The present application relates to the technical field of communication
system electronic function component manufacturing, and particularly relates to a manufacturing method of a V-band packaged antenna, comprising the following steps: (1) manufacturing a slotted
metal core; (2) manufacturing a V-band
microstrip antenna board with stepped blind grooves and a
metal core by combining the
metal core in (1) with a PCB process; (3) completing the
interconnection of a
transceiver chip and the
microstrip antenna board; and (4) installing a
waveguide connector. The method effectively solves the problems of parasitic effects caused by bonding,
narrow bandwidth of a planar antenna, secondary
assembly of a
microstrip antenna with a metal
structural component, low
assembly precision, difficult operation, low reliability of an embedded
air cavity, easy high-temperature
delamination and the like, and provides a solution for
miniaturization, high integration and low cost of a V-band communication antenna
assembly, can realize a bandwidth of 57-65GHz, the
gain can reach >=12dBi, and the loss is <=0.5dB. Compared with a traditional antenna, the size of the packaged antenna is reduced by more than 50%, can meet
temperature cycling of 100 times at-45 DEG C to 75 DEG C, has good processability and reliability, and breaks through the key technical
bottleneck for V-band communication.