The invention discloses an
interconnection structure of a
millimeter wave packaging antenna module, which relates to the technical field of
millimeter wave communication, and comprises an integral packaging structure, a substrate material and lamination structure, a key
interconnection structure,
performance index and
verification, and prototype
processing and assembling. Wherein the key
interconnection structure specifically comprises a PCB and SiP
chip interconnection structure, an interconnection structure between SiP chips, an interconnection structure between SiP and GaAs chips and an interconnection structure between GaAs chips and an
antenna array, through a multi-section
impedance matching design, matching structures are designed between the PCB and the SiP chips respectively,
broadband low-loss transmission is achieved, and the
antenna array has the advantages of being simple in structure, low in cost and high in reliability. A double gold
wire bonding structure is combined to reduce the parasitic
inductance of a GaAs
chip bonding wire and improve the matching performance, a bonding point is arranged on a cavity step through a step bonding technology, the length of a gold wire is shortened, the high-frequency loss is reduced, three-dimensional lamination interconnection is utilized, a
radio frequency signal can be led to an antenna from a
chip through a
blind hole and a strip line, and the antenna performance is improved. High-density
signal routing is achieved, and the application requirement of a
millimeter wave communication
system is met.