Method for manufacturing ceramic filled polytetrafluoroethylene glass fiber copper-clad substrate

Abstract

The invention discloses a method for manufacturing a ceramic filled polytetrafluoroethylene glass fiber copper-clad substrate. The method sequentially comprises the following processes of: 1) preparing a polytetrafluoroethylene solution; 2) stirring the prepared polytetrafluoroethylene solution, ceramic powder and a dispersing agent with high-speed stirring equipment to form a solvent; 3) immersing a glass fiber fabric in the solvent to form an impregnated fabric; and 4) sequentially paving a pure polytetrafluoroethylene thin film and the impregnated fabric between copper foil layers, wherein the copper foil layers are connected with the pure polytetrafluoroethylene thin film. According to the method, the ceramic powder, the polytetrafluoroethylene solution and the dispersing agent are mixed and blended together to form common excellent waveguide medium substrates with low dielectric loss and different dielectric constants. The high conductivity of copper foils can be greatly improved through the ceramic filled copper-clad substrate, the copper-clad substrate also has high heat conductivity, and the stripping strength of the substrate can be greatly improved.

Description

technical field [0001] The invention relates to the manufacture of a conductive substrate, in particular to a method for manufacturing a copper-clad substrate using ceramics filled with polytetrafluoroethylene glass fibers. Background technique [0002] Printed circuit boards, or PCB boards, are formed by bonding non-conductive dielectric substrates and copper foils together, and are the most basic materials for electronic products. The substrate used in the PCB board is composed of polytetrafluoroethylene resin and glass fiber. The products of this substrate are widely used, and it is currently the most widely used PCB in the electronics industry. In recent years, with the rapid development of the electronics industry, especially the communication industry, the frequency of applications has become higher and higher, and the influence of the substrate of the PCB used on the electrical properties can no longer be ignored, resulting in more and more products that cannot be use...

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Problems solved by technology

[0003] At present, with the continuous advancement of electronic technology, electronic information products continue to develop in the direction of high frequency and high speed, and traditional substrate materials are gradually replaced by high-speed, high-reliability ceramic substrate materials. Copper substrates are used as conductive substrates for templates. Among them, polytetrafluoroethylene glass fiber has become a commonly used material due to its high temperature resistance of 250 ° C, low temperature resistance of -100 ° C, corrosion resistance, high lubrication, and excellent electrical properties. High dielectric constant and low loss, low pressure and low temperature in the lamination process can be widely used in high-frequency microwave circuits. However, in practical applications, the combination of ordinary substrates and copper foils will cause insufficient strength. In addition, PTFE glass fiber copper clad also has the disadvantages of low dielectric constant and large loss, which affects the use effect

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