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Room-temperature cured high-temperature-resistant epoxy resin plugging material and preparation method thereof

An epoxy resin, room temperature curing technology, applied in the direction of epoxy resin glue, adhesive type, adhesive, etc., can solve the problems of high brittleness and poor temperature resistance of epoxy resin plugging materials, and achieve strong operability, Effect of short curing time and cost reduction

Inactive Publication Date: 2015-06-24
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved in the present invention is to overcome the problems of high brittleness and poor temperature resistance of epoxy resin plugging materials, and provide a polyurethane prepolymer modified epoxy resin plugging material prepared with polyether polyol and isocyanate , can be cured at room temperature and can obtain good heat resistance, and its decomposition temperature is as high as 275°C

Method used

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  • Room-temperature cured high-temperature-resistant epoxy resin plugging material and preparation method thereof
  • Room-temperature cured high-temperature-resistant epoxy resin plugging material and preparation method thereof
  • Room-temperature cured high-temperature-resistant epoxy resin plugging material and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The composition and content of room temperature curing and high temperature resistant epoxy resin plugging materials are shown in Table 1.

[0028] Table 1

[0029]

[0030] The method of preparation and use is as follows:

[0031] 1) Preparation of component A: Add the components of component A into the reaction kettle according to the weight ratio shown in the above table, and stir evenly to obtain component A.

[0032] 2) Preparation of modifier: Dehydrate polyether polyol (PPG-2000) under vacuum for 3 hours, then add MDI, the molar ratio of polyether polyol to MDI is 1.4:1, and under the protection of nitrogen at 70°C Stir for 4h. The system was left at room temperature to cool down to obtain a modifier.

[0033] 3) Preparation of component B: Add 810 curing agent and accelerator in another reaction kettle according to the weight ratio shown in Table 1, and finally add the modifier prepared in step 2) in this embodiment, and stir evenly, that is Get the B com...

Embodiment 2

[0037] The composition and content of room temperature curing and high temperature resistant epoxy resin plugging materials are shown in Table 2.

[0038] Table 2

[0039]

[0040] The method of preparation and use is as follows:

[0041] 1) Preparation of component A: Add the components of component A into the reaction kettle according to the weight ratio shown in the above table, and stir evenly to obtain component A.

[0042] 2) Preparation of modifier: Dehydrate polyether polyol (PPG-2000) under vacuum for 3 hours, then add IPDI, the molar ratio of polyether polyol to IPDI is 1.6:1, and store at 80°C under nitrogen protection Stir for 4h. The system was left at room temperature to cool down to obtain a modifier.

[0043] 3) Preparation of component B: Add 810 curing agent and accelerator in another reaction kettle according to the weight ratio shown in Table 2, and finally add the modifying agent prepared in step 2) in this embodiment, after stirring evenly, that is ...

Embodiment 3

[0046] The composition and content of room temperature curing and high temperature resistant epoxy resin plugging materials are shown in Table 3.

[0047] table 3

[0048]

[0049] The method of preparation and use is as follows:

[0050] 1) Preparation of component A: Add the components of component A into the reaction kettle according to the weight ratio shown in the above table, and stir evenly to obtain component A.

[0051]2) Preparation of modifier: Dehydrate polyether polyol (PPG-2000) under vacuum for 3 hours, then add TDI, the molar ratio of polyether polyol to TDI is 1.3:1, and under the protection of nitrogen at 100°C Stir for 4h. The system was left at room temperature to cool down to obtain a modifier.

[0052] 3) Preparation of component B: Add 810 curing agent and accelerator in another reaction kettle according to the weight ratio shown in Table 3, and finally add the modifier prepared in step 2) in this embodiment, and stir evenly, that is Get the B com...

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Abstract

The invention discloses a room-temperature cured high-temperature-resistant epoxy resin plugging material and a preparation method thereof, and belongs to the technical field of material preparation. The plugging material is composed of a part A and a part B, wherein the part A comprises epoxy resin, a diluent, a coupling agent, and packing; the part B comprises a curing agent, an accelerant, and a modifying agent, and the modifying agent is a polyurethane prepolymer prepared by reacting isocyanate with polyether polyol. The preparation method comprises the following steps: uniformly mixing the epoxy resin with the reactive diluent and the coupling agent so as to obtain the part A; uniformly mixing the curing agent with the compound accelerant, adding the modifying agent, and uniformly stirring, so that the part B is obtained; and when in use, pouting the part B into the part A, uniformly mixing at room temperature, and curing the obtained product to plug a position required to be plugged. The plugging material prepared according to the invention is simple in preparation process, strong in operability, wide in application, good in shearing property and high in tensile strength at high temperature, short in curing time at room temperature, and good in extensibility and toughness, and the maximum thermal decomposition temperature can reach 275 DEG C.

Description

technical field [0001] The invention belongs to the technical field of material preparation, and in particular relates to a preparation method of a room-temperature-cured high-temperature-resistant plugging material. Background technique [0002] The in-situ exploitation of oil shale is the same as that of crude oil, in addition to water blocking, well cementing and high-temperature exploitation are also required. This puts forward higher requirements on the performance of water blocking and cementing materials, that is, it needs to be cured at room temperature or at a lower temperature, and has good heat resistance. [0003] Epoxy resin is a kind of thermosetting resin including many types, such as glycidyl amine, glycidyl ester and aliphatic cyclophatic epoxy resin, etc. It has excellent chemical stability, corrosion resistance, electrical insulation and low shrinkage, Easy processing and molding advantages. Therefore, the epoxy resin adhesive compounded by it has good b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J175/08C08G18/76C08G18/75C08G18/48
Inventor 张玉敏邓永砚顾强陈晓东赵天琦王洪艳
Owner JILIN UNIV
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