Radiating flexible circuit board and surface coating thereof

A technology for flexible circuit boards and surface coatings, which is applied in the direction of flexible printed circuit boards, epoxy resin coatings, coatings, etc., and can solve the problems of narrow space for flexible circuit boards, lack of heat release, and inability to dissipate heat from components. To achieve the effect of improving heat conduction speed and heat conduction capacity, fast heat conduction speed and long service life

Inactive Publication Date: 2017-05-10
安徽鹏展电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In practical applications, due to the narrow use space of the flexible circuit board, its heat conduction effect is slow, the heat cannot be releas

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] A heat dissipation flexible circuit board proposed by the present invention includes a flexible insulating base layer, a conductive circuit layer, and a heat dissipation coating; the conductive circuit layer is located in the middle of the flexible insulating base layer and the heat dissipation coating, and the flexible insulating base layer and the conductive circuit layer pass through It is formed by coating the adhesive and pressing it; the heat dissipation coating is obtained by coating and curing the surface coating; the flexible insulating base layer is a polyimide soft board with a thickness of 0.22mm; the conductive circuit layer is a calendered aluminum foil with a thickness of 0.08mm mm; the thickness of the heat dissipation coating is 0.15mm.

[0016] A surface coating for a heat-dissipating flexible circuit board, characterized in that it comprises the following raw materials in parts by weight: 40 parts of acrylic resin, 15 parts of epoxy resin, 5 parts of g...

Embodiment 2

[0018] A heat dissipation flexible circuit board proposed by the present invention includes a flexible insulating base layer, a conductive circuit layer, and a heat dissipation coating; the conductive circuit layer is located in the middle of the flexible insulating base layer and the heat dissipation coating, and the flexible insulating base layer and the conductive circuit layer pass through It is formed by applying adhesive and then pressing; the heat dissipation coating is obtained by coating and curing the surface coating; the flexible insulating base layer is polyethylene terephthalate soft board, and its thickness is 0.12mm; the conductive circuit layer is rolled copper In the foil, its thickness is 0.1mm; the thickness of the heat dissipation coating is 0.18mm.

[0019] A surface coating for a heat-dissipating flexible circuit board, characterized in that it comprises the following raw materials in parts by weight: 35 parts of acrylic resin, 20 parts of epoxy resin, 3 p...

Embodiment 3

[0021] A heat dissipation flexible circuit board proposed by the present invention includes a flexible insulating base layer, a conductive circuit layer, and a heat dissipation coating; the conductive circuit layer is located in the middle of the flexible insulating base layer and the heat dissipation coating, and the flexible insulating base layer and the conductive circuit layer pass through It is made by coating adhesive and then pressing; the heat dissipation coating is obtained by coating and curing the surface coating; the flexible insulating base layer is polyvinyl chloride soft board, and its thickness is 0.15mm; the conductive circuit layer is rolled copper foil, and its thickness is 0.1mm mm; the thickness of the heat dissipation coating is 0.12mm.

[0022] A surface coating for a heat-dissipating flexible circuit board, characterized in that it comprises the following raw materials in parts by weight: 45 parts of acrylic resin, 10 parts of epoxy resin, 6 parts of gla...

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Abstract

The invention discloses a radiating flexible circuit board. The radiating flexible circuit board comprises a flexible insulating base layer, a conductive circuit layer and a radiating coating; the conductive circuit layer is located between the flexible insulating base layer and the radiating coating, and the flexible insulating base layer and the conductive circuit layer are bonded in a pressing manner after an adhesive is coated; the radiating coating is formed by curing the coated surface coating; and the surface coating is formed by mixing acrylic resin, epoxy resin, glass fibers, a heat-conducting filling, sodium dodecyl benzene sulfonate, a curing agent and a solvent at a high temperature of 88-105 DEG C. The radiating flexible circuit board provided by the invention solves the problem of local overheating caused by small used space of the existing flexible circuit board as the radiating coating is added on the surface of the conductive circuit layer, improves the heat radiation performance of the circuit board while the circuit board is efficiently protected against external impact damage, and is steady in performance, long in service life and wide in application foreground.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a heat-dissipating flexible circuit board and its surface coating. Background technique [0002] Flexible circuit board is referred to as "soft board", commonly known as FPC in the industry, and is a printed circuit made of a flexible insulating base layer. Flexible circuits provide excellent electrical performance, can meet the design needs of smaller and higher density mounting, and also help reduce assembly processes and enhance reliability. Flexible circuit boards are the only solution to meet the miniaturization and mobility requirements of electronic products. It can be bent, wound, and folded freely, and can withstand millions of dynamic bendings without damaging the wires. It can be arranged arbitrarily according to the spatial layout requirements, and can be moved and stretched in three-dimensional space, so as to achieve the integration of component asse...

Claims

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Application Information

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IPC IPC(8): H05K1/02C09D133/00C09D163/00C09D7/12
CPCH05K1/0209C08L2203/20C09D7/61C09D7/63C09D7/70C09D133/00H05K2201/05H05K2201/06C08L63/00C08K13/04C08K7/14C08K5/42C08K2003/385C08K2003/282
Inventor 杨思
Owner 安徽鹏展电子科技有限公司
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