The utility model discloses a point pressing die for
wafer temperature measurement point wiring, which belongs to the technical field of
wafer temperature measurement, and structurally comprises a circular ring inner film, a groove is arranged on the circular ring inner film, a wiring groove is arranged at the bottom of the groove, a pressing film is arranged above the wiring groove, and the pressing film is used for pressing a
signal line fixed in the wiring groove; in specific implementation, the
signal line of the
thermocouple is fixed in the wiring groove, then the
signal line is pressed tightly through the pressing film, and the annular inner film is fixed on the
wafer, so that when the signal line is pulled, part of pulling force can be differentiated to the annular inner film and then to the wafer, and the situation that the force is concentrated at the joint of the
thermocouple and the signal line is avoided; the mold can also standardize wiring of
signal lines of the thermocouples and avoid winding disorder of the
signal lines, in addition, the sizes of fixed glue points for fixing the thermocouples can be consistent through the mold, pressure is applied to the fixed glue of temperature measuring points through the mold, glue bubbles are discharged, the density of the glue is consistent, and therefore heat conduction consistency is achieved.