69results about How to "Increase heat dissipation structure" patented technology

A power converter unit comprises: a metal casing; a power module mounted in the metal casing and equipped with two or more power semiconductor devices; a metal plate disposed on the power module and fixed to the metal casing; a heat dissipating sheet disposed on the metal plate; and a drive circuit board disposed on the heat dissipating sheet and is equipped with a control circuit for controlling the power semiconductor devices.

The present invention discloses an LED streetlight structure, which comprises: a heat-conduction pipe frame, an upper casing, a lower casing, a light concentration plate, and a transparent cover. The upper and lower casings are made of a plastic material and pivotally coupled to each other. The heat-conduction pipe frame has a heat-dissipation seat with main heat-dissipation fins. Two stabilizer boxes with fins are respectively arranged at two sides of the heat-dissipation seat. Heat-dissipation lamp sets insert through the bottom of the heat-dissipation seat. The present invention installs the main heat-dissipation fins on heat-conduction pipe frame and installs the fins on the stabilizer boxes to increase heat-dissipation area. Further, an auxiliary heat-dissipation ventilation device is arranged above the heat-conduction pipe frame and made of aluminum, and aluminum itself benefits heat dissipation. Furthermore, air can be compulsively conducted to the main heat-dissipation fins, then can enhance the dissipation effect.

A power connector assembly is provided which comprises a plug connector and a mating receptacle connector. The plug connector includes an insulative plug housing having a plurality of passageways divided by division walls and a plurality of plug terminals accommodated in the corresponding passageways of the plug housing. The receptacle connector includes an insulative receptacle housing having a receiving space for receiving a part of the plug housing inserted therein and a plurality of receptacle terminals accommodated in the receptacle housing for mating with the plug terminals. Airflow channels are formed between the outer surface of the part of the plug housing in the receiving space and the inner surface of the receiving space for dissipation of heat.

A heat dissipating structure for an IC chip of a plasma display module, and a plasma display module having the same with improved heat dissipating performance of the IC chip while preventing the spread of foreign matter emanating from the heat-dissipating sheet. The structure includes a chassis including a chassis bending part and a chassis base, the IC chip contacting the chassis bending part and connected to a signal transmitting member, a cover plate arranged on the chassis bending part and facing the IC chip, a chip heat-dissipating sheet arranged between the IC chip and the cover plate, the chip-heat dissipating sheet made out of graphite and a thermally conductive member also arranged between the IC chip and the cover plate, the thermally conductive member adapted to contact and cover the chip heat-dissipating sheet.

A plasma display module including a plasma display panel adapted to display an image with gas discharge, a chassis adapted to support the plasma display panel, a driving unit arranged on the chassis and adapted to generate an electrical signal that drives the plasma display panel, an integrated circuit chip arranged on a signal transmitting unit, the integrated circuit chip being adapted to control electrical signal transfer between the driving unit and the plasma display panel, a cover plate arranged on the signal transmitting unit and adapted to cover the integrated circuit chip and a wave-type heat dissipating plate arranged on the cover plate.

A battery module includes a plurality of rechargeable batteries; a housing containing the rechargeable batteries; first heat dissipation ribs protruded from the housing and having a shape of a polygon or a closed curve; and second heat dissipation ribs protruded from the housing and linearly formed to couple the first heat dissipation ribs to each other.

A heat dissipation apparatus for use with a plasma display device and a method of conducting the heat generated in the plasma display panel and the driving ICs of the plasma display device to various surfaces of the device for dissipation to air. A first heat sink is disposed between the plasma display panel and the chassis base. The first heat sink is positioned at a first region where the heat generated from the driver ICs is substantially concentrated. A second heat sink is positioned at a second region between the plasma display panel and the chassis base where the heat generated by the plasma display panel is substantially concentrated. A number of additional thermal conduction media are also used in the various embodiments of the invention.

An improved heat-dissipation structure includes a heat-dissipation lamp frame which comprises: a heat-dissipation structure and a plurality of heat-dissipation lamp sets. The heat-dissipation structure has a plurality of heat-dissipation fins on one side thereof, and the heat-dissipation lamp sets are accommodated on the other side of the heat-dissipation structure. An inlay slot is formed along the perimeter of the heat-dissipation lamp sets and is used to accommodate a light guiding tube which is a hollow and tube-like structure and has an inlay rim. The light guiding tube passes through the opening and is inlaid in the inlay slot of the heat-dissipation lamp frame. A casing is a metallic shell and has a through-hole on one side thereof to accept the heat-dissipation lamp frame. The casing has an opening on the other side thereof. A light-permeable cover is a light-permeable hood and has a contact plane on one side thereof.

A liquid-cooling heat dissipation device includes a thermally conductive base and a covering structure. The thermally conductive base has a bottom surface and a top surface opposed to the bottom surface. The bottom surface is in contact with a heat source. A heat dissipation structure is formed on the top surface. The thermally conductive base is covered by the covering structure. An input chamber and an output chamber are defined by the thermally conductive base and the covering structure collaboratively. The input chamber is disposed over the heat dissipation structure and has an entrance. The output chamber has an exit. The input chamber is a tapered space. A vertical height of the input chamber is gradually decreased in a direction from the entrance toward the exit. Consequently, liquid flowing into the input chamber through the entrance is guided to the heat dissipation structure.

A heat dissipation structure of an intelligent power module includes a chassis base, a drive circuit board arranged on the chassis base, an intelligent power module arranged at a side of the drive circuit board, the intelligent power module comprising a plurality of circuit devices, a first heat dissipater having one surface contacting a surface of the intelligent power module, the first heat dissipater being adapted to dissipate heat generated by operation of the plurality of circuit devices, and a second heat dissipater having one side arranged in contact with another surface of the first heat dissipater and another side arranged to contact a surface of the chassis base.

A liquid cooling heat dissipation structure includes a heat-conducting substrate, a fluid-splitting board, a fluid-conducting board, and a liquid supply module. The heat-conducting substrate has a heat-conducting body contacting a heat generation source and a plurality of heat-dissipating fins disposed on the heat-conducting body. The fluid-splitting board is disposed on the heat-dissipating fins. The fluid-conducting board is disposed on the fluid-splitting board. The liquid supply module includes an external cover body detachably disposed on the heat-conducting body and at least two pumps detachably disposed on the external cover body. The external cover body has at least one liquid inlet and at least one liquid outlet, and cooling liquid flows into the external cover body through the at least one liquid inlet and flows out of the external cover body through the at least one liquid outlet by driving one or all of the at least two pumps.

A power connector includes an insulative housing, a number of contacts retained in the insulative housing and a spacer fixed to the insulative housing. The insulative housing includes a mating surface, an end surface opposite to the mating surface and a plurality of first passageways extending through the mating and the end surfaces. A depression and a cavity are recessed into the insulative housing from the mating surface and the end surface, respectively. Each first contact includes a main portion received in the corresponding first passageway and a tail portion located at the cavity in condition that at least one side wall of the tail portion is exposed to the outside for excellent heat dissipation.

A shell heat dissipating structure of a small form-factor transceiver includes a hollow shell and a heat dissipating structure. The hollow shell has a setting surface disposed on the outside; the setting surface is formed along an extending direction of the hollow shell. The heat dissipating structure has plural fins formed along the extending direction of the hollow shell and spaced on the setting surface; a plurality of channels is formed among the fins. Each of the fins is formed by plural projecting portions and recess portions disposed along the extending direction and alternated continuously such that the channels among the fins communicate with each other through the recess portions.