The invention belongs to the field of
chip heat dissipation, and particularly relates to a piezoelectric falling film circulation heat dissipation device which comprises a
closed cavity, a heat removal face is arranged on the outer side of the
closed cavity, a falling film
evaporation boiling face, a liquid working medium, a
piezoelectric pump, a liquid top box and a condensation face are arranged on the inner side of the
closed cavity, and the falling film
evaporation boiling face is of a
metal porous structure; the liquid working medium forms a liquid
pool in the closed cavity, the
piezoelectric pump is fixed to the bottom face of the liquid
pool, all of a liquid inlet pipeline and a part of a liquid outlet pipeline of the
piezoelectric pump are immersed in the liquid
pool, the liquid outlet pipeline of the piezoelectric pump is further communicated with a liquid inlet of the liquid top box, and a liquid outlet of the liquid top box is tightly attached to the top of the falling film
evaporation boiling face. And the liquid working medium can uniformly flow to the falling film evaporation boiling surface. According to the invention, the
heat transfer resistance can be reduced, the heat extraction capability is improved, the heat dissipation power is improved by more than 50% compared with that of a traditional radiator under the same volume and weight, and the heat dissipation requirements of high-power and high-power-density chips of a
numerical control system can be met.