69results about How to "Increase heat dissipation structure" patented technology

The present invention discloses an LED streetlight structure, which comprises: a heat-conduction pipe frame, an upper casing, a lower casing, a light concentration plate, and a transparent cover. The upper and lower casings are made of a plastic material and pivotally coupled to each other. The heat-conduction pipe frame has a heat-dissipation seat with main heat-dissipation fins. Two stabilizer boxes with fins are respectively arranged at two sides of the heat-dissipation seat. Heat-dissipation lamp sets insert through the bottom of the heat-dissipation seat. The present invention installs the main heat-dissipation fins on heat-conduction pipe frame and installs the fins on the stabilizer boxes to increase heat-dissipation area. Further, an auxiliary heat-dissipation ventilation device is arranged above the heat-conduction pipe frame and made of aluminum, and aluminum itself benefits heat dissipation. Furthermore, air can be compulsively conducted to the main heat-dissipation fins, then can enhance the dissipation effect.

A liquid cooling heat dissipation structure includes a heat-conducting substrate, a fluid-splitting board, a fluid-conducting board, and a liquid supply module. The heat-conducting substrate has a heat-conducting body contacting a heat generation source and a plurality of heat-dissipating fins disposed on the heat-conducting body. The fluid-splitting board is disposed on the heat-dissipating fins. The fluid-conducting board is disposed on the fluid-splitting board. The liquid supply module includes an external cover body detachably disposed on the heat-conducting body and at least two pumps detachably disposed on the external cover body. The external cover body has at least one liquid inlet and at least one liquid outlet, and cooling liquid flows into the external cover body through the at least one liquid inlet and flows out of the external cover body through the at least one liquid outlet by driving one or all of the at least two pumps.

A power converter unit comprises: a metal casing; a power module mounted in the metal casing and equipped with two or more power semiconductor devices; a metal plate disposed on the power module and fixed to the metal casing; a heat dissipating sheet disposed on the metal plate; and a drive circuit board disposed on the heat dissipating sheet and is equipped with a control circuit for controlling the power semiconductor devices.

A plasma display panel having improved heat transfer efficiency and temperature distribution, and a plasma display device including the same are disclosed. The plasma display device includes a plasma display module that includes a plasma display panel on which an image is displayed, a chassis base facing the plasma display panel, a circuit unit disposed at a back side of the chassis base for driving the plasma display panel, a front cover and a back cover that house the plasma display module, and at least a heat radiation coating layer formed between the front cover and the back cover. The heat radiation layer reduces a conventional heat dissipation sheet unnecessary, and thus reduces process times and manufacturing costs.

A plasma display apparatus includes a plasma display panel, and a chassis base proceeding substantially parallel to the plasma display panel with a surface facing the plasma display panel, and an opposite surface mounting a driving circuit unit thereon. Driver ICs selectively apply voltage to electrodes of the plasma display panel in accordance with the control signals from the driving circuit unit. A cover plate is placed external to the driver IC, and fitted to the chassis base to compress the driver IC against the chassis base. A first heat sink is disposed between the plasma display panel and the chassis base. The first heat sink is positioned at a first region where the heat generated from the driver ICs is substantially concentrated. A second heat sink is positioned at a second region between the plasma display panel and the chassis base except for the first region.

A heat dissipation apparatus and electronic device including the same are provided. The heat dissipation apparatus includes a battery area, a heat generation body including a shield can and a PCB on which heat generating components are mounted, an internal support structure disposed adjacent to the heat generation body, and a coil FPCB attached between the internal support structure and the shield can, wherein the internal support structure includes an air volume space configured to block conduction of high-temperature heat produced by the heat generation body and cause thermal radiation and convection.

A power connector assembly is provided which comprises a plug connector and a mating receptacle connector. The plug connector includes an insulative plug housing having a plurality of passageways divided by division walls and a plurality of plug terminals accommodated in the corresponding passageways of the plug housing. The receptacle connector includes an insulative receptacle housing having a receiving space for receiving a part of the plug housing inserted therein and a plurality of receptacle terminals accommodated in the receptacle housing for mating with the plug terminals. Airflow channels are formed between the outer surface of the part of the plug housing in the receiving space and the inner surface of the receiving space for dissipation of heat.

A heat dissipating structure for an IC chip of a plasma display module, and a plasma display module having the same with improved heat dissipating performance of the IC chip while preventing the spread of foreign matter emanating from the heat-dissipating sheet. The structure includes a chassis including a chassis bending part and a chassis base, the IC chip contacting the chassis bending part and connected to a signal transmitting member, a cover plate arranged on the chassis bending part and facing the IC chip, a chip heat-dissipating sheet arranged between the IC chip and the cover plate, the chip-heat dissipating sheet made out of graphite and a thermally conductive member also arranged between the IC chip and the cover plate, the thermally conductive member adapted to contact and cover the chip heat-dissipating sheet.

The invention provides a soft robot based on shape memory alloy driving. The soft robot has the characteristics of being simple in structure, capable of moving in multiple poses, good in environmental adaptation and the like. A single chip microcomputer is controlled to sequentially power on shape memory alloy wires embedded in the robot, the six shape memory alloy wires are arranged in a robot body, and an alloy wire overlapping structure is used for driving the robot to move forwards and backwards. The robot is provided with four feet, each foot comprises two shape memory alloy wires, the forward moving direction of the robot is changed by means of flexibility of the alloy wires, and multi-pose movement is achieved. A top heat dissipation structure can increase the movement speed of the root. A bottom tooth-shaped structure is beneficial to jacking up a silica gel outer shell in the mode that the alloy wires are powered on to retract. Supporting structures on the front side and the rear side serve as contact points of a supporting surface in movement, and friction force with the surface can be reduced in movement.

A heat pipe heat dissipation structure includes a main body. The main body has an evaporation section, a condensation section, a chamber filled with a working fluid and at least one first capillary structure. The first capillary structure is disposed on an inner wall face of the chamber. The first capillary structure has at least one swelling capillary section. The swelling capillary section swells from a part of the first capillary structure in the evaporation section. The heat pipe heat dissipation structure is able to greatly increase heat transfer efficiency.

A heat dissipation structure of an intelligent power module includes a chassis base, a drive circuit board arranged on the chassis base, an intelligent power module arranged at a side of the drive circuit board, the intelligent power module comprising a plurality of circuit devices, a first heat dissipater having one surface contacting a surface of the intelligent power module, the first heat dissipater being adapted to dissipate heat generated by operation of the plurality of circuit devices, and a second heat dissipater having one side arranged in contact with another surface of the first heat dissipater and another side arranged to contact a surface of the chassis base.

An optical head includes a fixed part, a movable part movably held by a plurality of wires fixed on the fixed part, and magnets fixed to the fixed part. The movable part includes a movable-part housing, a heatsink held by the movable-part housing, a light emitting element and a light receiving element both mounted on the heatsink, magnets provided to both sides of the movable-part housing to contact the heatsink, an objective lens held by the movable-part housing to allow an emitted laser beam from the light emitting element to focus, and a diffraction grating provided between the objective lens and the light emitting element and between the objective lens and the light receiving element. The gap between each coil and the adjacent magnet is filled with ferrofluid having a higher thermal conductivity than the atmosphere.

A heat dissipation apparatus for use with a plasma display device and a method of conducting the heat generated in the plasma display panel and the driving ICs of the plasma display device to various surfaces of the device for dissipation to air. A first heat sink is disposed between the plasma display panel and the chassis base. The first heat sink is positioned at a first region where the heat generated from the driver ICs is substantially concentrated. A second heat sink is positioned at a second region between the plasma display panel and the chassis base where the heat generated by the plasma display panel is substantially concentrated. A number of additional thermal conduction media are also used in the various embodiments of the invention.

An improved heat-dissipation structure includes a heat-dissipation lamp frame which comprises: a heat-dissipation structure and a plurality of heat-dissipation lamp sets. The heat-dissipation structure has a plurality of heat-dissipation fins on one side thereof, and the heat-dissipation lamp sets are accommodated on the other side of the heat-dissipation structure. An inlay slot is formed along the perimeter of the heat-dissipation lamp sets and is used to accommodate a light guiding tube which is a hollow and tube-like structure and has an inlay rim. The light guiding tube passes through the opening and is inlaid in the inlay slot of the heat-dissipation lamp frame. A casing is a metallic shell and has a through-hole on one side thereof to accept the heat-dissipation lamp frame. The casing has an opening on the other side thereof. A light-permeable cover is a light-permeable hood and has a contact plane on one side thereof.

A plasma display panel having improved heat transfer efficiency and temperature distribution, and a plasma display device including the same are disclosed. The plasma display device includes a plasma display module that includes a plasma display panel on which an image is displayed, a chassis base facing the plasma display panel, a circuit unit disposed at a back side of the chassis base for driving the plasma display panel, a front cover and a back cover that house the plasma display module, and at least a heat radiation coating layer formed between the front cover and the back cover. The heat radiation layer reduces a conventional heat dissipation sheet unnecessary, and thus reduces process times and manufacturing costs.

A heat dissipation structure for communication chassis. The heat dissipation structure includes an enclosure. At least one first copper heat absorption component and at least one first heat pipe assembly are disposed in the enclosure. The first heat pipe assembly is connected with the first copper heat absorption component and a section not in contact with the first copper heat absorption component. The first heat pipe assembly serves to quickly transfer heat absorbed by the first copper heat absorption component to the section not in contact with the first copper heat absorption component to dissipate the heat.

A power connector includes an insulative housing, a number of contacts retained in the insulative housing and a spacer fixed to the insulative housing. The insulative housing includes a mating surface, an end surface opposite to the mating surface and a plurality of first passageways extending through the mating and the end surfaces. A depression and a cavity are recessed into the insulative housing from the mating surface and the end surface, respectively. Each first contact includes a main portion received in the corresponding first passageway and a tail portion located at the cavity in condition that at least one side wall of the tail portion is exposed to the outside for excellent heat dissipation.

A heat dissipating structure for IC chip of a plasma display module, and a plasma display module having the same with improved the heat dissipating performance of the IC chip while preventing the spread of foreign matter emanating from the heat-dissipating sheet. The structure includes a chassis including a chassis bending part and a chassis base, the IC chip contacting the chassis bending part and connected to a signal transmitting member, a cover plate arranged on the chassis bending part and facing the IC chip, a chip heat-dissipating sheet arranged between the IC chip and the cover plate, the chip-heat dissipating sheet made out of graphite and a thermally conductive member also arranged between the IC chip and the cover plate, the thermally conductive member adapted to contact and cover the chip heat-dissipating sheet.

A heat dissipation structure of an intelligent power module includes a chassis base, a drive circuit board arranged on the chassis base, an intelligent power module arranged at a side of the drive circuit board, the intelligent power module comprising a plurality of circuit devices, a first heat dissipater having one surface contacting a surface of the intelligent power module, the first heat dissipater being adapted to dissipate heat generated by operation of the plurality of circuit devices, and a second heat dissipater having one side arranged in contact with another surface of the first heat dissipater and another side arranged to contact a surface of the chassis base.

A liquid cooling heat dissipation structure includes a heat-conducting substrate, a fluid-splitting board, a fluid-conducting board, and a liquid supply module. The heat-conducting substrate has a heat-conducting body contacting a heat generation source and a plurality of heat-dissipating fins disposed on the heat-conducting body. The fluid-splitting board is disposed on the heat-dissipating fins. The fluid-conducting board is disposed on the fluid-splitting board. The liquid supply module includes an external cover body detachably disposed on the heat-conducting body and at least two pumps detachably disposed on the external cover body. The external cover body has at least one liquid inlet and at least one liquid outlet, and cooling liquid flows into the external cover body through the at least one liquid inlet and flows out of the external cover body through the at least one liquid outlet by driving one or all of the at least two pumps.

A spherical lamp with easy heat dissipation comprises: a lower substrate and an upper substrate, in each of which a plurality of LEDs are embedded; a substrate support portion having a plate shape, to which the lower and upper substrates are coupled and fixed to lower and upper portions thereof, respectively; lower and upper covers, which are fixed to lower and upper portions of the substrate support portion, respectively, and each of which has a semi-spherical shape; a support portion, which is connected to an upper center portion of the substrate support portion and is exposed to the exterior through a center portion of the upper cover; and a heat dissipation plate which is formed on a rear surface of the heat dissipation plate and provided with a coupling portion into which an end of the support portion is inserted and fixed.

An improved heat-dissipation structure includes a heat-dissipation lamp frame which comprises: a heat-dissipation structure and a plurality of heat-dissipation lamp sets. The heat-dissipation structure has a plurality of heat-dissipation fins on one side thereof, and the heat-dissipation lamp sets are accommodated on the other side of the heat-dissipation structure. An inlay slot is formed along the perimeter of the heat-dissipation lamp sets and is used to accommodate a light guiding tube which is a hollow and tube-like structure and has an inlay rim. The light guiding tube passes through the opening and is inlaid in the inlay slot of the heat-dissipation lamp frame. A casing is a metallic shell and has a through-hole on one side thereof to accept the heat-dissipation lamp frame. The casing has an opening on the other side thereof. A light-permeable cover is a light-permeable hood and has a contact plane on one side thereof.

A power connector includes an insulative housing, a number of contacts retained in the insulative housing and a spacer fixed to the insulative housing. The insulative housing includes a mating surface, an end surface opposite to the mating surface and a plurality of first passageways extending through the mating and the end surfaces. A depression and a cavity are recessed into the insulative housing from the mating surface and the end surface, respectively. Each first contact includes a main portion received in the corresponding first passageway and a tail portion located at the cavity in condition that at least one side wall of the tail portion is exposed to the outside for excellent heat dissipation.

A lighting device includes a light source module and a housing mated to a heat sink and covered by a cover. The housing has a first shell portion encircled by an inner sidewall of the heat sink. Alternatively, the housing may further has a second shell portion arranged between the first shell portion and the inner sidewall of the heat sink. The respective ends of the first and second shell portions are covered by a first plate portion and a connecting portion. A cavity is defined by the first shell portion and the first plate portion for accommodating the light source module. A plurality of first thru-holes, second thru holes, third thru holes, fourth thru-holes, and fifth thru holes are formed on the circuit board, the connecting portion, the cover, the first shell portion, and the first plate portion, respectively.

An electrical connector (100) includes an insulative housing (1) and a number of electrical contacts (2). The insulative housing includes a base (10) having a pair of side walls (13), a slot (15) formed between the two side walls, and a number of passageways (19) and recesses (17) both defined on the side walls. Each side wall has an outer face (132) and each recess extends from a corresponding passageway to the outer face. The electrical contacts are received in the passageways of the insulative housing.

A shell heat dissipating structure of a small form-factor transceiver includes a hollow shell and a heat dissipating structure. The hollow shell has a setting surface disposed on the outside; the setting surface is formed along an extending direction of the hollow shell. The heat dissipating structure has plural fins formed along the extending direction of the hollow shell and spaced on the setting surface; a plurality of channels is formed among the fins. Each of the fins is formed by plural projecting portions and recess portions disposed along the extending direction and alternated continuously such that the channels among the fins communicate with each other through the recess portions.