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An electronic device casing and a manufacture method thereof

A technology of electronic devices and manufacturing methods, which is applied in lamination devices, chemical instruments and methods, electrical equipment shells/cabinets/drawers, etc., can solve the problem of poor wear resistance and hardness, and the aesthetics of metal shells is not as good as before, Problems such as dullness of the metal shell

Inactive Publication Date: 2012-10-10
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, after the metal shell is used for a long time, due to the poor wear resistance and hardness of the surface, the surface of the metal shell will become dull due to scratches, and it is easy to produce dents to make the surface uneven. The aesthetics of the metal shell caused by the traces of use is not as good as before. The aesthetics and durability of the above-mentioned shells obviously need to be developed and improved.

Method used

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  • An electronic device casing and a manufacture method thereof
  • An electronic device casing and a manufacture method thereof
  • An electronic device casing and a manufacture method thereof

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Embodiment Construction

[0017] The electronic device casing and the manufacturing method thereof of the present invention will be further described in detail with reference to the accompanying drawings and embodiments.

[0018] see figure 1 , the housing 10 of the electronic device according to the embodiment of the present invention includes a base layer 20 , a bonding layer 30 and a protective layer 40 , and the bonding layer 30 is disposed between the base layer 20 and the protective layer 40 . In this embodiment, the electronic device casing 10 is a back cover of a mobile phone.

[0019] see figure 2 and image 3 , the base layer 20 is used to cover the electronic components so as not to be exposed. In this embodiment, the base layer 20 can be made of metal materials such as stainless steel and aluminum alloy, and can be subjected to surface treatments such as polishing, etching, and electroplating. The base layer 20 is provided with a through hole 21 for accommodating the camera module.

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Abstract

An electronic device casing is disclosed, comprising a base layer, a bonding layer and a protective layer, wherein the bonding layer is arranged on the base layer, the protective layer is arranged on the bonding layer, and the bonding layer is arranged between the base layer and the protective layer. Since the protective layer of the electronic device casing covers beyond the base layer, the base layer can still maintain a bright and smooth metallic luster after long-time of service, and be free from tarnishes and dents due to scratches. Therefore the appearance and endurance of the electronic device casing are greatly enhanced to make sure the casing is always as good as new. The invention also provides a manufacture method of the casing.

Description

technical field [0001] The invention relates to an electronic device casing and a manufacturing method thereof. Background technique [0002] The casings of general consumer electronic products such as mobile phones or tablet computers are mostly made of injection-molded plastic materials, and then the exterior surface is painted by spraying paint to achieve the decorative purpose of beautifying the casing. The traditional spray gun uses high-speed air to atomize the paint, and the paint is atomized from a liquid into a fine particle-like paint mist, which is then sprayed out from the nozzle of the spray gun. Because the airflow generated by the high-speed air is too strong, the spray gun cannot be too close to the workpiece, otherwise the paint that has been sprayed and attached to the surface of the workpiece will be blown away by the airflow generated by the high-speed air, resulting in uneven runny nose. Therefore, the spray gun needs to maintain a certain distance and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/00H04M1/02B32B37/02B32B38/16
Inventor 徐牧基傅绍明
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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