The invention relates to a camera module and a photosensitive assembly thereof. The photosensitive assembly comprises a circuit board; the photosensitive chip is arranged on the circuit board; the support is arranged on the circuit board, a light through hole penetrating through the two ends is formed in the support and right faces the photosensitive chip, an installation groove surrounding the light through hole is formed in the end, away from the circuit board, of the support, and the installation groove is used for installing the lens assembly. In the photosensitive assembly, a installationgroove surrounding the light through hole is formed in the top surface, far away from the circuit board, of the bracket. The installation groove is used for installing the lens assembly, thereby achieving the embedded design of the lens assembly, preventing the side surface (i.e., the side surface of the lens assembly) of the camera module from being liable to deform because of collision, and improving the side surface shearing strength of the camera module. And the overall height of the camera module can be reduced by adopting the installation groove to mount the lens assembly. When the camera module with the reduced height is applied to mobile terminals such as a intelligent phone, the mobile terminals such as the intelligent phone can be ultrathin.