316results about How to "Reduce heating effect" patented technology

The invention discloses a method for preparing a hollow steel ingot for a protection ring of a large power generator by adopting electroslag remelting. The method comprises the following steps: (1) preparing consumable electrode groups; (2) melting slag into liquid molten slag; (3) inserting the consumable electrode groups into an electroslag remelting hollow ingot crystallizer; (4) starting two transformers; (5) injecting the liquid molten slag into the electroslag remelting hollow ingot crystallizer; (6) when the consumable electrode groups are in contact with the liquid molten slag, forming an electrifying loop among fake electrodes, the consumable electrode groups and a bottom water tank; (7) when the liquid molten slag is in contact with an upper section, forming a loop among the upper section, the bottom water tank and the transformers connected with the bottom water tank; (8) adjusting the output currents and voltages of the two transformers; (9) when a metal melt is in contact with a molten steel liquid level detection device, starting an ingot stripping device for ingot stripping; (10) exchanging the consumable electrode groups; and (11) inserting subsequent consumable electrode groups into the liquid molten slag, and repeating the steps (8 to 10) until the ingot stripping is finished.

The invention discloses a magnesium alloy sheet with low Gd content and high ductility and malleability, and a hot rolling technology thereof, belonging to the technical field of metal materials. The magnesium alloy sheet comprises chemical compositions in percentage by weight: 0.9-2.1% of zinc, 0.2-0.8% of rare earth Gd, 0-0.9% of manganese, and the balance of magnesium. The rare earth Gd element is added in the magnesium alloy sheet, so that the cost of the alloy can be lowered, the magnesium alloy has excellent rolling property, and continuous multi-pass large-deformation rolling can be realized; the rolled sheet can be ensured to have non-basal plane texture and high room-temperature elongation, the room-temperature elongation can achieve 35-50%, wherein the elongation delta along the rolling direction is more than or equal to 35%, and the elongation in horizontal direction is more than or equal to 45%.

The invention discloses an automatic film coating device comprising a machine body, a support frame, a substrate, a rotation device and a turnover device; wherein, the rotation device comprises a first driving device and a first transmission shaft connected with the first driving device; the turnover device comprises a second driving device and a second transmission shaft connected with the second driving device; the first driving device and the second driving device are adjacently fixed on the top of the machine body, and the first transmission shaft and the second transmission shaft are mutually parallel; one end of the support frame is rotatablely connected to the machine body, and the substrate is rotatablely connected to the support frame; the first driving device drives the first transmission shaft so as to drive the support frame to rotate horizontally, and the second driving device drives the second transmission shaft so as to drive the substrate to rotate vertically. The automatic film coating device of the invention can ensure that when one surface of a base wafer to be coated on the substrate finishes coating films, the other surface can perform film coating after automatic turnover without lowering temperature and breaking vacuum.

The invention relating to a vacuum plating device, which contains a vacuum chamber, a rotation supporting assembly, a substrate support lying in vacuum chamber and containing a few substrates and also connected to rotation supporting assembly, and a deposition source lying in the vacuum chamber and opposite the substrate support, further contains a turning device lying in the vacuum chamber and connected to substrate support, and a turning control device out of the vacuum chamber, with the turning device and turning control device, several substrates rotating horizontally in the vacuum chamber. With the invented plating device, no need of cooling and breaking vacuum after one surface of the substrate is coated, the heat-up and pump-down times decrease.

The invention discloses a protective film for chip cutting. The protective film sequentially comprises a releasing layer, a substrate layer and an adhesive layer, wherein the substrate layer is made of modified PO (propylene epoxide) material; the modified PO material is prepared by copolymerizing PP (polypropylene) and PE (polyethylene); the modified PO material is prepared from the following components in parts by weight: 50 to 70 parts of PP, 20 to 40 parts of PE, and 5 to 10 parts of talcum powder. The protective film has the characteristics that the substrate layer adopts the modified POmaterial, so that the mechanical strength is high, the halogen is avoided, and the environment-friendly requirement is met; the heat-resistant property is better, and the certain high-temperature operation requirement is met; the plasticizer is not contained, so that the risk of micromolecule segregation is avoided for the material; the material strength is high, the ductility is good, the uniformshrinkage rate in each direction is maintained under the condition of 140% of elongation rate, and the uniform strength in each direction is realized at the premises of certain elongation rate; the adhesive layer uses pressure-sensitive adhesive to replace the photo-sensitive adhesive and thermo-sensitive adhesive, the transparency degree is high, the weather-resistant property is high, TG is about -20 DEG C, and the procedures are simple (no UV (ultraviolet) furnace passing or reheating procedure); by performing simple laminating and separating, the product application requirement can be met, the change of viscosity duration is small and is less than 20%, and the residual adhesive is avoided.