712results about How to "Improve installation strength" patented technology

The present invention provides a semiconductor device formed over an insulating substrate, typically a semiconductor device having a structure in which mounting strength to a wiring board can be increased in an optical sensor, a solar battery, or a circuit using a TFT, and which can make it mount on a wiring board with high density, and further a method for manufacturing the same. According to the present invention, in a semiconductor device, a semiconductor element is formed on an insulating substrate, a concave portion is formed on a side face of the semiconductor device, and a conductive film electrically connected to the semiconductor element is formed in the concave portion.

An interconnection element and method for making same is disclosed. The interconnection element may include a plurality of metal conductors, a plurality of solid metal bumps and a low melting point (LMP) metal layer. The solid metal bumps overly and project in a first direction away from respective ones of the conductors. Each bump has at least one edge bounding the bump in at least a second direction transverse to the first direction. The low melting point (LMP) metal layer has a first face joined to the respective ones of the conductors and bounded in the second direction by at least one edge and a second face joined to the bumps. The edges of the bumps and the LMP layer are aligned in the first direction, and the LMP metal layer has a melting temperature substantially lower than the conductors.

A bumper fixture is interposed between an extended-directional end portion of a bumper and an auto body as to extend the extended-directional end portion of the bumper mounted on the auto body to form a part of a wheel house. The bumper fixture includes a mounting portion mountable to an extended-directional outer end wall of the bumper on one extended-directional end portion of the bumper, and the mounting portion is elastically deformable by a greater than predetermined load. A bumper mounting structure includes the bumper fixture such that an extended directional outer end wall of the bumper is mounted on the mounting portion.

Articulating window assemblies are provided comprising, in combination, a windowpane and a hinge having a hinge axis. The hinge comprises a first hinge member that cooperates with a second hinge member and optionally with a hinge pin to form a hinge joint. The first hinge member has at least an encapsulation section with at least a first encapsulant void, optionally two or more encapsulant voids. A continuous body of encapsulant overlays at least a portion of an outward-facing surface of the encapsulation section, at least partially fills the first encapsulant void, overlays at least a portion of an inward-facing surface of the encapsulation section and overlaps either at least a portion of an external peripheral edge of the encapsulation section, a portion of a void edge defining a second encapsulation void, or both from both the outward-facing surface and the inward-facing surface. This provides a mechanical grip of the first hinge member by the encapsulant. The encapsulant is further bonded to an inner surface of the windowpane to retain the first hinge member, and thereby the hinge, to the windowpane. The windowpane of the window assemblies provided is therefore adapted to rotate or articulate about the hinge axis relative to the second hinge member. No portion of the hinge extends through or overlays any portion of the outer surface of the windowpane, enabling a flush, streamlined appearance. Also provided are vehicles having an articulating window assembly in accordance with those just described.

A securing member includes a flat base portion, a flat top board portion which is supported by a pair of top board supporting portions erected on the base portion, a long hole which penetrates through the top board portion and of which both ends are closed, a bolt having a head which does not pass through the long hole, and of which shaft is inserted through the long hole in a state where the head is located lower than the top board portion and is to be inserted through a supporting hole provided on a supporting member of a solar battery module, a head insertion hole through which the head of the bolt passes, penetrates through the top board portion, and communicates with the long hole, securing holes which are located on a line obtained by projecting a center line of the long hole, and penetrate through the base portion.

A pair of mounts 3A and 3B for an assist grip G each include a pair of engaging pieces 19 which are pushed apart from each other by press-insertion of a locking member 23 between them and thereby engaged on the edge of a panel opening p1 of an inner panel P. On at least one of both sides of the mount 3A (3B) where the pair of engaging pieces 19 are located, a provisional retention piece 20 is provided which is independent of and separated from the engaging piece 19. In mounting the assist grip G to the inner panel P through the panel opening p1, the provisional retention piece is inserted together with the engaging pieces 19 into the panel opening p1 and thereby engaged on the edge of the panel opening p1 to provisionally retain the mount 3A (3B) onto the inner panel P. This provides ease and reliable provisional retention and full retention of the mount with a small force.

A connector includes: a first connector body having a plurality of first lead terminals soldered onto a first wiring board; a second connector body having a plurality of second lead terminals soldered onto a second wiring board; a screw member; and a fastening member engageable to the screw member. The first connector body and the second connector body are engaged with each other to bring the first lead terminals and the second lead terminals into contact such that the first lead terminals and the second terminals electrically connect the first wiring board to the second wiring board. The first and second wiring boards and the first and second connector bodies are integrally fastened together by engaging the screw member to the fastening member.

A mounting fitting (3, 5) is made of a metallic plate material, wherein a first mounting panel (7, 14) to be mounted on a casing (1) is defined on one surface, and a second mounting panel (8, 16) to be mounted on an inner panel (2) is defined on the opposite surface. A reinforcing edge (12, 18) is formed by bending at a peripheral edge portion of the mounting fitting (3, 5) such that an edge end thereof faces in the same direction. The reinforcing edge (12, 18) is continuous along the longitudinal direction thereof without any cut.

The invention provides a front vehicle body structure, comprising an upper front shroud, a scuttle front part coupled at the lower of the upper front shroud, and a pair of link bearing at the left and the right sides which is fixed above an extending part of the upper front shroud and is connected with the rear longitudinal wall of the suspension and the upper front shroud. The scuttle front part comprises a main body component spaned between a pair of extending parts of the upper front shroud at left and right sides, two end parts in a width direction of the vehicle which extend the longitudinal wall of the main body component in the width direction of the vehicle to fix the longitudinal wall, and a pair of side square components at the left and the right sides which connects the pair of link bearing at the left and the right sides, wherein the side square components have extending reinforcement parts which extend ahead at the lower and is connected with the suspension. According to the invention the installation rigidity of the upper front shroud and the front of the vehicle scuttle can be surely increased.

This semiconductor device includes a semiconductor chip, and a lead arranged around the semiconductor chip to extend in a direction intersecting with the side surface of the semiconductor chip, and having at least an end farther from the semiconductor chip bonded to a package board, wherein a joint surface to the package board and an end surface orthogonal to the joint surface are formed on the end of the lead farther from the semiconductor chip, and a metal plating layer made of a pure metal is formed on the end surface.