100results about How to "High-density mounting" patented technology

A component built-in module includes an insulating layer, wirings integrated with both surfaces of the insulating layer, a via connecting the wirings, and one or more components selected from an electronic component and a semiconductor, which is embedded inside of the insulating layer. In this module, at least one of the wirings is formed on a surface of a wiring board, and the components embedded inside of the insulating layer are mounted on and integrated with the wiring board before embedding. This configuration allows the components such as a semiconductor to undergo a mounting inspection and a property inspection before embedding. As a result, the yields of the module can be improved. In addition, since the components are integrated with the wiring board and embedded, the strength thereof can be enhanced.

A surface-mounted LED including a base having heat conductivity, an insulative wiring board fixed to the base and including a conductive pattern and a mounting hole, a light emitting element chip mounted on a mounting area exposed by the mounting hole of the wiring board, and a reflective frame having heat conductivity and fixed to the base and thermally coupled therewith, to surround the light emitting element chip, heat generation from the light emitting element chip being released through both the base and the reflective frame, or either one thereof.

An optical connector of a fitting pin positioning type includes multiple optical fiber insertion holes arranged in one row and fitting holes or fitting pins. The fitting holes or the fitting pins for positioning are respectively disposed on mutually opposite sides of a straight line connecting centers of the optical fiber insertion holes and are located point-symmetrically with respect to a center of the row of the entire optical fiber insertion holes arranged on the straight line.

An FPC is electrically connected to a printed wiring board. The FPC includes an elongated substrate and a conductor part laminated on the face of the substrate. The conductor part includes a plurality of conductors extending along the axial direction of the substrate, and elastically deformable first contact terminals each of which extends from the face of the conductors toward the base end of the FPC. The printed wiring board includes an insertion opening formed at the edge surface thereof, and plural line connecting terminals which are formed on the internal wall surface of the insertion opening, and which extend in the inserting direction for inserting the FPC.

A connecting structure is for a printed wiring board to be electrically connected to a FPC. The FPC includes a substrate and electro-conductive portions. The printed wiring board includes an insertion opening provided on an edge surface thereof, and line connecting terminals formed on an inner wall face of the insertion opening. A dual in-line contact member including first contact members is fixed to the top end portion of the FPC. Each first contact member includes a main body, and a first arm and a second arm extending from the main body generally in parallel to each other. Furthermore, the first arm and the second arm are bent at bent portions so as to form curves protruding away from each other. With the present embodiment, at least one of the first arm and the second arm press the corresponding line connecting terminal provided within the insertion opening at the bent portion thereof by inserting the FPC to the insertion opening of the printed wiring board. Thus, the FPC is connected to the edge surface of the printed wiring board. This improves the freedom from the perspective of design of the wiring pattern as well as allowing mounting of circuit components with high circuit density.

A cable connector which enables high-density mounting while reducing the risk of the locking arm being damaged or deformed is disclosed. The cable connector (1) comprises housings (10 and 30) that support a cable (C) and that have a locking arm (14) to be locked with a mating connector (50). A pull-tab (40) is connected to the locking arm (14). The pull-tab (40) is inserted into holes (18 and 19) that are respectively formed in the upper section (12) of the housings (10 and 30) and in the upper section (17) of the locking arm (14). When the pull-tab (40) is pulled in direction approximately opposite from the mating direction (i.e., in the direction of arrow A), the pull-tab (40) causes an approaching motion between the upper section (12) of the housings (10) and (30) and the section (17) of the locking arm (14), thus releasing the locking arm (14) from the mating connector (50).

A side-edge mountable parallel optical communications module and an optical communications system that incorporates one or more of the modules are provided. In the optical communications system, one or more of the side-edge mountable parallel optical communications modules are side-edge mounted in respective edge card connectors, which, in turn, are mounted on a surface of a motherboard PCB. Because the modules are relatively thin and because the spacing, or pitch, between the modules can be kept very small, the system can have a very high mounting density, and consequently, a very high bandwidth.

There is provided a connector that can decrease a crosstalk generated between facing terminals by a shield plate in a case where at least one of a terminal adjacent to a first ground terminal and a terminal adjacent to a second ground terminal facing the first ground terminal functions as a signal terminal, by forming the shield plate so that one end of the shield plate is coupled to the first ground terminal arranged at each of both ends of one terminal group and the other end of the shield plate is coupled to the second ground terminal arranged at each of both ends of the other terminal group.