Equipment and technology of dual-cathode plasma deposition nano-coating on diamond surface

Abstract

The invention discloses equipment for preparing a nano coating on the surface of diamond by means of double-cathode plasma sputtering deposition, and a preparation process of the equipment. The equipment comprises a vacuum chamber, a double-cathode structure, a target device, a material disc, an oscillator, a gas inlet and a gas outlet, wherein the double-cathode structure comprises two anodes and two cathodes, wherein one of the cathodes is connected with the target device, and the other cathode is connected with the material disc. A coating is formed on the surface of the diamond through target metal by adopting the double-cathode plasma sputtering deposition means, by adjusting the voltages of a target and the material disc and the distance between the target and the diamond in the material disc, and by controlling the deposition time and the temperature. Due to the double-cathode plasma sputtering deposition means, the prepared coating and the diamond have good bonding force.

Description

technical field [0001] The invention relates to the technical field of diamond surface treatment, in particular to equipment for preparing a nano-coating on a diamond surface by means of double-cathode plasma sputtering deposition and a preparation process thereof. Background technique [0002] The high hardness, high wear resistance, high compressive strength and excellent thermal conductivity of diamond make it widely used in the field of metal and hard and brittle materials processing tools and abrasive tools. Such as diamond saw blades, grinding wheels, grinding heads, etc. At present, the most widely used diamond tool is a diamond tool sintered with metal powder, which is made by mixing and sintering diamond and metal powder as a binder. Due to the high interface energy between diamond and general metals or alloys, the surface of diamond cannot be infiltrated by general metals or alloys, and diamonds are easy to graphitize and oxidize at high temperatures, so it is dif...

AI Technical Summary

Problems solved by technology

[0005] (1) Electroless plating of Ni, Co, and Cu on the surface of diamond is not suitable for metal bond tools. Even products plated with Ni-W and Co-W alloys cannot be used for metal bond tools. The reason is that Ni and Co are graphitized Elements that cannot be metallurgically bonded

[0006] (2) Ordinary physical vapor deposition includes thermal evaporation plating, magnetron sputtering plating, ion plating, etc. The process is complex and the amount of single plating is small. The coating and the diamond are only physically attached, and no carbide is formed with the diamond surface. In the short time of hot pressing in tool manufacturing, it is difficult to bond large areas of compounds, so the effect of use is not obvious

[0007] (3) In the chemical vapor deposition (CVD) and salt bath plating process, the diamond is heated to over 850°C during the plating process. Under high vacuum conditions, the strength of the diamond decreases significantly, losing its industrial application value

[0008] (4) The currently widely used vacuum micro-evaporation plating technology also requires a higher deposition temperature, and the types of plating are limited (only limited to Ti plating), and the raw materials used contain certain toxic elements such as titanium trichloride, which is easily polluted environment

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