A method for secondary metallization and nickel plating on the surface of high temperature co-fired ceramics

A high-temperature co-fired ceramic and secondary metallization technology, applied in liquid chemical plating, metal material coating process, coating, etc. The effect of enhancing interfacial adhesion and improving corrosion resistance

Active Publication Date: 2017-09-22
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems such as the difficulty of high-quality surface modification in the secondary metallization process of the surface of high-temperature co-fired ceramics, the present invention provides a method for secondary metallization and nickel plating on the surface of high-temperature co-fired ceramics

Method used

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  • A method for secondary metallization and nickel plating on the surface of high temperature co-fired ceramics
  • A method for secondary metallization and nickel plating on the surface of high temperature co-fired ceramics
  • A method for secondary metallization and nickel plating on the surface of high temperature co-fired ceramics

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] The specific technical solutions are as follows:

[0037] (1) Alkaline degreasing

[0038] Soak the tungsten conductor test piece of the high temperature co-fired ceramic primary metallization in the degreasing solution at a temperature of 75 ℃ for 2 minutes, take it out and rinse it with water to obtain the degreasing test piece. The degreasing solution is composed of sodium hydroxide 85 g / L, sodium hydrogen phosphate 13 g / L, sodium bicarbonate 12 g / L, 1 g / L surfactant and deionized water, wherein the surfactant is 0.2 g / L sodium dioctyl sulfosuccinate, 0.8 g / L sodium glycocholate.

[0039] (2) Etching leveling

[0040]At room temperature, immerse the degreased test piece in the acid activation solution for 75 seconds, while slightly stirring the acid activation solution, take it out and rinse it with water to obtain an acid activation test piece; the acid activation solution consists of 24 mL / L mass percent 37.5 % concentrated hydrochloric acid, 15 mL / L hydrofluori...

Embodiment 2

[0055] The specific technical solutions are as follows:

[0056] (1) Alkaline degreasing

[0057] Soak the tungsten conductor test piece of the high temperature co-fired ceramic primary metallization in the degreasing solution at a temperature of 62 ℃ for 3.5 minutes, take it out and rinse it with water, and obtain the degreasing test piece. Wherein the degreasing solution is composed of 73 g / L sodium hydroxide, 14.5 g / L sodium hydrogen phosphate, 13.8 g / L sodium bicarbonate, 2.5 g / L surfactant and deionized water, wherein the surfactant It is 1.2 g / L sodium glycocholate and 1.3 g / L sodium dodecylsulfonate.

[0058] (2) Etching leveling

[0059] At room temperature, immerse the degreased test piece in the acid-activated solution for 60 seconds, while slightly stirring the acid-activated solution, take it out and rinse it with water to obtain an acid-activated test piece.

[0060] The acid activation solution was composed of 27.8 mL / L mass percentage of 37.5% concentrated hy...

Embodiment 3

[0074] The specific technical solutions are as follows:

[0075] (1) Alkaline degreasing

[0076] Soak a tungsten conductor test piece of high temperature co-fired ceramic primary metallization in a degreasing solution at a temperature of 70°C for 5 minutes, take it out and rinse it with water to obtain a degreasing test piece.

[0077] Wherein the degreasing solution is composed of sodium hydroxide 66 g / L, sodium hydrogen phosphate 17 g / L, sodium bicarbonate 15 g / L, 5 g / L surfactant and deionized water, wherein the surfactant It is 2 g / L sodium dodecyl sulfonate and 3 g / L sodium stearate.

[0078] (2) Etching leveling

[0079] At room temperature, immerse the degreased test piece in the acid-activated solution for 45 seconds, while stirring the acid-activated solution slightly, take it out and rinse it with water to obtain an acid-activated test piece.

[0080] The acid activation solution is composed of 32 mL / L mass percentage of 37.5% concentrated hydrochloric acid, 18 m...

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Abstract

The invention relates to a nickel-plating method for the surface of a high-temperature co-fired ceramic tungsten metallized conductor layer. The specific operation steps are as follows: Alkaline degreasing, acid micro-etching, sensitization activation, electroless copper plating, surface adjustment treatment, alkaline electroless nickel plating on the tungsten conductor material of primary metallization of high temperature co-fired ceramics. A nickel material layer with a thickness of 2 to 3 μm is formed on the surface of the tungsten conductor of the primary metallization of high temperature co-fired ceramics. The strong oxidizing property of the acid is used to slightly corrode the surface of the tungsten metallized conductor layer to achieve microcosmic roughening and hydrophilic effect. The one-step method of sensitization and activation is used to form a palladium salt center with catalytic activity on the surface of the material; the surface adjustment treatment is used to form a good solid solution diffusion between the acidic chemical nickel coating and the substrate, and the interface bonding force is enhanced; the two-step copper plating is used The method of combining nickel to form a multi-layer metal layer can enhance the adhesion between the coatings on the surface of the material, release the stress of the coating, and the obtained coating has good appearance quality and excellent solderability.

Description

technical field [0001] The invention belongs to the technical field of surface treatment of ceramic materials, and in particular relates to an electroless nickel plating method for secondary metallization on the surface of high-temperature co-fired ceramics. Background technique [0002] High-temperature co-fired ceramics have excellent properties such as high strength, high wear resistance, high insulation, low expansion coefficient, and isotropy, and are widely used in the fields of microelectronics industry and aerospace. Primary metallization refers to coating the ceramic surface with a coating composed of refractory metal powder such as tungsten and additive oxide powder, and then sintering the coating in a reducing atmosphere. Generally speaking, the tungsten layer after primary metallization cannot For direct use, it needs to be plated with conductive metal nickel, gold plating, etc. to improve the conductivity and provide a weldable surface; the process of plating ni...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/18C23C18/34C23C18/40
Inventor 邱颖霞刘东光闵志先胡江华张孔
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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