Circulating tin plating process and device

Abstract

The invention relates to the technical field of tin plating of copper wires, in particular to a circulating tin plating process and device. The circulating tin plating process comprises the following steps of: setting speed and stabilizing speed and tension in a tension buffer area; annealing in a high-temperature annealing area at high temperature; initially cooling in an annealing and cooling area; pre-plating tin in an inlet tin heating area; finally plating tin in an outlet tin heating area; scraping residual tin by using a tin plating mold for sizing; protecting reducing gas to deoxidize liquid tin and protecting a wire rod from being oxidized; cooling a hot plated tin wire with water; scraping water on the tin-plated wire with rubber; scraping water and possible tin beads by using a mold; drying residual water by using a drier; cooling the tin-plated wire to room temperature by using a cooling wind scoop; and rolling into a finished product, and the like. By adopting the circulating tin plating process, the product quality of the tin-plated wire is ensured, use of a soldering flux causing pollution can be avoided, noble rare earth metals are avoided or reduced, a large amount of electric energy is saved, waste of tin dross is reduced, operation is simplified and concealed danger of quality is reduced.

Description

technical field [0001] The invention relates to the technical field of copper wire tinning, in particular to a circulating tinning process and device. Background technique [0002] Tinned wire is widely used in industry, so tinned wire production occupies a large proportion in wire production. The traditional production process of tinned copper wire is: 1) first anneal the copper wire at high temperature in the furnace tube of the annealing furnace; After the copper wire is inclined downward, apply flux on the copper wire with a cloth soaked in flux; 4) Then enter the tin pot, and the copper wire changes from downward to upward at the tin fork near the bottom of the tin pot; 5 ) After the copper wire leaves the tin surface, before it is cooled and solidified, immediately scrape off the excess tin through the tin plating mold to make the tin plating thickness meet the requirements; 6) After a certain distance of air cooling, it enters the traction wheel; 7) After coating Gu...

AI Technical Summary

Problems solved by technology

The above process leads to the following problems: 1) Commonly used fluxes contain highly corrosive inorganic acids, which produce a lot of acidic fumes when coated on wires and enter the tin pot, which brings great pollution to the workshop environment and atmospheric environment; 2 ) When the flux-coated wire enters the tin pot, the flux and water will be brought into the liquid tin, the water will react with the liquid tin to form tin oxide, and the flux will react with the liquid tin to form tin chloride, etc., resulting in pollution and waste of liquid tin ;3) If a large amount of water is brought into the liquid tin, it will explode when it vaporizes rapidly, splashing the liquid tin out of the tin pot, often causing accidents such as scalding; 4) After the wire enters the liquid tin, it needs to turn at the tin fork, The friction between the tin fork increases the traction tension of the wire, which makes the wire easy to be broken, which seriously limits the production speed of the tinning line; 5) After the wire is annealed, it is cooled before entering the tin pot, and there is secondary heating process, and the large area of ​​liquid tin surface is in contact with air to dissipate heat, so the energy consumption is relatively large

However, if the temperature of the copper wire entering the liquid tin is lower than the temperature of the liquid tin, domestic enterprises may have this problem during the test, so that the temperature of the liquid tin in the tube is lowered and lower than the temperature of the liquid tin in the pot, then the temperature of the liquid tin in the pot reaches Saturated dissolved oxygen will precipitate and form oxygen bubbles

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