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Diaphragm pump and cooling system with the diaphragm pump

a diaphragm pump and diaphragm technology, which is applied in the direction of machines/engines, flexible member pumps, and positive displacement liquid engines, etc., can solve the problems of increasing the power consumption of electronic parts such as cpu, and reducing the flow rate of liquid through the flow passage. , to achieve the effect of increasing the pump efficiency, reducing the thickness, and increasing the cooling efficiency

Inactive Publication Date: 2007-03-22
NEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0010] The present invention has its object to provide a diaphragm pump that enables an increase in pump efficiency by reducing the pressure loss of liquid and that enables reduction in thickness. Also, the present invention has its object to provide a cooling system that enables an increase in cooling efficiency by being provided with the diaphragm pump.

Problems solved by technology

As the performance of electronic equipment becomes higher and processing speed is enhanced, power consumption for electronic parts such as CPU increases.
In this way, when the flow of the liquid is changed rapidly, the pressure of the liquid is largely lost.
As a result, the amount of flow of the liquid passing through the flow passage is reduced, and therefore the pump efficiency is decreased.

Method used

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  • Diaphragm pump and cooling system with the diaphragm pump
  • Diaphragm pump and cooling system with the diaphragm pump
  • Diaphragm pump and cooling system with the diaphragm pump

Examples

Experimental program
Comparison scheme
Effect test

first embodiment

[0038]FIG. 1 shows schematic views of a cooling system provided with a piezoelectric pump of a first embodiment according to the present invention, FIG. 1(a) is a plan view showing a liquid passage in the cooling system, and FIG. 1(b) is a sectional view along line X-X in FIG. 1(a).

[0039] Cooling system 10 shown in FIG. 1 is a water-cooled cooling apparatus preferably used for providing cooling for electronic equipment, such as a portable personal computer. Cooling system 10 is roughly provided with flow passage unit 60 in which circulation flow passage 60a is formed and piezoelectric pump 1 connected to flow passage unit 60 and is used to circulate liquid in the flow passage. Flow passage unit 60 and piezoelectric pump 1 provide a closed-structure flow passage. Inside the flow passage, liquid to be circulated is filled up.

[0040] In flow passage unit 60, circulation flow passage 60a is formed in a predetermined pattern. There are no particular limitations to the sectional shape of...

second embodiment

[0057] In the first embodiment, the pressure chamber is formed in a rectangular parallelepiped shape, however, the pressure chamber may be formed so that the cross-sectional area of the pressure chamber is gradually varied in order to reduce the resistance of the liquid.

[0058]FIG. 3 shows the piezoelectric pump of the second embodiment according to the present invention. Piezoelectric pump 2 shown in FIG. 3 is formed so that pressure chamber 50′ is formed in a streamlined shape. On peripheral walls of pressure chamber 50′, structural parts (retuning grooves 11a) for accelerating the flow of the liquid are arranged. The other structures are similar those of piezoelectric pump 1 shown in FIG. 2, and the same numeral references are applied to the structural parts having the same functions and explanations thereof are omitted.

[0059] Pressure chamber 50′, as shown in FIG. 3(b), is provided with peripheral wall surface 11e in an approximate streamlined shape viewed from the upper surfac...

third embodiment

[0068] Generally, a closed-structure flow passage in cooling system 10 shown in FIG. 1 is filled up with the liquid so that no bubbles remain. However, for example, there is a case in which dissolved oxygen is changed into bubbles and the bubbles are mixed into the liquid. In a piezoelectric pump, the existence of bubbles inside the flow passage causes a reduction in pump efficiency. Further, the existence of bubbles inside the closed-structure flow passage causes a reduction in cooling efficiency of cooling system 10.

[0069] So, in order to further improve pump efficiency, in addition to the two above-mentioned embodiments, a piezoelectric pump may be provided with means for collecting bubbles mixed in the liquid.

[0070] Respective piezoelectric pumps 3, 3′, 3″ shown in FIG. 7 to FIG. 9 are provided with gaseous chambers 35, 35′, 35″. FIGS. 7(a), 8(a) and 9(a) are lateral section views of piezoelectric pumps 3, 3′, 3″, and FIGS. 7(b), 8(b) and 9(b) are longitudinal section views of...

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Abstract

A diaphragm pump enabling an increase in pump efficiency by reducing the pressure loss of liquid and reduction in thickness. The flow passage in piezoelectric pump (1) includes a pressure chamber (50) formed into a flat shape in cross section and a suction side flow passage (70a) and discharge side flow passage (70b). The suction side flow passage (70a) and the discharge side flow passage (70b) are disposed at both ends of the pressure chamber (50) so that the axes thereof are aligned with each other. The check valves (20a, 20b) are respectively disposed on the suction side flow passage (70a) and the discharge side flow passage (70b), and are tilted relative to the flow direction of the liquid.

Description

TECHNICAL FIELD [0001] The present invention relates to a diaphragm pump used for a cooling system or the like, and in particular, relates to a slim diaphragm pump capable of discharging liquid efficiently. Further, the present invention relates to a cooling system with the diaphragm pump used for cooling electronic equipment or the like. BACKGROUND ART [0002] As the performance of electronic equipment becomes higher and processing speed is enhanced, power consumption for electronic parts such as CPU increases. As a result, the heating value in the electronic parts becomes high, and it is absolutely necessary to have a technology that can efficiently dissipate heat generated from the electronic parts and that remains inside the electronic equipment in terms of ensuring reliable operation of the electronic equipment. [0003] As a cooling technique for a portable personal computer such as a notebook personal computer, instead of an air-cooled cooing system, there is proposed a water-co...

Claims

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Application Information

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IPC IPC(8): F04B17/00F04B43/02F04B43/04
CPCF04B43/046F04B43/02
Inventor YAMAMOTO, MITSURUSASAKI, YASUHIROOCHI, ATSUSHIKITAJO, SAKAE
Owner NEC CORP
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