3results about How to "Increase heat dissipation structure" patented technology

A heat dissipation structure of a dual-motor controller, comprising: a dual-motor controller, a uniform temperature plate and a cooling liquid tank, wherein the dual-motor controller is arranged on the upper side of the uniform temperature plate, the cooling liquid tank has a cavity for containing cooling liquid in the interior, the opposite two side walls of the cooling liquid tank are respectively provided with a cooling liquid inlet and a cooling liquid outlet which are communicated with the cavity, the upper part of the cooling liquid tank is formed with an opening which is communicated with the cavity and is open, and the lower side of the uniform temperature plate is uniformly provided with a plurality of heat dissipation protrusions corresponding to the cavity, when the uniform temperature plate is arranged on and combined with the opening of the cooling liquid tank, the plurality of heat dissipation protrusions are accommodated in the cooling liquid flowing through the cavity through the cooling liquid inlet and the cooling liquid outlet. Accordingly, the arrangement of the heat dissipation protrusions can increase the heat exchange area of the uniform temperature plate, thereby effectively improving the heat dissipation efficiency of the heat dissipation structure.

The utility model discloses a power supply module with a dual filtering structure, which comprises an aluminum shell, an outer support, support screws, side plates and heat dissipation holes, the two sides of the aluminum shell are connected with the two side plates through a plurality of support screws and outer support bolts, and the heat dissipation holes are equidistantly arranged on the surfaces of the side plates. According to the utility model, the design structure of the existing power supply module is improved, double physical isolation is carried out on high and low frequency interference through a double-shell structure, and meanwhile, a multi-outlet heat dissipation structure is added, so that the heat dissipation capability of the power supply module is improved.

This utility model discloses a multi-purpose high-efficiency heat sink, including a heat dissipation component and a heat conduction component. The heat dissipation component includes a heat dissipation concave block and a heat dissipation protrusion with concave and convex longitudinal cross-sections, respectively. The heat conduction component includes a heat conduction base and several heat conduction coils, each of which can be inserted into the heat conduction space of the heat dissipation concave block and the heat dissipation protrusion. This utility model forms a multi-layer heat conduction space through the concave-convex fit, which is a significant improvement over the traditional planar heat dissipation structure. The heat conduction ends of the heat conduction coils are staggered to avoid heat concentration and facilitate heat dissipation. Furthermore, the heat dissipation component and the fan module are coaxially designed to reduce airflow resistance and wind pressure loss, thereby improving heat dissipation efficiency. It can be adapted to the mounting surfaces of different devices, enhancing versatility, and can be used in products with high heat generation, such as computer CPUs and high-power lamps.