Drift-sensitive laser trimming of circuit elements

Abstract

In the laser trimming of passive circuit elements such as resistors, capacitors and inductors, various trimming parameters must be selected. To select a parameter, such as a cut type or speed, a value of a parameter, such as the resistance or impedance of a resistor, of each of a plurality of elements is measured. The measured parameter value of each element is compared with a target value for the parameter to determine an offset value between the measured parameter value and the target value. The relevant trim parameters are then selected based on the determined offset values.

Description

RELATED APPLICATIONS [0001] This application is a continuation of U.S. application Ser. No. 10 / 103,317, filed Mar. 22, 2002, which is herein incorporated in its entirety by reference.FIELD OF THE INVENTION [0002] The present invention relates to trimming elements formed on a panel or other work piece. More particularly the present invention relates to trimming elements, such as resistors, capacitors or other passive circuit elements, which may be later embedded in a layer of a multi-layer work piece, such as a printed circuit board (PCB). BACKGROUND OF THE INVENTION [0003] Material processing is used to adjust the performance of electronic elements by removing or otherwise affecting a portion of the material of the electronic element to change the electrical characteristics thereof. It is known to change the electrical properties of passive and some active electronic elements by removing material therefrom. Methods of removing material include applying laser energy for vaporizing a ...

AI Technical Summary

Benefits of technology

[0056] One embodiment of the present invention provides a method for laser trimming a circuit element. The method includes identifying parameters associated with the element that are substantial contributors to subsequent drift in element value. The identified parameters include, for example, at least one of a paste composition from which the element is formed, a subsequent manufacture processing step to which the element is subject

Problems solved by technology

However, each resistor element 120, as applied to or formed onto the ceramic substrate 110 may have a resistance value that falls outside of the desired range due to uncontrollable aspects of forming the resistive elements onto the substrate.

In addition, the cost of fabricating embedded resistors is lower than the cost of separately fabricating and then surface mounting surface mount resistors.

A significant problem with the use of embedded passive elements is that the electrical characteristics of the deposited or etched elements are difficult to control and predict because of variables in the fabrication process.

For many applications, it has not been possible to fabricate embedded elements with sufficient accuracy due to these limitations.

This has limited the use of embedded passive printed circuit boards in many critical performance systems.

The majority of the problems associated with embedding resistors within layers of a PCB panel relate to the typical materials used for the resistor elements, the substrate or mounting material, and any surrounding materials proximate to the resistor such as a dielectric layer laminated or coated on top of the resistor.

Thickness and composition of the resistive layer are susceptible to variation due to difficulty in control of the process parameters used to deposit the film.

During these cycles, one or more pastes will have more than one curing cycle, making the prediction of final resistance values for these resistors quite complex.

Furthermore, the low temperature and short time used for the curing process result in a cured paste that is softer and less temperature stable than its high temperature counterpart.

This profile may result from the screen printing process and melting during curing.

Furthermore, these substrates will typically be printed circuit boards that are flexible, affected by changes in temperature and prone to distortion in lamination or other thermal cycling steps.

The epoxy material is prone to softening and creep at elevated temperatures, resulting in distortion of the panel.

The epoxy material is also prone to moisture absorption, changing its thermal and electrical characteristics.

In turn, resistors located on this core material are thus susceptible to stresses caused by flexing and dimensional changes in the substrate, thermal cycling, and moisture absorption, among other factors.

Each of these factors can also affect resistance value drifts during other steps of panel production.

Therefore, through all of the process steps involved in the fabrication of a finished PCB panel, there results a change, or drift, in the resistor value.

It is known that the drift of resistance values for embedded resistors in PCB panels is larger in magnitude and less predictable than the drift that is conventionally associated with chip resistor or hybrid circuit manufacture, due to many factors including those described above.

As has been described above, there may exist several contributors to drift subsequent to trimming and up to final completion of the PCB panel, some not previously known in conventional chip resistor and hybrid circuit manufacture, and these effects may not be consistent for all resistive circuit elements associated with a PCB panel.

The ability, then, to achieve narrow final resistor tolerances is thus not assured, compared to conventional chip resistor and hybrid circuit manufacture.

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