, electrostatic discharge pulses of about 0.5 to 2 nanoseconds can be suppressed efficiently.

Apparatus and processes to automatically power-down a computer system upon determination of the presence, imminence, or forecast of severe weather in the local area. A computer system receives data relating to a weather forecast for a particular local area from a weather service communication server and, based on a determination of the presence, imminence or forecast of severe weather in the local area, initiates an automatic power-down sequence. A delay may be provided to allow the user time to abort the initiation of the automatic power-down sequence. The data may be transmitted in any suitable manner, e.g., over a telephone line through the PSTN, using the Internet, using a paging system, etc. The weather service communication server is provided with the particular local area relating to the computer system. For instance, in the case of a dial-up telephone call to the weather service communication server, call related information such as the telephone exchange number and / or the area code in Caller ID information can be used by the weather service communication server to determine the local area relating to the particular computer system. Thus, a user is provided additional security against damage which may be caused to all or a portion of a computer system due to lightning strikes, downed telephone poles, etc. as a result of severe weather in a local area.

The present invention provides overvoltage circuit protection. Specifically, the present invention provides a voltage variable material (“VVM”) that includes an insulative binder that is formulated to intrinsically adhere to conductive and nonconductive surfaces. The binder and thus the VVM is self-curable and may be applied to an application in the form of an ink, which dries in a final form for use. The binder eliminates the need to place the VVM in a separate device or for separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid (FR-4) laminate, a polyimide or a polymer. The VVM can also be directly applied to different types of substrates that are placed inside a device.

An electrostatic discharge (ESD) protection circuit in a semiconductor integrated circuit (IC) having protected circuitry is provided herein. In one embodiment, a circuit for protecting an integrated circuit from ESD includes a protected circuit node in the integrated circuit, a multiple stage transistor pump circuit coupled to the protected circuit node, and an electrostatic discharge protection circuit having a trigger coupled to the multiple stage transistor pump circuit. The multiple stage transistor pump circuit may comprise a Darlington transistor pump circuit.

An AC / DC power device for AC / DC power line communication is provided. An AC / DC protection circuit coupled to an AC / DC power line is able to receive an AC or DC power. An AC / DC configuration circuit coupled to the AC / DC protection circuit is used to switch between an AC mode and a DC mode PLC. An AC / DC coupling / filtering circuit coupled to the AC / DC configuration circuit is to couple and filter the received power, and then coupled an AC voltage or a first DC voltage. An AC / DC converter coupled to the AC / DC coupling / filtering circuit is used to convert the AC voltage into a second DC voltage. A DC / DC converter coupled to the AC / DC coupling / filtering circuit and the AC / DC converter is to convert the first DC voltage (DC mode) and convert the second DC voltage (AC mode), so as to output DC voltages respectively to analog and digital circuit of the PLC modem.

A pnpn thyristor element Thy1 and six pn diode elements D1, D2, D3, D4, D5, and D6 are formed in a semiconductor substrate of a first conductivity type, and separated into six regions by a diffusion layer of a second conductivity type which also functions as the anode of the thyristor element Thy1. A double isolation diffusion layer is disposed between the region of the thyristor element Thy1 and three pn diode elements D1 ·D2 and D6, and the region of the three remaining pn diodes D3, D4, and D5. Surface connection is performed to provide a balance type surge protection circuit.

In a hybrid DC electromagnetic contactor, by including a power unit for supplying a certain power voltage; a main contact point of a breaking switch for providing a supply path of the power voltage by being switched in accordance with a voltage apply to an operational coil; a switch for providing a supply path of the power voltage according to a gate signal; a snubber circuit for charging voltage at the both ends of the switch in turning off of the switch and being applied-discharged an electric current when the charged voltage is not less than a certain voltage; and a discharge current removing unit for removing the discharge current by providing a discharge current path to a load block in turning off of the switch, it is possible to minimize a size of leakage current when the main contact point and the semiconductor switch are turned off, and accordingly it can be practically used.

An electrostatic discharge (ESD) protection circuit in a semiconductor integrated circuit (IC) having protected circuitry. In one embodiment, the ESD protection circuit includes a pad adapted for connection to a first voltage source of a protected circuit node of the IC, and a silicon controlled rectifier (SCR) having an anode adapted for coupling to the first voltage source, and a cathode adapted for coupling to a second voltage source. At least one capacitive turn-on device respectively coupled between at least one of a first gate of the SCR and the first voltage source, and a second gate of the SCR and the second voltage source.

The present invention relates to a passive electronic component architecture employed in conjunction with various dielectric and combinations of dielectric materials to provide one or more differential and common mode filters for the suppression of electromagnetic emissions and surge protection. The architecture allows single or multiple components to be assembled within a single package such as an integrated circuit or connector. The component's architecture is dielectric independent and provides for integration of various electrical characteristics within a single component to perform the functions of filtering, decoupling, fusing and surge suppression, alone or in combination.

A switch which is magnetic pole insensitive is described. The switch includes a Hall effect sensor coupled to a threshold circuit which provides an output signal indicative of the proximity of a magnet, and hence a magnetic field, to the Hall effect sensor regardless of the orientation of the magnet to the Hall effect sensor.