215results about "Thermistors" patented technology

The invention belongs to the field of semiconductor bridge current protection, and particularly relates to a semiconductor bridge current protection method based on a vanadium dioxide thick film thermistor. Firstly, copper, nickel and gold interdigital electrodes are deposited and grown on an aluminum oxide ceramic substrate, then a methanol solution of vanadyl acetylacetonate is sprayed on the surface of the heated interdigital electrode, a vanadium dioxide thermistor device is obtained, the vanadium dioxide thermistor device is connected with a semiconductor bridge in parallel, and current protection of the semiconductor bridge thermistor is achieved. Vanadium dioxide with a single valence state can be synthesized by adjusting the synthesis method and process, M-phase vanadium dioxide is synthesized on the interdigital electrode in one step, the vanadium dioxide prepared by the method avoids the tedious process that vanadium dioxide powder is firstly prepared and then transplanted to the surface of the interdigital electrode, and the preparation method is simple and convenient to operate. And the vanadium dioxide can be more stably combined on the surface of the interdigital electrode.

The invention relates to a metallization layer for a PTC semiconductor ceramic for at least partially coating the surface of the PTC semiconductor ceramic, which contains at least one functional layer, wherein the at least one functional layer serves for current distribution, wherein the porosity of the at least one functional layer is less than 5%, as well as a method for applying the metallization layer to a PTC semiconductor ceramic, a PTC thermistor which has this metallization layer, and the use thereof.

The invention discloses a thermistor mounting method and related equipment. The thermistor mounting method comprises the following steps: applying micro-power alternating bias excitation to a thermistor to obtain cold-state thermal resistance reference data; mounting a thermistor on the surface of the solder paste, collecting real-time resistance data in a temperature rise process, and performing normalized difference according to cold-state thermal resistance reference data to obtain a normalized dynamic resistance curve; performing derivative continuity and extreme value distribution analysis on the curve to obtain a wetting connectivity index; when the wetting connectivity index reaches a preset threshold value, executing second-order extreme value spacing analysis to obtain interface heat flux density distribution, calculating an interface thermal resistance dispersion vector field, and adjusting the transmission chain speed and furnace chamber airflow parameters according to the interface thermal resistance dispersion vector field; and a backtracking dynamic resistance curve is obtained in the cooling process, and the backtracking dynamic resistance curve and the standardized dynamic resistance curve are differentiated to obtain a curing quality factor. According to the invention, real-time identification in a defect germination stage and instant correction in a solder solidification window stage in a thermistor mounting process can be realized, and the mounting quality and reliability are improved.

One aspect relates to a high-temperature sensor, having a coated substrate. The substrate contains a zirconium oxide or a zirconium oxide ceramic, at least one resistance structure and at least two connection contacts. The connection contacts electrically contact the resistance structure. The substrate is coated with an insulation layer. The insulation layer contains a metal oxide layer, the resistance structure and the free regions of the insulation layer, on which no resistance structure is arranged, are coated at least in regions with a ceramic intermediate layer, and a protective layer and / or a cover is arranged on the ceramic intermediate layer. At least one opening is formed in the insulation layer, which exposes at least sections of a surface of the substrate.

The present disclosure provides a high-temperature resistant nano-copper produced by laser direct writing, a preparation method and an application thereof. The high-temperature resistant nano-copper exhibits excellent oxidation resistance, thermal stability and superior conductivity. In this disclosure, the preparation is simple, and the nano-copper oxide ink can be stored for extended periods without being affected by oxidation. It is suitable for various manufacturing processes including printing, coating, and other similar methods. Moreover, based on laser direct writing, the processing efficiency is high, enabling the one-step integration of multi-performance of the high-temperature resistant nano-copper. The high-temperature resistant nano-copper described in the present disclosure can be used as an interconnection circuit in an integrated sensor system based on all-laser in-situ direct writing, and can be widely applied in fields of aerospace, automobile, electronics, etc.

The thermistor is provided with: a holding member that is attached to a wall section that partitions the inside and the outside of a case member; and a thermistor body that is held by the holding member and detects the temperature inside the housing member. The thermistor body is provided with: a thermistor element for detecting temperature; a lead electrically connected to the thermistor element; and a resin part which covers the thermistor element and from which the lead wire is led out to the outside. The holding member includes: a holding portion that holds the resin portion and arranges the thermistor element inside the frame member; and a lead-out part for leading out the lead wire to the outside of the frame member.

Composite materials for simultaneous thermal management and electromagnetic interference screening of radiofrequency-based electronic systems are provided. The materials contain a phase change material and one or more electrically and thermally conductive filler particles. The materials provide a passive system for thermal management and EMI shielding that is lightweight, does not contain moving parts, and does not require an external power supply.

A system includes an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power module, the power module including a thermistor assembly, the thermistor assembly including: a conductive layer including a trench; a thermistor connected to the conductive layer and disposed across the trench; and a first height control feature between the conductive layer and the thermistor.

An electrical device is described. According to one embodiment, the electrical device comprises an electrical element comprising two electrodes and two wires connected to the electrodes, each wire comprising a flat area forming one end of the wire, and the flat areas being configured to touch the electrodes. Furthermore, a method for manufacturing an electrical device is described.

A liquid level sensor can include a circuit board and a thermistor bridge supported by the circuit board comprising a first pair of thermistors and a second pair of thermistors. A heat sink can be coupled to the circuit board proximate the first pair of thermistors and not the second pair of thermistors. A power supply can be configured to provide pulses of electrical current through the thermistor bridge. A controller in communication with the thermistor bridge can be configured to receive a measurement signal from the thermistor bridge output a low product indication when the measurement signal satisfies a predetermined condition.

To provide a temperature sensor in which a thermistor is accurately determined with respect to a case.SOLUTION: A thermistor assembly body 110 includes a thermistor 111, rigid two lead members 112, and a first resin part 113. A first end part 1121 of the two lead members 112 is connected to the thermistor 111 and the thermistor 111 is sealed by the first resin part 113.SELECTED DRAWING: Figure 6

A buried thermistor includes a lower substrate, an upper substrate, and a number of thermistor stacks. Each thermistor stack includes two resistor subjects. Each resistor subject includes a base layer, a medium layer, a metal layer, a resistor layer, a nanometal layer, and a conductive layer. Applicable material of the resistor layer becomes more diverse by disposing the number of thermistor stacks, and the buried thermistor shows variable thermal sensitivity.

The present invention relates to a sensor comprising a ceramic substrate (1) and two metallization layers (2) applied on opposite surfaces of the ceramic substrate (1), each having an adhesion layer (2A) applied directly onto the ceramic substrate (1) and a gold layer (2B) applied on each adhesion layer (2A). Furthermore, the present invention relates to a method for manufacturing the sensor.

An over-current protection device includes an electrode layer and a heat-sensitive layer. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic, and is laminated between a top metal layer and a bottom metal layer of the electrode layer. The heat-sensitive layer includes a polymer matrix and a conductive filler. The polymer matrix includes a first fluoropolymer and a second fluoropolymer. The first fluoropolymer has a first volume and a first melt flow index, and the second fluoropolymer has a second volume and a second melt flow index. The second melt flow index ranges from 0.4 g / 10 min to 0.7 g / 10 min and is lower than the first melt flow index, and a volume ratio by dividing the second volume by the first volume ranges from 0.4 to 0.6.

A circuit protection device is disclosed, comprising: a housing; a negative temperature coefficient thermistor, which is accommodated in the housing and includes a resistance heating element, a pair of electrodes mounted on both sides of the resistance heating element, and a first thermistor lead and a second thermistor lead respectively drawn out from the pair of electrodes; and a fuse, which is accommodated in the housing and includes a fuse body, and a first fuse lead and a second fuse lead respectively connected to both ends of the fuse body. Here, the fuse body includes a fuse rod having a plating layer formed thereon and a pair of fuse caps coupled to both ends of the fuse rod and having conductivity, and the first fuse lead and the second fuse lead are respectively joined to the pair of fuse caps.

An electrical device is specified. According to one embodiment, an electrical device includes an electrical element including two electrodes and two wires connected to the electrodes, where each wire includes a flat region constituting a wire end, and where the flat region is configured for contacting the electrodes. The invention further relates to a method for producing an electrical device.

The invention provides a thermosensitive resistor and a manufacturing method. The thermosensitive resistor comprises a substrate, electrodes and a protective layer, the matrix is prepared from a nano-scale ceramic powder and high-molecular polymer composite material, the nano-scale ceramic powder is uniformly dispersed in a high-molecular polymer, and the high-molecular polymer is polyimide; the electrode is made of an alloy material composed of silver, palladium and rare earth elements, and the electrode is deposited on the surface of the base body through the physical vapor deposition technology. The protective layer wraps the surfaces of the base body and the electrodes, the protective layer is composed of a multi-layer composite material, and the multi-layer composite material comprises an inner layer, a middle layer and an outer layer. Compared with a traditional product, the size is greatly reduced, the development requirement for miniaturization of electronic equipment is met, meanwhile, the layering failure problem caused by thermal expansion under large-current impact is effectively prevented, and the stability of product performance is guaranteed.

The invention relates to an electronic device comprising: - a component having a resistance (R120) with a negative temperature coefficient, and - a temperature control means having an electrical resistance (R130) varying as a function of the temperature T such that the sum of the total resistance (R) is, on a second temperature subrange (302), greater than a setpoint temperature (305), strictly greater than the total resistance (R) at the setpoint temperature (305).

The battery pack (1) includes: a battery (3); and a flexible printed circuit board (7) for detecting the voltage and temperature of the battery (3). The FPC (7) includes: a base material (70) having a front side and a back side; a thermistor (79) for detecting the temperature of the battery (3); a temperature detection line (71); and a voltage detection line (72). The temperature detection line (71) is electrically connected to the thermistor (79) and is disposed between the back side and the battery (3). The voltage detection line (72) is disposed on the front side so as to overlap the temperature detection line (71) when the FPC (7) is viewed in a plane from the back side to the front side.

An electronic component having a case including an accommodation part having an opening; a ceramic element in the accommodation part with first and second main faces facing each other, a first and second electrode formed to the first and second main face, respectively; a first metal terminal including a first electrode connecting part connecting to the first electrode, a first mounting part exposed out of the accommodation part through the opening, and a first terminal arm part connecting the first electrode connecting part and the first mounting part; a second metal terminal including a second electrode connecting part connecting to the second electrode, a second mounting part exposed out of the accommodation part through the opening, and a second terminal arm part connecting the second electrode connecting part and the second mounting part; and an insulation member between the first electrode and the second terminal arm part.

A thermistor includes: a holding member that is assembled on a wall portion of a housing member, the wall portion separating an inside and an outside of the housing member; and a thermistor body that is held by the holding member and that detects a temperature inside the housing member. The thermistor body includes: a thermistor element that detects the temperature; a lead wire that is electrically connected to the thermistor element; and a resin portion which covers the thermistor element and from which the lead wire leads to an outside portion. The holding member includes: a holding portion that holds the resin portion and arranges the thermistor element inside the housing member; and a lead-out portion that leads the lead wire to the outside of the housing member.

The application discloses a recyclable NTC thermistor, which comprises a shell, a viscose cover plate, a sensitive element, a connecting end, a movable ring, a tray, an anti-explosion groove, a movable plate, a pressing plate, a wedge-shaped plate and a rotating plate; the installation assembly of the pressing plate pressing the sensitive element is formed through the wedge-shaped plate and the rotating plate; the cooperation assembly of the rotating plate being separated from the wedge-shaped plate and the pressing plate guarantees the pressing effect on the sensitive element and makes the tray separated from the shell; through pressing the movable ring, the movable plate and the wedge-shaped plate are moved downwards; on one hand, the wedge-shaped plate is moved downwards, the pressing plate is moved along the movable groove and is pressed on the outer surface of the sensitive element; on the other hand, the movable plate is moved downwards, the rotating plate is moved downwards and contacts the fixed plate, the rotating plate moving downwards is rotated, the pressing plate is pressed, the wedge-shaped plate and the rotating plate jointly act on the top and bottom of the pressing plate, so that the pressing plate is stably pressed on the outer surface of the sensitive element, and the sensitive element is fixed.

An electronic device, comprising a component having a resistance with a negative temperature coefficient, and a temperature control means having an electrical resistance varying according to the temperature, such that the sum of the total resistance is, over a second temperature subrange greater than a setpoint temperature strictly greater than the total resistance at the setpoint temperature

A temperature sensor element is provided that can suppress the reduction reaction of a heat-sensitive body even when used in a strong reducing atmosphere for a long period of time. The temperature sensor element (1) of the present invention comprises: a heat-sensitive body (11) whose resistance changes with temperature; a first coating layer (20) that covers the periphery of the heat-sensitive body (11); a pair of lead wires (15, 15) that are connected to the heat-sensitive body (11), pass through the first coating layer (20) and are led out toward the rear end side; a second coating layer (25, 27) that covers the periphery of the pair of lead wires (15, 15) that pass through the first coating layer (20) and are led out; and a third coating layer (30) that covers the periphery of the first coating layer (20) and the second coating layer (25, 27). When the linear expansion coefficients of the lead wire (15), the second coating layer (25, 27) and the third coating layer (30) are set to α15, α25 and α30, respectively, the relationship α15<α30<α25 holds.

This method for manufacturing an electronic component unit (1) is provided with: a first step for manufacturing a base member (2); and a second step for assembling, to the base member (2), either a connector-type housing (3A) integrally and additionally molded on the base member (2) or a housing-type housing (3B) assembled so as to engage with the base member (2). When the connector-type housing (3A) is selected, the connector-type housing (3A) is additionally integrally formed on the base member (2) so as to fill the engagement portion (23) of the base member (2) and form the fitting opening (91), and when the housing-type housing (3B) is selected, after the pair of electric wires (6) and the pair of terminals (30) are connected, the connector-type housing (3A) is integrally formed on the base member (2). Then, the housing-type housing (3B) is assembled to the base member (2) in such a manner that the housing-type housing (3B) is engaged with the engagement section (23) of the base member (2) and the pair of electric wires (6) are inserted through the inside and outside of each of the pair of accommodating chambers (78).

The invention relates to a sensor comprising a ceramic substrate (1) and two metallization layers (2) applied on opposite surfaces of the ceramic substrate (1), in which the two metallization layers (2) each comprise an adhesive layer (2A) applied directly on the ceramic substrate (1) and the two metallization layers each comprise a gold layer (2B) applied directly on the ceramic substrate (1). And the gold layer is coated on the corresponding bonding layer (2A). The invention also relates to a manufacturing method for the sensor.

The purpose of the present invention is to provide a thermistor sintered body for which a desired B constant can be stably obtained even if a composition deviation occurs in an additive element. The thermistor sintered body of the present invention comprises a sintered body that comprises a Y2O3 phase and a Y(Cr),Mn)O3 phase, and a chemical composition of Cr, Mn, Ca, and Y excluding oxygen is Cr: 3 to 12 mol%, Mn: 5 to 15 mol%, Ca: 1 to 8 mol%, and Sr: 1 to 25 mol%, with the remainder comprising inevitable impurities and Y. With the thermistor sintered body of the present invention, Ca and Sr can also be dissolved in a Y(Cr,Mn)O3 phase.

The invention discloses a glass paste for a platinum film thermistor and a preparation method thereof, the glass paste mainly comprises the following components by weight: 50%-75% of a lead-free glass material, 0%-5% of an inorganic additive, and the balance of an organic additive; the lead-free glass material is a SiO2-B2O3-Bi2O3-CaO-Al2O3 system, and is mainly prepared from the following components in percentage by weight: 28.05 percent to 28.45 percent of silicon oxide, 30.31 percent to 30.75 percent of boron oxide, 8.67 percent to 8.80 percent of aluminum oxide, 7.07 percent to 11.52 percent of bismuth oxide, 0 to 3.33 percent of lithium oxide, 9.08 percent to 12.85 percent of zinc oxide, 6.68 percent to 6.77 percent of calcium oxide, 1.85 percent to 1.88 percent of titanium dioxide and 0.1 percent to 0.3 percent of cobalt oxide. The problems that in the prior art, thermal expansion is not matched with a substrate, the sintering temperature range is narrow, and the packaging strength is low are solved, after packaging, glass is free of bubbles inside, high in density and high in bonding strength with the substrate, the tension value is larger than 13 N, and the requirement for long-term use safety of the platinum resistor film temperature sensor can be met.

The invention discloses a surface-mounted ceramic thermistor, and belongs to the technical field of thermistors, the surface-mounted ceramic thermistor comprises a ceramic resistor, an electrode is fixedly connected in the ceramic resistor, a bidirectional liquid spraying assembly is arranged in the ceramic resistor, and the bidirectional liquid spraying assembly comprises a slide rail III; the top of the third sliding rail is slidably connected with a hollow box, the top of the hollow box penetrates through and is rotationally connected with a cylindrical pipe, the top of the cylindrical pipe penetrates through and is connected with a drainage pipe in an inserted mode, and the rear end of the drainage pipe is connected with a liquefied spray type spray head in an inserted mode. The phenomenon that the two electrodes used for a long time are fused due to high temperature is avoided, the possibility that the ceramic resistor is burnt out is reduced, the high efficiency of safe conductive signal transmission of the two electrodes is enhanced, the conductive lead can be cooled, and the sensitivity of conductive detection of communication of the electrodes and the resistive film body is enhanced.

The present invention relates to a PTC chip assembly assembly device and method for a pin-plug starting thermal protector, belonging to the field of starting thermal protectors. The present invention comprises a thermal protector, a cover plate, a first pin, a connecting insert, a duplex insert, a second pin, a bidirectional thyristor (TRIAC), a third reed, a second thermistor (TCR), a fourth reed, a base, and a PTC chip assembly. The PTC chip assembly comprises the second pin, the first pin, the first thermistor (TCR), a first reed, and a second reed. The thermal protector is mounted on the base, the first pin is connected to the connecting insert, the second pin is connected to the first pin, the first pin is connected to the duplex insert, the second reed, the second pin, the third reed, and the fourth reed are all connected to the bidirectional thyristor, the third reed and the fourth reed are respectively connected to the two poles of the second thermistor, and the first pin, the first reed, and the second reed are respectively connected to the two poles of the first thermistor.