704results about How to "Improve installation strength" patented technology

Both ends of the lead arrangement project outward from side surfaces of a package to form outer lead regions. Each of the outer lead regions includes a pair of outer lead projections and lead terminal smaller projections that are located between the outer lead projections. The outer lead projections and lead terminal smaller projections project outward. Adjustment is made to the projection amount of end surfaces of the lead smaller projections lying in a plane perpendicular to a longitudinal direction of the lead arrangement, whereby the end surfaces projecting less than end surfaces of the outer lead projections. Thus, cut surfaces of lead connection portions with edged corners are not exposed. This arrangement prevents that the cut surfaces damage other devices.

A photovoltaic element is obtained which allows use of a low-melting solder and can suppress reduction in reliability and output thereof due to mechanical stress or water intrusion.

The photovoltaic element has a photoelectric conversion layer and a collector electrode provided on at least one surface of the photoelectric conversion layer. Characteristically, a collector electrode covering layer for covering a surface of the collector electrode is provided and a tab electrode for electrical connection to an exterior electrode is provided on a top surface of the collector electrode through the collector electrode covering layer. A portion of the collector electrode covering layer that lies between the tab electrode and collector electrode comprises a solder layer and another portion of the collector electrode covering layer that covers a lateral surface of the collector electrode comprises a thermosetting resin layer.

A coil component comprises a core element having a mounting portion, a coil conductor placed on the core element, and at least two terminal electrodes which are placed in the mounting portion. The mounting portion has at least two terminal placement areas for placing the terminal electrodes respectively. A hollow portion opening to the mounting side face of the mounting portion is formed in an area between the at least two terminal placement areas in the mounting portion. When mounting the coil component on a circuit board, conductive paste is intervened between an area from the terminal electrodes placed in the mounting portion of the core element to the base exposed area of the mounting portion, and the electrode patterns on the circuit board.

A water pump for cooling an engine in which an impeller accommodated in a pump housing provided on an engine body is mounted on an end of a rotational shaft rotatably supported on the pump housing for enhancing the reliability of the mounting strength of the impeller while avoiding an increase in cost. A fitting recess for fitting an end of the rotational shaft having an outer circumferential surface which is straight in an axial direction at least in a portion on the impeller side is provided in a central portion of the impeller. A bolt inserted into the central portion of the impeller is threaded in a coaxial direction with the end of the rotational shaft in a state that is fitted in the fitting recess.

The present invention provides a semiconductor device formed over an insulating substrate, typically a semiconductor device having a structure in which mounting strength to a wiring board can be increased in an optical sensor, a solar battery, or a circuit using a TFT, and which can make it mount on a wiring board with high density, and further a method for manufacturing the same. According to the present invention, in a semiconductor device, a semiconductor element is formed on an insulating substrate, a concave portion is formed on a side face of the semiconductor device, and a conductive film electrically connected to the semiconductor element is formed in the concave portion.

A clamp device for connecting a high-temperature elongated component to a support comprises a first clamp mountable to the support and a second clamp for holding the elongated component. The first clamp includes a clamp holder for holding the second clamp and is made of a non-heat-resistant hard plastic material. The second clamp includes a holder for holding the elongated component and is made of a heat-resistant hard plastic material. Preferably, the outer peripheral surface of the second clamp is covered by a layer of vibration-resistant elastic plastic material that prevents transmission of vibrations between an elongated component, such as a heater pipe, and a support, such as an under floor of an automobile.

A support structure of parts for a vehicle including: a tray fixed to a structural member of a vehicle body for mounting a first part thereto; a retainer member for retaining the first part on the tray; and a vertically extending support member for supporting a second part on the side of the first part. The support member is connected to the tray at a lower end thereof and to the retainer member at an upper end thereof.

Improvement in the mountability of a semiconductor device is aimed at. By preparing a package substrate which has a plurality of lands of NSMD structure, and the taking-out wiring and dummy wiring which were connected to each of the lands, and have been arranged mutually in the location of 180° symmetry, and printing solder by a printing method to the lands after the package assembly, the variation in the height of the solder coat between lands can be reduced, and improvement in the mountability of LGA (semiconductor device) is aimed at.

A front cross member 202 of a rear subframe 53 has a recessed portion 221 which is recessed continuously over a longitudinal direction thereof. The recessed portion 221 is formed at a lower portion of the cross member 202 and is recessed upwardly, and an elastic bush 240 is fitted in a resulting recess. The elastic bush 240 has an elastic element 243 which connects together an inner tube 241 and an outer tube 242 which surrounds the inner tube 231 and is mounted on the rear subframe 53 at the recessed portion 221 as a bracket. The bracket 221 has bracket plate portions 263a, 263b which each have a plane which is brought into contact with an end face of the inner tube and folded-back portions 235, 235. The bracket 221 is disposed in such a manner as to hold therein both ends of the inner tube 241 and is configured such that the elastic bush 240 is mounted thereon by passing a bolt 224 through the inner tube 241.

A backlight module includes a light guide plate, at least one light emitter, and a wavelength converter. The light guide plate has an incident surface. The light emitter is disposed at a side of the light guide plate and corresponds in position to the incident surface. The light emitter includes a base and a light source. The base includes a clamping arm. The clamping arm substantially extends toward the light guide plate. The light source is disposed on the base. The wavelength converter is located between the light guide plate and the light source and is clamped by the clamping arm.

A switch having terminals that provide from side surfaces of a switch housing for mounting on a substrate. Through-holes are provided in the terminals. A main body is installed in a cutaway part of the substrate to form a gap between the housing side surface and the cutaway part. When soldering a solder connection surface of the terminal to the solder mounting surface of the substrate, flux flows out to a substrate end surface through a space formed continuously between each through-hole and the gap, such that there is no penetration of flux into the interior of the switch. As a result, contact operation is made stable. In addition, the solder connection strength is also improved by forming a solder fillet on the interior surface of the through-hole.

A rear suspension connecting structure located under the floor of a vehicle wherein one horizontal reinforcement member is employed at an inner side of the rear floor side member. A weld pipe, for receiving an entire shank of a bolt, is coupled to an upper side of the reinforcement, and the weld pipe is coupled to a vertical bulkhead coupled along the width of the reinforcement.

An integrated-circuit element and passive components are mounted on a front face of a multilayer substrate. A capacitor constituting a crystal-oscillator circuit is disposed inside the multilayer substrate. A cavity is provided in a rear face of the multilayer substrate. A crystal oscillator constituting the crystal-oscillator circuit is accommodated in the cavity, and the cavity is sealed with a sealing cap made of a conductive material. The sealing cap is fixed to an electrode pad provided on a motherboard with solder therebetween.

A wiring substrate has, on each of opposite faces thereof, connection pad portions to which various circuit elements are connected, and wiring traces for connecting the connection pad portions. The wiring substrate also has a through wiring portion for establishing mutual connection between the connection pad portions and the wiring traces on the front face and those on the back face. A post electrode component is formed such that it includes a plurality of post electrodes supported by a support portion. A semiconductor chip is attached to the back face of the wiring substrate, and is connected to the connection pad portions on the back face. After the post electrode component is fixed to and electrically connected to the wiring traces at predetermined positions, and resin sealing is performed, the support portion is separated so as to expose end surfaces of the post electrodes or back face wiring traces connected thereto. Another circuit element is disposed on the front face of the wiring substrate, and is connected to the connection pad portions on the front face.

The invention discloses a high-speed turnout switch tie for speed of 350km per hour and a manufacturing method thereof. The method comprises the following steps of: 1, installing a template; 2, laying steel wires; 3, laying end plates; 4, installing sleeves and laying separators; 5, laying fittings; 6, starting a computer to automatically control the tensioned steel wires; 7, performing final tension; 8, fastening the separators, and binding the fittings; 9, putting an ash bucket and concrete into a die; 10, vibrating; 11, detaching the separators and partition plates; 12, clearing the production line; 13, curing; 14, performing concrete stripping; 15, tensioning; 16, breaking the wires, and stripping; 17, spraying, treating the sleeves, and cutting the exposed ribs; 18, clearing the die and the parting agent; and 19, warehousing. Accurate control of distribution quantity, uniform distribution and high speed are realized, stirring uniformity and concrete compactness are realized in automatic distribution, and the strength of the switch die is ensured.