Non-palladium activation copper plating process and sensitizer and activator thereof

Abstract

The invention provides a non-palladium activation copper plating process. The process comprises the following steps of S1, removing oil; S2, coarsening, coarsening a workpiece by adopting a coarseningsolution, and then carrying out ultrasonic washing; S3, sensitizing, putting the washed workpiece into a sensitizer to be sensitized, wherein the sensitizer is prepared from the following componentsof, in concentration ratio, 5-100g/L of tin methanesulfonate, 1-50g/L of tartaric acid, 1-10g/L of ascorbic acid, 5-50g/L of citric acid, 1-20g/L of 2, 4-aminopyridine, 1-10ml/L of an amino silane coupling agent and 1-10ml/L of a surfactant; S4, activating, putting the sensitized workpiece into an activating agent to be activated, wherein the activating agent is prepared from the following components of, in concentration ratio, 1-20g/L of silver nitrate, 1-50ml/L of ammonia water, 1-50g/L of EDTA, 1-20ml/L of triethanolamine, 0.5-5g/L of 2, 4-aminopyridine and 0.1-10ml/L of phosphate surfactant; S5, pre-coppering; and S6, thickening-copper. The invention provides the non-palladium activated copper plating process, the sensitizer and the activating agent thereof which is low in production cost, good in plating bonding force, green and environment-friendly.

Description

technical field [0001] The invention belongs to the technical field of electroless copper plating, and in particular relates to a non-palladium activated copper plating process and a sensitizer and an activator thereof. Background technique [0002] With the rise and rapid development of 5G technology, the 5G mobile phone antenna process is completed by the activation of copper plating nickel plating metallization process after radium engraving lines on the PC mobile phone case. The usual process steps of activated copper plating and nickel plating metallization are: PC material, PPS material or ceramic material is degreased → roughening → ultrasonic → sensitization → activation → trigger copper / nickel → thick copper / nickel process to complete copper plating or nickel plated. This activated copper-plated nickel-plated metallization process can be applied to the production of 5G base station vibrators and ceramic dielectric filters made of PPS materials. [0003] At present...

AI Technical Summary

Problems solved by technology

However, the cost of palladium ions as a raw material remains high, and the operation process using palladium as an activator is difficult to control. Especially for PC 5G mobile phone antennas, the timing of activation and washing is not properly controlled, and it is easy to miss plating and overflow plating