Polymer, hydrogen additive, resin composition, resin film, and electronic component

A resin composition and polymer technology, applied in the field of polymers, can solve problems such as use restrictions, and achieve the effects of high transparency, high adhesion, and low leakage current characteristics

Active Publication Date: 2012-02-29
ZEON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the polymers specifically disclosed in these Patent Documents 1 to 3 or their hydrogenated products have a problem in that propylene glycol monomethyl ether ether, which is widely used in resin compositions containing crosslinking agents or radiation-sensitive compounds, etc., has a problem. Among various solvents represented by acid ester (PGMEA) and methyl isobutyl ketone (MIBK), it is insoluble in highly volatile polar solvents such as MIBK used as a cleaning solvent for resin compositions, and its use is limited.

Method used

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  • Polymer, hydrogen additive, resin composition, resin film, and electronic component
  • Polymer, hydrogen additive, resin composition, resin film, and electronic component
  • Polymer, hydrogen additive, resin composition, resin film, and electronic component

Examples

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preparation example Construction

[0156] The preparation method of the resin composition of this invention is not specifically limited, What is necessary is just to mix each component which comprises the resin composition of this invention by a well-known method.

[0157] The method of mixing is not particularly limited, but it is preferable to mix a solution or a dispersion obtained by dissolving or dispersing each component constituting the resin composition in a solvent. Thus, the resin composition of the present invention can be obtained in the form of a solution or a dispersion.

[0158] What is necessary is just to follow a conventional method about the method of dissolving or dispersing each component which comprises the resin composition of this invention in a solvent. Specifically, a method of stirring using a stirrer and a magnetic stirrer, a method of using a high-speed homogenizer, a disperser, a planetary mixer, a twin-shaft mixer, a ball mill, a three-roll mill, and the like are exemplified. In ...

Embodiment 1

[0207] 100 parts of N-(1-methylpentyl)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxyimide, 1 , 2 parts of 5-hexadiene, (1,3-two imidazoline-2-indene)(tricyclohexylphosphine)benzylidene ruthenium chloride (synthesized by the method described in Org. Lett., volume 1, page 953, 1999) 0.02 part and diethylene glycol 400 parts of methyl ethyl ether were reacted at 80° C. for 4 hours while stirring to obtain a polymerization reaction liquid of polymer A1. The obtained polymer A1 had a polymerization conversion rate of 99.6%, a weight average molecular weight of 5,660, a number average molecular weight of 3,510, and a molecular weight distribution of 1.49.

[0208] Polymer A1 was evaluated for solubility in methyl isobutyl ketone (MIBK). Table 1 shows the evaluation results. Polymer A1 is soluble in MIBK at 25°C.

Embodiment 2

[0210] The polymerization reaction liquid of polymer A1 obtained in Example 1 was poured into an autoclave, stirred at 150° C. and a hydrogen pressure of 4 MPa for 5 hours, and hydrogenated to obtain hydride A2. The obtained hydride A2 had a weight average molecular weight of 7,010, a number average molecular weight of 4,590, a molecular weight distribution of 1.53, and a hydrogenation rate of 99.8%.

[0211] Hydride A2 was evaluated for methyl isobutyl ketone (MIBK) solubility. Table 1 shows the evaluation results. Hydride A2 is soluble in MIBK at 25°C.

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Abstract

Provided is a polymer comprising a monomer polymerization unit represented by the general formula (1); whereby, a polymer that is highly soluble in solar solvents, exhibits low water absorption, and has a strong adherence to substrates, a hydrogen additive of said polymer, a resin composition using said polymer and / or said hydrogen additive, a resin film formed out of said resin composition, and an electronic component having said resin film can be obtained.

Description

technical field [0001] The present invention relates to a polymer, a hydrogenated product of the polymer, a resin composition containing the polymer and / or the hydrogenated product, a resin film formed from the resin composition, and an electronic component having the resin film . More specifically, the present invention relates to a polymer having high solubility in polar solvents, low water absorption, and high adhesion to a substrate, a hydrogenated product of the polymer, and a polymer using the polymer and / or A resin composition of the hydride, a resin film formed from the resin composition, and an electronic component having the resin film. Background technique [0002] In recent years, polymers of cyclic olefins having functional groups and their hydrogenated products have attracted attention as functional group-containing polymers excellent in heat resistance, electrical properties, low water absorption, and the like. In addition, this polymer has excellent adhesio...

Claims

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Application Information

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IPC IPC(8): C08F32/04C08G61/12C08L65/00G02B1/04H01L21/312
CPCC08G61/08C08F232/08C08F236/20C08G2261/3324C08G2261/418C08G2261/724
Inventor 后藤邦博
Owner ZEON CORP
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