Copper foil with carrier, laminate, method of producing printed wiring board, and method of producing electronic devices

Abstract

The invention relates to a copper foil with a carrier, a laminate, a method of producing a printed wiring board, and a method of producing electronic devices. The invention provides the copper foil with the carrier having a small absolute value of the difference in releasing strength between the copper foil with a carrier prepared by laminating and hot-pressing the surface close to an ultra-thin copper layer of the copper foil with a carrier to an insulating substrate and used after the carrier is peeled off and the copper foil with a carrier prepared by laminating and hot-pressing the surface close to the carrier of the copper foil with a carrier to an insulating substrate and used after the ultra-thin copper layer is peeled off, while generation of swelling during laminating of the copper foil with a carrier to the insulating substrate by hot pressing is prevented, discoloring of the surface of the ultra-thin copper layer due to oxidation is prevented, and the circuit formability is high. A copper foil with a carrier, including a carrier, an intermediate layer, an ultra-thin copper layer, and a surface treated layer in this order, wherein no roughened layer is disposed on the surface of the ultra-thin copper layer, and the surface treated layer consists of Zn or a Zn alloy, the amount of Zn applied in the surface treated layer is 30 to 300 <mu>g / dm2, and if the surface treated layer is composed of the Zn alloy, the proportion of Zn in the Zn alloy is 51% by mass or more.

Description

technical field [0001] The present invention relates to a method for manufacturing a copper foil with a carrier, a laminate, a printed wiring board, and an electronic device. Background technique [0002] Printed wiring boards are generally produced by bonding an insulating substrate to copper foil to form a copper-clad laminate, and then etching the surface of the copper foil to form a conductive pattern. In recent years, with the increasing demand for miniaturization and high performance of electronic equipment, high-density mounting of mounted components and high-frequency signals have been progressing, and miniaturization of conductor patterns (fine pitch) is required for printed wiring boards. Or high-frequency response, etc. [0003] Recently, copper foils with a thickness of 9 μm or less and further thicknesses of 5 μm or less are required to cope with fine pitches. However, such ultra-thin copper foils have low mechanical strength and are prone to cracks or wrinkles...

AI Technical Summary

Problems solved by technology

[0003] Recently, copper foils with a thickness of 9 μm or less and further thicknesses of 5 μm or less are required to cope with fine pitches. However, such ultra-thin copper foils have low mechanical strength and are prone to cracks or wrinkles when manufacturing printed wiring boards. Therefore, there has been a use A metal foil with a certain thickness is used as a carrier, and a copper foil with a carrier is made by electroplating an extremely thin copper layer on the carrier through a peeling layer.

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