The invention discloses a high-precision circuit board
laser drilling process, and particularly relates to the technical field of circuit board
processing, and the high-precision circuit board
laser drilling process comprises the following steps: step 1, selecting a high-quality base material and a
copper-clad layer, and carrying out pretreatment on the base material, the pretreatment comprises cleaning and deoxidation, and the interaction efficiency of
laser and the material is improved; 2, according to the design requirement of the circuit board, the position needing to be drilled and the aperture size are determined and completed through CAD
software, a drilling
data file is generated, the circuit board to be drilled is fixed to a drilling
machine, and it is guaranteed that the board face is smooth and free of deformation; thirdly, a CO2 laser is selected,
light beam focusing, laser power stability and laser beam uniformity of
laser drilling equipment are optimized, and stability and accuracy of laser are guaranteed. According to the invention, high-precision
laser drilling processing can be realized, the drilling
processing quality of the circuit board can be ensured, the processing defective rate is obviously reduced, the popularization and the use are facilitated, and meanwhile, the method is suitable for a modern production process.