The invention provides a non-palladium activation copper plating process. The process comprises the following steps of S1, removing oil; S2, coarsening, coarsening a workpiece by adopting a coarseningsolution, and then carrying out ultrasonic washing; S3, sensitizing, putting the washed workpiece into a sensitizer to be sensitized, wherein the sensitizer is prepared from the following componentsof, in concentration ratio, 5-100g/L of tin methanesulfonate, 1-50g/L of tartaric acid, 1-10g/L of ascorbic acid, 5-50g/L of citric acid, 1-20g/L of 2, 4-aminopyridine, 1-10ml/L of an amino silane coupling agent and 1-10ml/L of a surfactant; S4, activating, putting the sensitized workpiece into an activating agent to be activated, wherein the activating agent is prepared from the following components of, in concentration ratio, 1-20g/L of silver nitrate, 1-50ml/L of ammonia water, 1-50g/L of EDTA, 1-20ml/L of triethanolamine, 0.5-5g/L of 2, 4-aminopyridine and 0.1-10ml/L of phosphate surfactant; S5, pre-coppering; and S6, thickening-copper. The invention provides the non-palladium activated copper plating process, the sensitizer and the activating agent thereof which is low in production cost, good in plating bonding force, green and environment-friendly.