Method of drilling a hole through Co2 laser directly

A laser drilling and direct technology, applied in laser welding equipment, removing conductive materials by chemical/electrolytic methods, welding equipment, etc., can solve the problems of poor precision, high cost, consumption of dry film and etching potion, etc., to achieve The effect of improving accuracy, saving consumption, saving process and time
CN1761378AInactive Publication Date: 2006-04-19WUS PRINTED CIRCUIT (KUNSHAN) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
WUS PRINTED CIRCUIT (KUNSHAN) CO LTD
Publication Date
2006-04-19
Estimated Expiration
Not applicable · inactive patent

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Abstract

Drilling method of carbon dioxide laser includes steps: preparing locating point on layer next to the outer layer; before pressfitting added layer, browning oxidizing surface of target bonding pad; after pressfitting added layer, milling location hole / polishing edge, washing surface under high pressure; browning front surface of copper, thinning and coursing the surface before drilling hole by layer; first time to drill hole by laser; positioning film perforation by using plate location hole in original etching method for making window of copper, burning through copper foil and resin above the locating point on layer next to the outer layer so as to expose the locating point; second time to drill hole by laser; using the exposed locating point as position fixing to make micro hole inplate; washing surface under high pressure to remove browning layer after drill hole. The invention saves dry film and etching liquid, and raises process precision.
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Description

technical field

[0001] The invention belongs to the technical field of printed circuit board (PCB) manufacturing, and relates to a method for directly performing laser drilling by using a CO2 (carbon dioxide) laser drilling machine. Background technique

[0002] In the existing manufacturing process of PCB printed circuit boards, if high-density interconnection boards are to be made, it is necessary to laminate the build-up layer on the core board with the circuit already prepared, and then use laser drilling on the build-up layer to match the target pad ( That is, the microholes aligned with the existing circuit layer disc pattern on the core board. The existing laser drilling method usually adopts the traditional etching copper window method (conformal) process, that is, firstly cover the dry film on the board surface, and then use the image transfer method to image the dry film, after exposure, development, etching, etc. , Glue removal and other processes, etch off the c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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