Barrier Film For Flexible Copper Substrate And Sputtering Target For Forming Barrier Film

Abstract

Provided are a barrier film for a flexible copper substrate comprising a Co—Cr alloy film containing 5 to 30 wt % of Cr and a balance of unavoidable impurities and Co, having a film thickness of 3 to 150 nm, and film thickness uniformity of 10% or less at 1σ; and a sputtering target for forming a barrier film comprising a Co—Cr alloy containing 5 to 30 wt % of Cr and a balance of unavoidable impurities and Co, wherein the relative magnetic permeability in the in-plane direction of the sputtered face is 100 or less. The barrier film for a flexible copper substrate and the sputtering target for forming such barrier film have a film thickness that is thin enough to prevent film peeling in inhibiting the diffusion of copper to a resin film such as polyimide, is capable of obtaining a sufficient barrier effect even in a minute wiring pitch, and have barrier characteristics that will not change even when the temperature rises due to heat treatment or the like.

Description

TECHNICAL FIELD [0001] The present invention relates to a barrier film for a flexible copper substrate and a sputtering target for forming such barrier film capable of effectively inhibiting the diffusion of copper to a resin film such as polyimide. BACKGROUND ART [0002] Conventionally, a copper layer is formed on a resin film such as polyimide, which is to become the base film, upon manufacturing a flexible copper substrate, Specifically, a copper seed layer is formed on the polyimide film by sputtering or electroless deposition, and a thick copper plated layer is formed thereon. Thereafter, the copper is subject to etching so as to form a copper circuit pattern. [0003] The problem here is that the copper formed on the polyimide film easily diffuses (migrates) in the polyimide film, and causes a short circuit in the wiring on the circuit board. [0004] In order to inhibit this kind of diffusion of Cu to the polyimide film, proposed is a method of forming in advance a barrier layer f...

AI Technical Summary

Benefits of technology

[0010] In light of the foregoing problems of conventional technology, an object of the present invention is to obtain a barrier film for a flexible copper substrate and a sputtering target for forming such barrier film. The barrier film for a flexible copper substrate can inhibit the diffusion of copper to a resin film such as polyimide. Further, the film thickness is thin enough to prevent film peeling, and is capable of obtaining a sufficient barrier effect even in a minute wiring pitch. Moreover, the barrier characteristics will not change even when the temperature rises due to heat treatment or the like.

[0011] As a result of intense study, the present inventors discovered that the foregoing problems can be overcome by using an alloy having effective barrier characteristics, forming the barrier film as thin as possible in order to prevent peeling, and improving the uniformity of the deposited film.

[0015] The barrier film for a flexible copper substrate of the present invention yields superior effects in that it has a film thickness that is thin enough to prevent film peeling, is capable of obtaining a sufficient barrier effect even in a minute wiring pitch, and has barrier characteristics that will not change even when the temperature rises due to heat treatment or the like. The present invention yields significant characteristics in that it is capable of effectively inhibiting the diffusion of copper to a resin film such as polyimide.

Problems solved by technology

The problem here is that the copper formed on the polyimide film easily diffuses (migrates) in the polyimide film, and causes a short circuit in the wiring on the circuit board.

In addition, when the wiring pitch becomes narrower than 30 μm, it is not possible to prevent diffusion to the polyimide layer with a conventional barrier layer, and it has become known that this is not necessarily effective.

Nevertheless, when the thickness exceeds a certain value, another problem occurs in that the barrier film would peel from the polyimide film.

Therefore, this method was insufficient to become a fundamental solution.

Nevertheless, in this case, since the foregoing method does not fundamentally solve the diffusion of the barrier metal, this problem still needs to be solved.

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