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34results about How to "Affect thickness" patented technology

Regulation method and device for double-roll thin-strip continuous casting machine fixing roll

The invention discloses a regulation method and device for a double-roll thin-strip continuous casting machine fixing roll. The regulation method comprises the following steps of: a) a hydraulic cylinder is arranged corresponding to a casting roll continuous casting machine rack on a fixed side, the head part of the hydraulic cylinder is connected with a casting roll bearing pedestal, tensioning mechanisms are respectively arranged above and below the hydraulic cylinder, each tensioning mechanism comprises a draw bar, a spring, a gland and regulation nuts, a stop dog is arranged below the other side of the bearing pedestal, a pressure sensor is arranged between the stop dog and the bearing pedestal, and a cast rolling force sensor is arranged on the front end of the hydraulic cylinder; b) before the casting operation, the hydraulic cylinder on the fixed side pushes the casting roll bearing pedestal to press the stop dog; c) the pressure of the draw bars and the springs is regulated by the regulation nuts, the bearing pedestal, the cast rolling force sensor and the hydraulic cylinder are pressed together until the numerical value of the pressure sensor between the stop dog and the bearing pedestal is zero, and the pressure numerical value detected by the cast rolling force sensor is more than the sum of pressuring pressure FN and the maximum friction force f of the bearing pedestal on a guide rail; and after a casting center line is calibrated, the casting state is waited to start. According to the regulation method and device for the double-roll thin-strip continuous casting machine fixing roll, which are disclosed by the invention, the casting center line positioning precision is guaranteed, the cast rolling force detection degree is improved, and stable casting is realized.
Owner:BAOSHAN IRON & STEEL CO LTD

Method for removing powder and attaching glue for tab locations of pole pieces

InactiveCN106299227AEffective in removing powderEliminate effectiveCell component detailsMetallurgyPole piece
The invention discloses a method for removing powder and attaching glue for tab locations of pole pieces. The method includes steps of S1, fixedly placing the pole pieces with the powder required to be removed on fixtures; S2, positioning regions, with the powder required to be removed, of the tab locations in laser firing or grinding modes; S3, starting laser light to fire the regions, with the powder required to be removed, of the tab locations to remove the powder or grinding the regions, with the powder required to be removed, of the tab locations to remove the powder in the grinding modes; S4, starting a vacuum dust collection device to clean dust generated due to laser firing or grinding in the regions with the powder required to be removed; S5, turning the pole pieces over, repeatedly carrying out previous steps and completely removing the powder at the tab locations on the other surface of each pole piece; S6, attaching the insulating glue onto the regions, without the powder, of the tab locations on two surfaces of each pole piece by the aid of double-side glue attaching equipment. The method has the advantages that the powder at the tab locations of the pole pieces can be effectively removed by the aid of the method, the thicknesses of the regions without the powder are assuredly identical to the thicknesses of other film-coated regions, and accordingly the thicknesses and the appearance of batteries can be guaranteed against being affected.
Owner:四川赛尔雷新能源科技有限公司

Method for stabilizing flash memory unit word line threshold voltage

The invention provides a method for stabilizing flash memory unit word line threshold voltage. The method includes the steps that photoresist is distributed on a silicon wafer, the photoresist on an active area of the silicon wafer is removed, and the photoresist on the peripheral portion of the silicon wafer is left; first injection treatment is executed on a flash memory unit forming area of the active area of the silicon wafer, and an injection condition of the first injection treatment is selected so that an expected floating gate lower threshold can be formed on a final flash memory unit; the flash memory unit forming process is executed on the silicon wafer so that the flash memory unit can be formed on the flash memory unit forming area of the active area; second injection treatment is executed on the active area of the silicon wafer so that doping can be formed on the positions, corresponding to the silicon wafer area, of word lines on the two sides of the flash memory unit, and an injection condition of the second injection treatment is selected so that an expected word line lower threshold can be formed on the final flash memory unit, wherein ion injection is not carried out on the flash memory unit forming area in the flash memory unit forming process.
Owner:SHANGHAI HUAHONG GRACE SEMICON MFG CORP

Temperature compensation method and device for improving detection precision of ray type thickness gauge

The invention provides a temperature compensation method and device for improving the detection precision of a ray type thickness gauge. According to the scheme, the device comprises the thickness gauge and a scanning type pyrometer, the scanning type pyrometer detects the temperature of the whole cross section of strip steel, and a collected signal is connected to a special processor for processing; the collected signal is transmitted to a thickness gauge control system through a serial port or the Ethernet and other manners, and temperature compensation coefficients of all points in the width direction are calculated through a temperature compensation calculation program block in the thickness gauge control system; and a deviation value is set, and the temperature compensation coefficients are calculated by adopting a temperature average value in the width direction when the temperature detection values of two adjacent points exceed a deviation value or the temperature detection value of a certain point suddenly changes to exceed a deviation range. Thickness detection precision can be improved, thickness calculation and detection are prevented from being affected by an abnormal temperature zone, the purpose of accurately measuring the thickness, convexity and wedge shape of the strip steel is achieved, and meanwhile the product quality and the production stability are improved.
Owner:RIZHAO STEEL HLDG GROUP

Processing device for fireproof cable with metal sheath

The invention discloses a processing device for a fireproof cable with a metal sheath. According to the technical scheme, the processing device for the fireproof cable comprises a processing table, one side of the top of the processing table is fixedly connected with a fixed vertical plate, one side of the fixed vertical plate is provided with a limiting processing mechanism, the limiting processing mechanism comprises a limiting sleeve and an annular sleeve, the limiting sleeve is located on one side of the fixed vertical plate, supporting vertical plates are arranged at the two ends of the limiting sleeve correspondingly, and the two ends of the limiting sleeve penetrate through the two supporting vertical plates correspondingly and are fixedly connected with the supporting vertical plates. The processing device for the fireproof cable with the metal sheath has the beneficial effects that unnecessary troubles caused by non-uniform spraying of a fireproof coating during cable processing are reduced, and the problems that the surface of the cable is not smooth, the fireproof performance of the cable is reduced and normal use requirements cannot be met due to the fact that the coating is generally and directly coated outside the cable by an existing cable processing device, but the fireproof coating is not uniformly sprayed in the coating process and the thicknesses of the fireproof coating sprayed outside the cable are different are solved.
Owner:JIANGXI ZHONGSHENG METAL

Chemical vapor deposition method assisted by non-plasma

The invention provides a chemical vapor deposition method assisted by non-plasma. The method comprises the following steps: cleaning sediment deposited on the inner wall of a reaction cavity before placing a wafer in the reaction cavity, depositing a layer of second sediment on the inner wall of the reaction cavity, and regulating the time of introducing protective gas according to the air pressure in the reaction cavity; and after placing the wafer in the reaction cavity, preparing a dielectric layer on the wafer by using the chemical vapor deposition method assisted by the non-plasma. By using the method, the sediment deposited on the inner wall of the reaction cavity is cleaned before placing the wafer in the reaction cavity so as to clean the sediment remained on the inner wall of the reaction cavity, then a layer of second sediment is deposited on the inner wall of the reaction cavity so that the environments in the reaction cavity are consistent with the environment when the wafer is placed in the reaction cavity to manufacture the dielectric layer; and through cleaning the reaction cavity and regulating the introduction time of the protective gas, the severe variation of the temperature in the reaction cavity is avoided so as to influence the thickness of the sequentially manufactured dielectric layer, and the variation range of the thickness of the dielectric layer is reduced.
Owner:SEMICON MFG INT (SHANGHAI) CORP +1

Loading Method of Solder Paste for Reworked Printed Boards of Surface Mount Devices

The invention discloses a method for loading repaired printed board solder paste of a surface mount device, which aims to provide a solder paste loading method possessing good operability, excellent quality and high reliability. The method is realized through the following technical scheme: a printed board solder paste loading tool which is formed by supporting two spring stand columns between a printed board and a pressing plate is prepared, a peripheral stand column with a suction cup is used to pass through the pressing plate to suck a steel mesh template on the printed plate; a film pressing plate connected through the pressing plate is fixed above the steel mesh template, and the solder paste is arranged on the steel mesh template; the spring is compressed, so that the pressing film plate on the pressing plate presses the solder paste into meshes in the steel mesh template; the position of the pressing plate is kept, the pressing plate is lifted, and the suction cup drives the steel mesh template to rise, press brushing of solder paste over-reflow soldering is carried out on a printed board PCB bonding pad to form a welding spot, the solder paste is punched through the steel mesh template and is printed on the bonding pad of the welding area element of the printed circuit board; and the bonding pad is connected with the corresponding bonding pad on the printed circuit board PCB to complete the loading of the solder paste.
Owner:10TH RES INST OF CETC

Printing equipment capable of stably controlling printing gap and reducing solder projection and collapse

The invention relates to the technical field of printing, and provides printing equipment capable of stably controlling a printing gap and reducing solder projection and collapse. The printing equipment comprises a machine body, a push block is movably connected in the machine body, a push rod is fixedly connected to the bottom of the push block, and a moving frame is fixedly connected to the bottom of the push rod. According to the printing equipment capable of stably controlling the printing gap and reducing solder projection and collapse, a drive mechanism drives the push block to move, the push block and the push rod are used in cooperation to push the moving frame, the moving frame enables a printing plate to move for printing through parallel plates, when the printing plate inclines, the parallel plates incline to enable a balance lever to deviate, the balance lever extrudes pressure-sensitive ceramic through contact blocks, the pressure-sensitive ceramic is pressed to enable electromagnets to be powered on, the power-on amount is related to the magnitude of the pressure borne by the pressure-sensitive ceramic, the electromagnets attract iron blocks to move after being powered on, the iron blocks and turning rods jointly act to change the inclination angle of the printing plate, the printing plate is parallel to the horizontal plane again, the printing gap is kept stable, and thus solder projection is prevented.
Owner:桂图加

Structure for improving performance of MPI substrate FPC antenna and preparation method

The invention provides a structure for improving the performance of an MPI substrate FPC antenna and a preparation method. The structure comprises a plurality of groups of base layers and surface layers which are periodically and alternately arranged, the base layers are hydrophilic and elastic polymer material layers, the surface layers are made of a fluorinated siloxane material, and the base layers and the surface layers are mutually combined through coupling acting force to form special acting bonds, so that a complete and firm flexible-rigid double-layer coating structure is formed. According to the structure for improving the performance of an MPI substrate FPC antenna and the preparation method provided by the invention, the surface of an MPI substrate FPC antenna formed by combining the base layers and the surface layers is provided with low-polarity fluorine-containing molecular groups, the dielectric constant epsilon(r) is not larger than 3, the dielectric constant is reduced, the total thickness is 0.3-5 [mu]m, the thickness of the antenna is not affected, the elastic base layers can also absorb part of external stress, a certain deformation and displacement space is provided, and no negative influence is caused to the space design flexibility of the antenna.
Owner:上海科谷纳新材料科技有限公司

Manufacturing method of MEMS device

The invention provides a manufacturing method of an MEMS device. The manufacturing method at least comprises the following steps: S1, providing a semiconductor substrate, wherein an MEMS region for the post-production of an MEMS sensitive structure is divided in advance on the surface of the semiconductor substrate; S2, forming a first SiGe layer on the semiconductor substrate; S3, forming a plurality of grooves in the surface of the first SiGe layer positioned on a non-MEMS region, and filling the grooves with a plastic material so as to form a plastic filling block; S4, removing residual plastic materials outside the grooves, and then forming a second SiGe layer covering the plastic filling block on the surface of the first SiGe layer; and S5, manufacturing the MEMS sensitive structure by taking the first SiGe layer and the second SiGe layer, which are positioned on the MEMS region, as structural materials. According to the manufacturing method provided by the invention, the plastic filling block is added into the SiGe layers, and the stress in the plastic filling block is absorbed by utilizing the plastic deformation capacity of the plastic filling block, so that the stripping phenomenon of the SiGe layer is prevented effectively; furthermore, the plastic filling block is positioned in the non-MEMS region, and the functions of the device cannot be affected.
Owner:SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORP

Regulation method and device for double-roll thin-strip continuous casting machine fixing roll

The invention discloses a regulation method and device for a double-roll thin-strip continuous casting machine fixing roll. The regulation method comprises the following steps of: a) a hydraulic cylinder is arranged corresponding to a casting roll continuous casting machine rack on a fixed side, the head part of the hydraulic cylinder is connected with a casting roll bearing pedestal, tensioning mechanisms are respectively arranged above and below the hydraulic cylinder, each tensioning mechanism comprises a draw bar, a spring, a gland and regulation nuts, a stop dog is arranged below the other side of the bearing pedestal, a pressure sensor is arranged between the stop dog and the bearing pedestal, and a cast rolling force sensor is arranged on the front end of the hydraulic cylinder; b) before the casting operation, the hydraulic cylinder on the fixed side pushes the casting roll bearing pedestal to press the stop dog; c) the pressure of the draw bars and the springs is regulated by the regulation nuts, the bearing pedestal, the cast rolling force sensor and the hydraulic cylinder are pressed together until the numerical value of the pressure sensor between the stop dog and the bearing pedestal is zero, and the pressure numerical value detected by the cast rolling force sensor is more than the sum of pressuring pressure FN and the maximum friction force f of the bearing pedestal on a guide rail; and after a casting center line is calibrated, the casting state is waited to start. According to the regulation method and device for the double-roll thin-strip continuous casting machine fixing roll, which are disclosed by the invention, the casting center line positioning precision is guaranteed, the cast rolling force detection degree is improved, and stable casting is realized.
Owner:BAOSHAN IRON & STEEL CO LTD

Method for stabilizing threshold voltage of word line of flash memory cell

The invention provides a method for stabilizing the threshold voltage of the word line of a flash memory cell, comprising: arranging photoresist on a silicon chip, and removing the photoresist on the active area of ​​the silicon chip, leaving the photoresist; the first implantation process is performed on the flash memory cell formation area of ​​the active region of the silicon wafer, wherein the implantation conditions of the first implantation process are selected so that the desired floating gate lower threshold is formed in the final flash memory cell; the silicon wafer Performing a flash memory cell formation process to form a flash memory cell on the flash memory cell formation area of ​​the active area; performing a second implantation process on the active area of ​​the silicon wafer so as to form a doped silicon wafer area corresponding to the word line on both sides of the flash memory cell , wherein the implantation conditions of the second implantation process are selected such that a desired word line lower threshold is formed in the final flash memory cell. Wherein, no ion implantation is performed on the formation region of the flash memory unit during the formation process of the flash memory unit.
Owner:SHANGHAI HUAHONG GRACE SEMICON MFG CORP

A kind of manufacturing method of mems device

The invention provides a manufacturing method of an MEMS device. The manufacturing method at least comprises the following steps: S1, providing a semiconductor substrate, wherein an MEMS region for the post-production of an MEMS sensitive structure is divided in advance on the surface of the semiconductor substrate; S2, forming a first SiGe layer on the semiconductor substrate; S3, forming a plurality of grooves in the surface of the first SiGe layer positioned on a non-MEMS region, and filling the grooves with a plastic material so as to form a plastic filling block; S4, removing residual plastic materials outside the grooves, and then forming a second SiGe layer covering the plastic filling block on the surface of the first SiGe layer; and S5, manufacturing the MEMS sensitive structure by taking the first SiGe layer and the second SiGe layer, which are positioned on the MEMS region, as structural materials. According to the manufacturing method provided by the invention, the plastic filling block is added into the SiGe layers, and the stress in the plastic filling block is absorbed by utilizing the plastic deformation capacity of the plastic filling block, so that the stripping phenomenon of the SiGe layer is prevented effectively; furthermore, the plastic filling block is positioned in the non-MEMS region, and the functions of the device cannot be affected.
Owner:SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORP

Display module and display device

The invention belongs to the technical field of display equipment, and discloses a display module and a display device. The display module comprises a main flexible circuit board, a touch flexible circuit board and a connector used for enabling the touch flexible circuit board to be connected with the main flexible circuit board; the connector comprises a socket arranged on the main flexible circuit board, and the plugging end of the socket is provided with a connection terminal set and first limiting mechanisms located on the two sides of the connection terminal set; and the insertion end of the touch flexible circuit board comprises a golden finger and second limiting mechanisms located on the two sides of the golden finger. When the insertion end of the touch flexible circuit board is connected with the plugging end of the socket in an inserted mode, the first limiting mechanisms and the second limiting mechanisms can be clamped in a matched mode, so that the length of the portion, inserted into the socket, of the insertion end of the touch flexible circuit board can be adjusted through cooperation of the first limiting mechanisms and the second limiting mechanisms. According to the display module, the problem that the touch flexible circuit board falls off from the socket of the connector can be avoided, and the problem that a neck hunches up after the touch flexible circuit board is plugged into the main flexible circuit board can be effectively solved.
Owner:BOE TECH GRP CO LTD +1
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