Radiating flexible circuit board and surface coating thereof

Abstract

The invention discloses a radiating flexible circuit board. The radiating flexible circuit board comprises a flexible insulating base layer, a conductive circuit layer and a radiating coating; the conductive circuit layer is located between the flexible insulating base layer and the radiating coating, and the flexible insulating base layer and the conductive circuit layer are bonded in a pressing manner after an adhesive is coated; the radiating coating is formed by curing the coated surface coating; and the surface coating is formed by mixing acrylic resin, epoxy resin, glass fibers, a heat-conducting filling, sodium dodecyl benzene sulfonate, a curing agent and a solvent at a high temperature of 88-105 DEG C. The radiating flexible circuit board provided by the invention solves the problem of local overheating caused by small used space of the existing flexible circuit board as the radiating coating is added on the surface of the conductive circuit layer, improves the heat radiation performance of the circuit board while the circuit board is efficiently protected against external impact damage, and is steady in performance, long in service life and wide in application foreground.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a heat-dissipating flexible circuit board and its surface coating. Background technique [0002] Flexible circuit board is referred to as "soft board", commonly known as FPC in the industry, and is a printed circuit made of a flexible insulating base layer. Flexible circuits provide excellent electrical performance, can meet the design needs of smaller and higher density mounting, and also help reduce assembly processes and enhance reliability. Flexible circuit boards are the only solution to meet the miniaturization and mobility requirements of electronic products. It can be bent, wound, and folded freely, and can withstand millions of dynamic bendings without damaging the wires. It can be arranged arbitrarily according to the spatial layout requirements, and can be moved and stretched in three-dimensional space, so as to achieve the integration of component asse...

AI Technical Summary

Problems solved by technology

In practical applications, due to the narrow use space of the flexible circuit board, its heat conduction effect is slow, the heat cannot be released, and the original parts of the circuit board are easily overheated locally, resulting in component damage due to the inability to dissipate heat.