Loading Method of Solder Paste for Reworked Printed Boards of Surface Mount Devices

A technology for surface mount devices and printed boards, which is used in the manufacture of printed circuits, assembly of printed circuits with electrical components, printed circuits, etc.

Active Publication Date: 2020-08-25
10TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The present invention aims at the disadvantages of solder paste loading for reworked printed boards of existing surface mount devices, and provides a solder paste with good operability, excellent quality, high reliability, uniform solder paste, appropriate amount of solder paste, and more convenient soldering. Paste loading method to improve surface mount device rework printed board solder paste loading printability and long-term reliability of electronic equipment

Method used

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  • Loading Method of Solder Paste for Reworked Printed Boards of Surface Mount Devices

Examples

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Effect test

Embodiment Construction

[0019] refer to figure 1 . According to the present invention, prepare a loading frock that is supported between the printed circuit board 1 and the pressure plate 7 with two spring columns 3, the loading frock is provided with four columns 5 that pass through the pressure plate 7 and have suction cups, through the pressure plate nut 9 Screw the connecting rod and pass through the pressure plate 7, and hover over the pressure film plate 8 above the stencil template 2. The stencil template 2 is placed on the printed circuit board 1 and aligned with the printed circuit board 1; The mesh template 2 and the printed circuit board 1 are adsorbed on the suction cups at the free ends of the four columns 5, the spring 6 is compressed by the pressure plate 7, and the pressure plate 7 drives the pressure film plate 8 to go down, and the solder paste is pressed into the mesh on the steel mesh template 2, Solder paste passes through the mesh of the stencil template 2 and leaks onto the pa...

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PUM

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Abstract

The invention discloses a method for loading repaired printed board solder paste of a surface mount device, which aims to provide a solder paste loading method possessing good operability, excellent quality and high reliability. The method is realized through the following technical scheme: a printed board solder paste loading tool which is formed by supporting two spring stand columns between a printed board and a pressing plate is prepared, a peripheral stand column with a suction cup is used to pass through the pressing plate to suck a steel mesh template on the printed plate; a film pressing plate connected through the pressing plate is fixed above the steel mesh template, and the solder paste is arranged on the steel mesh template; the spring is compressed, so that the pressing film plate on the pressing plate presses the solder paste into meshes in the steel mesh template; the position of the pressing plate is kept, the pressing plate is lifted, and the suction cup drives the steel mesh template to rise, press brushing of solder paste over-reflow soldering is carried out on a printed board PCB bonding pad to form a welding spot, the solder paste is punched through the steel mesh template and is printed on the bonding pad of the welding area element of the printed circuit board; and the bonding pad is connected with the corresponding bonding pad on the printed circuit board PCB to complete the loading of the solder paste.

Description

technical field [0001] The invention relates to a method for reloading solder paste on a printed board for surface mount components that need to be re-welded due to bad soldering in surface mount components, so as to meet the quality requirements for solder paste loading in re-welding of surface mount components. Background technique [0002] There are many types of SMD (Surface Mount Device), and the chip pins are J-shaped and bent into the chip, so it is difficult to control the flow of solder during soldering. Bent or folded leads, wrong polarity, wrong or skewed solder pin positioning, excessive solder or solder joint bridging or weak soldering, etc. When soldering, use certain tools to accurately place the non-lead surface mount components on the PCB pads that have been printed with solder paste or glued, and then go through wave soldering or reflow soldering to make the components and the circuit board well established. mechanical and electrical connections. Surface ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34H05K3/22
CPCH05K3/225H05K3/341H05K2203/0126
Inventor 赖复尧苏欣
Owner 10TH RES INST OF CETC
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