Camera module and photosensitive assembly thereof

A photosensitive component, non-photosensitive technology, applied in the field of photography, can solve problems such as poor side shear strength, and achieve the effect of being conducive to ultra-thinning

Active Publication Date: 2020-03-03
NANCHANG OFILM HUAGUANG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to provide a camera module and its photosensitive assembly for the problem of poor side shear strength of the traditional camera module

Method used

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  • Camera module and photosensitive assembly thereof
  • Camera module and photosensitive assembly thereof
  • Camera module and photosensitive assembly thereof

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Embodiment Construction

[0028] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.

[0029] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected ...

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PUM

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Abstract

The invention relates to a camera module and a photosensitive assembly thereof. The photosensitive assembly comprises a circuit board; the photosensitive chip is arranged on the circuit board; the support is arranged on the circuit board, a light through hole penetrating through the two ends is formed in the support and right faces the photosensitive chip, an installation groove surrounding the light through hole is formed in the end, away from the circuit board, of the support, and the installation groove is used for installing the lens assembly. In the photosensitive assembly, a installationgroove surrounding the light through hole is formed in the top surface, far away from the circuit board, of the bracket. The installation groove is used for installing the lens assembly, thereby achieving the embedded design of the lens assembly, preventing the side surface (i.e., the side surface of the lens assembly) of the camera module from being liable to deform because of collision, and improving the side surface shearing strength of the camera module. And the overall height of the camera module can be reduced by adopting the installation groove to mount the lens assembly. When the camera module with the reduced height is applied to mobile terminals such as a intelligent phone, the mobile terminals such as the intelligent phone can be ultrathin.

Description

technical field [0001] The invention relates to the field of camera technology, in particular to a camera module and a photosensitive component thereof. Background technique [0002] The camera module usually includes a circuit board, a photosensitive chip, electronic components, a bracket and a lens. The photosensitive chip and electronic components are all arranged on the circuit board, the electronic components are located outside the photosensitive chip, and the bracket is located on the circuit board. The bracket is A hollow structure with openings at both ends to store photosensitive chips and electronic components in the bracket. The lens is set on the end of the bracket away from the circuit board. The outer diameter of the end of the lens near the bracket is roughly the same as the outer diameter of the bracket, so that the lens is close The outer wall of one end of the support and the outer wall of the support can be butted to form a surface. And because the outer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225
CPCH04N23/54H04N23/57H04N23/55
Inventor 冯军朱淑敏唐东
Owner NANCHANG OFILM HUAGUANG TECH CO LTD
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